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Infineon Technologies S25FS256SAGBHM203
- Part No.:
- S25FS256SAGBHM203
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FS256SAGBHM203.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,714
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Product details
Overview
S25FS256SAGBHM203 from Infineon is a 256 Mb (32 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, and industrial temperature grade (–40°C to +85°C). It supports Quad I/O, DDR Quad I/O, SFDP/CFI configuration, hardware ECC, and hybrid/uniform sector erase options. Used in embedded boot code storage for industrial controllers requiring fast XIP-capable read performance up to 80 MBps.
For engineers reviewing the S25FS256SAGBHM203 datasheet, S25FS256SAGBHM203 pinout, S25FS256SAGBHM203 application, or S25FS256SAGBHM203 equivalent, key selection criteria include 1.8 V operation, BGA-24 FAB024 package compatibility, 256-KB uniform sector erase timing, OTP security features, and AEC-Q100 Grade 3 qualification readiness.
Technical Context
This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density NOR flash with deterministic latency for execute-in-place (XIP) operation. It supports both standard SPI (modes 0/3) and enhanced Multi-I/O protocols including QPI mode and DDR Quad I/O with 80 MHz clock.
The internal ECC engine provides single-bit error correction per 512-bit word without software overhead, while hybrid sector layout (eight 4-KB + one 224-KB sectors at top/bottom) enables flexible firmware partitioning. Erase suspend/resume and program suspend/resume allow real-time background operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mbit (32 MB) - sufficient for full firmware images plus parameter storage in resource-constrained edge nodes |
| Supply Voltage | 1.7 V to 2.0 V - compatible with low-power 1.8 V system rails and reduces active current vs. 3.3 V flash |
| Read Throughput | 80 MBps DDR Quad I/O - enables near-DRAM-like instruction fetch speed for XIP boot from flash |
| Erase Endurance | 100,000 cycles - supports field-upgradable firmware with frequent OTA update cycles |
| Data Retention | 20 years minimum - ensures long-term reliability in unattended industrial deployments |
| Temperature Range | –40°C to +85°C (Industrial grade) - validated for operation in factory automation and outdoor control cabinets |
| Package | BGA-24, 6 × 8 mm, FAB024 footprint (5 × 5 ball array) - optimized for high-density PCB layouts with thermal pad for improved heat dissipation |
Pinout & Package
Package: BGA-24, 6 × 8 mm body, FAB024 footprint (5 × 5 ball array), lead-free, with exposed thermal pad (ball A1–E5).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Power supply input | 1.8 V core and I/O supply; decoupling required within 5 mm of ball A1 |
| VSS | Ground reference | Signal and power ground; connects to PCB thermal pad for thermal management |
| CS# | Chip select | Active-low enable for command/address/data transfer; supports daisy-chain configuration |
| SCK | Serial clock | Input clock for SPI/MIO; supports up to 133 MHz SDR or 80 MHz DDR operation |
| IO0–IO3 | Multi-I/O bidirectional data lines | Supports single/dual/quad I/O and DDR modes; IO2/IO3 double as WP#/RESET# in specific configurations |
| WP# | Write protect | Hardware lock for status register and sector protection bits; tied low to disable write protection |
| RESET# | Hardware reset | Asynchronous reset that clears internal state and returns device to default configuration |
Key Features
| Feature | Design Value |
|---|---|
| DDR Quad I/O interface | Enables 80 MBps read bandwidth using only four pins, reducing signal count vs. parallel NOR and easing routing on dense MCU boards |
| Internal hardware ECC | Single-bit error correction per 512-bit word performed transparently during read, eliminating need for external error-handling logic |
| Hybrid sector architecture | Eight 4-KB + one 224-KB physical sectors at address boundaries allow bootloader isolation and flexible firmware partitioning |
| OTP array (1024 bytes) | Immutable storage for cryptographic keys, device IDs, or calibration data-programmable once and locked permanently |
| Erase/program suspend | Allows interrupting background erase or program operations to service time-critical reads, improving real-time system responsiveness |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and configuration tables in programmable logic controllers deployed in factory environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch directly to Cortex-M7 MCU core. Use Value: 80 MBps DDR Quad I/O read speed eliminates external RAM copy step, reducing boot time by >40% versus legacy SPI flash. | Use Scenario: Holding safety-critical boot code and sensor calibration data in front-camera modules operating under AEC-Q100 Grade 3 conditions. IC Role / Device Role / Timing Role: Secure, certified boot memory with OTP key storage and hardware write protection for ASIL-B compliance. Use Value: Built-in ECC and 100K erase cycles ensure integrity over 15-year vehicle lifetime without field recalls due to bit rot. |
| Medical Imaging System Parameter Storage | Edge AI Gateway Configuration Memory |
Use Scenario: Retaining calibrated imaging parameters and regulatory audit logs in portable ultrasound devices requiring 20-year data retention. IC Role / Device Role / Timing Role: Non-volatile parameter archive with guaranteed 20-year retention at 85°C ambient, backed by SFDP-defined configuration registers. Use Value: Eliminates need for battery-backed SRAM or external EEPROM, simplifying BOM and reducing failure points in sealed enclosures. | Use Scenario: Hosting firmware overlays and model metadata for FPGA-accelerated inference engines in smart city gateways. IC Role / Device Role / Timing Role: High-bandwidth configuration store supporting dynamic reconfiguration via Quad I/O burst reads and sector-protected updates. Use Value: Uniform 256-KB erase blocks align with Linux kernel MTD partitioning, enabling atomic OTA updates without filesystem corruption risk. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FS256SAGNFM203 | Same die, identical electrical specs, but WSON-8 (6×5 mm) package - no BGA option | Limited to space-constrained designs where BGA assembly is unavailable or cost-prohibitive | Select when board-level reflow capability excludes BGA or thermal pad integration is impractical |
| Winbond W25Q256JWSIQ | 256 Mb, 1.8 V, but lacks DDR mode and internal ECC; uses standard SPI only | Requires external error handling and delivers only 40 MBps max read rate in Quad I/O mode | Choose for cost-sensitive applications where ECC and DDR bandwidth are not required |
Compared with S25FS256SAGBHM203, the Cypress alternative offers identical functionality in a smaller WSON package but forfeits BGA thermal and routing advantages, while the Winbond part trades DDR performance and hardware ECC for lower unit cost and simpler interface support.
Availability
S25FS256SAGBHM203 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, medical imaging systems, and edge AI gateways requiring stable component supply, long-life qualification, and BGA-compatible flash density.
Supply support for S25FS256SAGBHM203 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT applications.
The FS-S Flash family targets high-reliability embedded systems needing fast, secure, and configurable NOR flash with advanced features like DDR I/O, hardware ECC, and AEC-Q100 qualification paths.
FAQ
What is the maximum clock frequency supported in DDR Quad I/O mode?
The S25FS256SAGBHM203 supports up to 80 MHz DDR clock frequency in Quad I/O mode, delivering 80 MBps effective read throughput. This is specified under AC characteristics section 6.5 of the datasheet and validated across the full industrial temperature range with 1.8 V supply.
Does this device require external ECC circuitry?
No. The device integrates hardware-based ECC that automatically corrects single-bit errors per 512-bit word during read operations. No external logic or software intervention is needed, and correction occurs transparently without CPU involvement or latency penalty.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP (One-Time Programmable) array is permanently locked after programming. Once written and verified, bits cannot be altered or erased. This ensures cryptographic keys or device identifiers remain immutable throughout product lifetime.
Is the FAB024 BGA package RoHS-compliant and lead-free?
Yes. The S25FS256SAGBHM203 in FAB024 package is fully RoHS-compliant and lead-free, meeting JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) requirements. The package uses matte tin finish on solder balls and conforms to IPC/JEDEC J-STD-006 standards.
S25FS256SAGBHM203 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FS256SAGBHM203 FAQ
1.How can I place an order for S25FS256SAGBHM203 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS256SAGBHM203 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS256SAGBHM203 reliable?
The price and inventory of S25FS256SAGBHM203 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGBHM203 is usually 5 days.
3.What payment methods are accepted for S25FS256SAGBHM203?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGBHM203 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS256SAGBHM203?
S25FS256SAGBHM203 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS256SAGBHM203 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS256SAGBHM203?
For technical support, including S25FS256SAGBHM203 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGBHM203 requirements.
6.How does Aetrix verify that S25FS256SAGBHM203 is sourced from the original manufacturer or authorized distributors?
All S25FS256SAGBHM203 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGBHM203 meets industry standards.
7.What is the process for return or replacement of S25FS256SAGBHM203?
All S25FS256SAGBHM203 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGBHM203, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS256SAGBHM203 part is unused and in its original packaging.
Return procedure for S25FS256SAGBHM203:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FS256SAGBHM203 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
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