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Infineon Technologies S25FS256SAGBHV203

Part No.:
S25FS256SAGBHV203
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FS256SAGBHV203.pdf
Description:
IC FLASH 256MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,353

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Product details

Overview

S25FS256SAGBHV203 from Infineon is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, operating at 1.8 V supply, supporting DDR Quad I/O read up to 80 MBps, hybrid/ uniform sector erase options, and integrated hardware ECC for single-bit error correction. It is used in industrial and automotive boot code storage requiring high reliability and fast XIP-capable reads.

For engineers reviewing the S25FS256SAGBHV203 datasheet, S25FS256SAGBHV203 pinout, S25FS256SAGBHV203 application, or S25FS256SAGBHV203 equivalent, key selection factors include 1.7–2.0 V operation, AEC-Q100 Grade 2 qualification (–40°C to +105°C), BGA-24 FAB024/FAC024 footprint compatibility, SFDP/CFI support, and OTP array security.

Technical Context

This device implements SPI-MIO (Multi-I/O) with configurable 24-/32-bit addressing, supporting standard SPI modes 0/3 and DDR mode. It integrates Eclipse architecture with 65-nm MIRRORBIT™ technology to enable burst wrap, continuous XIP, and QPI read modes.

Its embedded algorithm supports program/erase suspend/resume, automatic ECC generation, and dual-sector protection via status register bits and advanced sector protection (ASP) with password-controlled access to boot sectors and OTP regions.

Key Specifications

ParameterValue and Actual Design Meaning
Density256 Mbit (32 MB) nonvolatile memory capacity for firmware image storage
Supply Voltage1.7 V to 2.0 V - enables low-power operation in battery-backed or energy-constrained systems
Read SpeedDDR Quad I/O at 80 MHz → 80 MBps - supports real-time XIP execution without external cache
Erase Endurance100,000 program-erase cycles - ensures long-term field reliability in frequent firmware update scenarios
Data Retention20 years minimum at +85°C - validated for industrial and automotive lifecycle requirements
Temperature GradeAEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood and industrial control environments
Security1024-byte OTP array + ASP with password-controlled sector read/write - prevents unauthorized firmware extraction or modification

Pinout & Package

Package: BGA-24, 6 × 8 mm, 5 × 5 ball (FAB024) or 4 × 6 ball (FAC024) footprint, Pb-free, known good die.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable for SPI command decoding; supports daisy-chain configuration
SCKSerial ClockInput clock for SDR/DDR SPI operations; phase/polarity configurable per mode 0/3
IO0–IO3Multi-I/O Data LinesBi-directional pins supporting single/dual/quad I/O and DDR protocols; IO3 doubles as RESET#
WP#Write ProtectHardware lock for status register and sector protection bits; active-low, tied high for normal operation
VCC / VSSPower / Ground1.8 V core supply with 0.025 mA standby current; decoupling required per layout guidelines
NCNo ConnectUnbonded pad; must be left floating or grounded per PCB design rules

Key Features

FeatureDesign Value
DDR Quad I/O Read80 MBps throughput enables direct code execution from flash in resource-constrained MCUs
Hybrid Sector EraseMixed 4-KB/32-KB or 4-KB/224-KB top/bottom sectors allow flexible partitioning of boot vs. application code
Automatic Hardware ECCOn-the-fly single-bit error correction eliminates need for external error-handling logic or SW overhead
OTP + ASP Security1024-byte one-time programmable array plus password-protected sector locking secures boot loader integrity
SFDP/CFI SupportStandardized parameter tables enable automatic driver initialization and runtime configuration discovery

Applications

Automotive ADAS ECU Boot StorageIndustrial PLC Firmware Image

Use Scenario: Storing boot firmware and safety-critical microcode in radar processing units requiring AEC-Q100 Grade 2 compliance.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with XIP-capable Quad DDR reads and hardware ECC for ASIL-B functional safety.

Use Value: Eliminates external RAM copy step during boot, reduces BOM count, and ensures bit-level data integrity over 15+ year vehicle lifetime.

Use Scenario: Holding field-upgradable firmware and configuration data in programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: High-endurance serial flash for secure, over-the-air (OTA) firmware updates with sector-level write protection.

Use Value: Supports 100k+ update cycles and 20-year retention at 85°C ambient, enabling maintenance-free operation in uncooled enclosures.

Medical Imaging System BIOS5G Baseband Radio Firmware

Use Scenario: Storing certified diagnostic firmware and calibration tables in portable ultrasound devices with strict regulatory traceability.

IC Role / Device Role / Timing Role: Secure boot memory with OTP-locked bootloader and ASP-protected calibration sectors.

Use Value: Meets IEC 62304 software lifecycle requirements via immutable boot code and auditable sector access control.

Use Scenario: Hosting FPGA configuration bitstreams and DSP firmware in remote radio units exposed to wide thermal cycling.

IC Role / Device Role / Timing Role: High-speed, temperature-resilient flash with DDR Quad I/O for rapid reconfiguration during beamforming updates.

Use Value: Delivers 80 MBps read bandwidth at –40°C to +105°C, reducing reconfiguration latency by >40% vs. legacy SPI flash.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FS256SDSBHVF103Same die, identical pinout and timing; differs only in marking and tape/reel packagingNo functional difference; suitable for drop-in replacement where packaging format allowsSelect when sourcing from legacy Cypress channel or requiring specific reel orientation
Winbond W25Q256JWSIQ256 Mb, 1.8 V, but lacks DDR mode, ASP, and AEC-Q100 Grade 2 qualificationLower-cost option for commercial-grade applications without safety or high-speed XIP needsChoose only if DDR performance and automotive qualification are not required

Compared with S25FS256SAGBHV203, the Cypress variant offers identical functionality with packaging variance, while the Winbond part trades DDR speed, ASP security, and automotive qualification for cost-making it unsuitable for safety-critical or high-bandwidth boot use cases.

Availability

S25FS256SAGBHV203 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging BIOS, and 5G baseband radio firmware requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S25FS256SAGBHV203 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.

The FS-S Flash family targets high-reliability embedded systems needing fast, secure, and thermally robust serial NOR flash-specifically optimized for automotive boot code, industrial firmware, and safety-critical firmware storage.

FAQ

What package type does S25FS256SAGBHV203 use?

S25FS256SAGBHV203 uses a Pb-free BGA-24 package with either 5 × 5 ball (FAB024) or 4 × 6 ball (FAC024) footprint. Both variants measure 6 × 8 mm and are qualified for industrial and automotive applications. The SOIC-16 package is not offered for the 256 Mb density.

Does this device support execute-in-place (XIP) operation?

Yes, S25FS256SAGBHV203 supports continuous XIP mode using Fast, Dual I/O, Quad I/O, and DDR Quad I/O commands. Its burst wrap capability and low-latency read paths enable deterministic instruction fetch directly from flash without copying to RAM.

How is security implemented in this flash device?

Security includes a 1024-byte one-time programmable (OTP) array, hardware block protection via status register bits, and Advanced Sector Protection (ASP) with password-controlled read/write access to individual sectors. ASP can be enabled via boot code or password, and supports lock-down of boot sectors.

Is S25FS256SAGBHV203 compatible with legacy S25FL-S devices?

Yes-S25FS256SAGBHV203 maintains serial command subset and footprint compatibility with S25FL-S devices. It also supports the same SFDP/CFI parameter structures and hybrid/uniform sector maps, enabling migration without PCB redesign or driver changes.

S25FS256SAGBHV203 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FS-S
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (8x6)

S25FS256SAGBHV203 FAQ

1.How can I place an order for S25FS256SAGBHV203 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FS256SAGBHV203 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FS256SAGBHV203 reliable?

The price and inventory of S25FS256SAGBHV203 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGBHV203 is usually 5 days.

3.What payment methods are accepted for S25FS256SAGBHV203?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGBHV203 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FS256SAGBHV203?

S25FS256SAGBHV203 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FS256SAGBHV203 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FS256SAGBHV203?

For technical support, including S25FS256SAGBHV203 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGBHV203 requirements.

6.How does Aetrix verify that S25FS256SAGBHV203 is sourced from the original manufacturer or authorized distributors?

All S25FS256SAGBHV203 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGBHV203 meets industry standards.

7.What is the process for return or replacement of S25FS256SAGBHV203?

All S25FS256SAGBHV203 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGBHV203, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FS256SAGBHV203 part is unused and in its original packaging.

Return procedure for S25FS256SAGBHV203:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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