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Infineon Technologies S25FS256SAGMFB000
- Part No.:
- S25FS256SAGMFB000
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FS256SAGMFB000.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,004
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Product details
Overview
S25FS256SAGMFB000 from Infineon is a 256 Mb (32 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, and industrial temperature grade (–40°C to +85°C). It supports Quad I/O, DDR Quad I/O read up to 80 MBps, 256-byte/512-byte page programming, hardware ECC, and hybrid/uniform sector erase options. Used in boot code storage for embedded microcontrollers in industrial control systems.
For engineers reviewing the S25FS256SAGMFB000 datasheet, S25FS256SAGMFB000 pinout, S25FS256SAGMFB000 application, or S25FS256SAGMFB000 equivalent, key selection factors include 1.8 V operation, BGA-24 FAB024 package compatibility, SFDP/CFI support, AEC-Q100 Grade 3 qualification, and DDR Quad I/O timing compliance at 80 MHz.
Technical Context
This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density NOR flash with deterministic read latency and XIP-capable continuous burst mode. It uses standard SPI clock modes 0/3 and supports both SDR and DDR command protocols with configurable 24-/32-bit addressing.
The flash integrates dual-sector protection schemes: status register-based block protection and password-controlled Advanced Sector Protection (ASP), plus a 1024-byte OTP array. Erase endurance is rated at ≥100,000 cycles with ≥20-year data retention under industrial conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mbit (32 MB) - fixed capacity for firmware image storage with margin for future updates |
| Supply Voltage | 1.7 V to 2.0 V - compatible with low-voltage SoC I/O rails and reduces system power consumption |
| Read Bandwidth | 80 MBps (DDR Quad I/O @ 80 MHz) - enables fast boot execution without external RAM buffering |
| Erase Endurance | ≥100,000 program-erase cycles - supports field firmware updates over product lifetime |
| Data Retention | ≥20 years at –40°C to +85°C - ensures long-term reliability in unattended industrial deployments |
| Package | BGA-24, 6 × 8 mm, FAB024 footprint (5 × 5 ball array) - surface-mount compatible with automated PCB assembly |
| Temperature Grade | Industrial (–40°C to +85°C) - validated for operation in factory automation and motor drive environments |
Pinout & Package
Package: BGA-24, 6 × 8 mm, FAB024 footprint (5 × 5 ball array), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Power supply input | 1.8 V core and I/O supply; decoupling required per Infineon layout guidelines |
| VSS | Ground reference | Signal and power ground; must be connected to low-impedance PCB plane |
| CS# | Chip select active-low | Enables device communication; asserted before command transmission |
| SCK | Serial clock input | Drives all SPI timing; supports up to 133 MHz SDR or 80 MHz DDR |
| IO0 | Serial input / I/O bidirectional | Primary data line for standard SPI; functions as DQ0 in Quad I/O mode |
| IO1 | Serial output / I/O bidirectional | Primary data line for standard SPI; functions as DQ1 in Quad I/O mode |
| IO2 | Write protect / I/O bidirectional | Hardware write protection when pulled low; DQ2 in Quad I/O mode |
| IO3 | Reset / I/O bidirectional | Active-low reset input; DQ3 in Quad I/O mode; also used for DPD entry |
| NC | No connect | Unbonded pad; must remain unconnected on PCB |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction with no software overhead or latency penalty |
| DDR Quad I/O Interface | 80 MBps sustained read throughput using double-data-rate signaling on four I/O lines |
| Hybrid Sector Architecture | Mixed 4-KB, 32-KB, and 64-KB physical sectors for optimized firmware partitioning and update granularity |
| Advanced Sector Protection (ASP) | Password-protected individual sector locking, preventing unauthorized firmware modification or extraction |
| SFDP & CFI Support | Standardized parameter discovery enabling automatic driver configuration without hard-coded timing values |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with XIP-capable continuous read mode and deterministic latency. Use Value: 20-year data retention and 100K-cycle endurance ensure firmware integrity across extended maintenance intervals without replacement. | Use Scenario: Holding safety-critical boot code and sensor calibration data in camera-based driver assistance modules. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified NOR flash providing secure, fast-access startup memory for ASIL-B systems. Use Value: Hardware ECC and ASP prevent corruption or tampering of boot assets, supporting ISO 26262 functional safety requirements. |
| Medical Imaging System Configuration | Edge AI Gateway Firmware |
Use Scenario: Storing FPGA configuration bitstreams and device-specific calibration tables in portable ultrasound equipment. IC Role / Device Role / Timing Role: High-reliability SPI flash interfacing directly with FPGA configuration controller via Quad I/O. Use Value: Uniform 64-KB sector erase enables atomic reprogramming of calibration data without disrupting operational firmware partitions. | Use Scenario: Hosting Linux kernel, root filesystem, and ML inference model metadata in fanless industrial gateways. IC Role / Device Role / Timing Role: High-bandwidth (80 MBps DDR Quad) memory supporting fast cold boot and OTA update staging. Use Value: SFDP support allows dynamic driver initialization, reducing BSP porting effort across heterogeneous ARM Cortex-A SoCs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FS256SAGNFB000 | Same die, identical electrical specs, but WSON-8 (6×5 mm) package instead of BGA-24 | Limited to space-constrained PCBs where BGA assembly is not feasible | Select when board-level rework capability or smaller footprint is prioritized over thermal performance |
| Winbond W25Q256JWSIQ | 256 Mb, 1.8 V, but lacks DDR Quad I/O and ASP; max read rate 40 MBps (SDR Quad) | Suitable for cost-sensitive designs without safety-critical firmware protection needs | Choose only if DDR bandwidth and password-locked sector protection are not required |
Compared with S25FS256SAGNFB000, this BGA variant offers superior thermal dissipation and routing density; versus W25Q256JWSIQ, it delivers twice the read bandwidth and certified security features essential for industrial firmware integrity.
Availability
S25FS256SAGMFB000 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, medical imaging subsystems, and edge AI gateways requiring stable component supply and long-term lifecycle assurance.
Supply support for S25FS256SAGMFB000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.
The FS-S Flash family targets high-reliability embedded systems needing secure, fast, and long-life nonvolatile storage-specifically designed for boot code, firmware, and configuration data in safety- and uptime-critical environments.
FAQ
Is S25FS256SAGMFB000 pin-compatible with earlier S25FL-S series devices?
Yes, it maintains footprint compatibility with S25FL-P and S25FL-S families in the same package type. The FAB024 BGA variant matches the ball map and signal assignments of S25FL256SAGMFB000, enabling drop-in replacement where voltage and timing margins allow.
Does this device support execute-in-place (XIP) operation?
Yes, it supports continuous burst read mode with wrap addressing, enabling true XIP execution from flash without copying to RAM. This is confirmed in Section 2.2 of the datasheet and requires proper configuration of the volatile status register bit BRWRT.
What is the function of the IO3/RESET# pin during normal operation?
During active operation, IO3 serves as bidirectional I/O line DQ3 in Quad I/O mode. When driven low externally, it triggers hardware reset; when held high, it functions as part of the Quad data bus. Its dual role is controlled by internal state machine sequencing, not software configuration.
Can the OTP array be reprogrammed after initial programming?
No, the 1024-byte OTP array is one-time programmable. Once any bit is set to '0', it cannot be changed back to '1'. Programming is irreversible and intended for permanent device identification, cryptographic keys, or calibration constants that must survive full erase cycles.
S25FS256SAGMFB000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FS256SAGMFB000 FAQ
1.How can I place an order for S25FS256SAGMFB000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS256SAGMFB000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS256SAGMFB000 reliable?
The price and inventory of S25FS256SAGMFB000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGMFB000 is usually 5 days.
3.What payment methods are accepted for S25FS256SAGMFB000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGMFB000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS256SAGMFB000?
S25FS256SAGMFB000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS256SAGMFB000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS256SAGMFB000?
For technical support, including S25FS256SAGMFB000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGMFB000 requirements.
6.How does Aetrix verify that S25FS256SAGMFB000 is sourced from the original manufacturer or authorized distributors?
All S25FS256SAGMFB000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGMFB000 meets industry standards.
7.What is the process for return or replacement of S25FS256SAGMFB000?
All S25FS256SAGMFB000 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGMFB000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS256SAGMFB000 part is unused and in its original packaging.
Return procedure for S25FS256SAGMFB000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FS256SAGMFB000 Tags
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M24C02-WMN6TP
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