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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S25FS256SAGMFB003

Name: S25FS256SAGMFB003
Brand: Infineon Technologies
SKU: S25FS256SAGMFB003
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S25FS256SAGMFB003

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 16-SOIC (0.295", 7.50mm Width)

Datasheet:: S25FS256SAGMFB003.pdf

Description:: IC FLASH 256MBIT SPI/QUAD 16SOIC

Quantity:: RFQ Add To RFQ list

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Inventory:2,689

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Product details

Overview

S25FS256SAGMFB003 from Infineon is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, operating at 1.8 V supply. It supports Quad I/O, DDR Quad I/O, and SFDP/CFI configuration, features hardware ECC, 100,000 program-erase cycles, and AEC-Q100 Grade 2 qualification (–40°C to +105°C). Used in automotive instrument clusters for boot code storage and firmware updates.

For engineers reviewing the S25FS256SAGMFB003 datasheet, S25FS256SAGMFB003 pinout, S25FS256SAGMFB003 application, or S25FS256SAGMFB003 equivalent, key selection criteria include hybrid/uniform sector erase options, OTP array size, DDR timing compliance, and BGA-24 package compatibility with FAB024/FAC024 footprints.

Technical Context

This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density nonvolatile storage with deterministic read latency. It supports both SDR and DDR SPI protocols up to 133 MHz (SDR) and 80 MHz (DDR), delivering up to 80 MBps read throughput via DDR Quad I/O mode.

The flash integrates dual-sector erase architectures: hybrid (eight 4-KB + one 32-KB or 224-KB sectors) and uniform (64-KB or 256-KB blocks), with program/erase suspend-resume capability and automatic single-bit ECC correction across all operations.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mbit (32 MB) - sufficient for full firmware images and secure boot partitions in automotive ECUs
Supply Voltage	1.7 V to 2.0 V - compatible with low-voltage SoC power rails and reduces system-level power conversion complexity
Read Throughput	80 MBps (DDR Quad I/O @ 80 MHz) - enables fast XIP execution and OTA update streaming without external buffering
Erase Endurance	100,000 cycles minimum - supports frequent field firmware updates over 15+ year vehicle lifetime
Data Retention	20 years minimum at +85°C - ensures long-term reliability in under-hood and infotainment environments
Temperature Grade	AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for engine control and ADAS domain controller use cases
OTP Array	1024 bytes - provides immutable storage for cryptographic keys, calibration data, or device-specific identifiers

Pinout & Package

Package: BGA-24, 6 × 8 mm footprint with either FAB024 (5 × 5 ball) or FAC024 (4 × 6 ball) layout. Known good die and known tested die screening applied.

Pin/Terminal	Circuit Role	Design Meaning
CS#	Chip Select	Active-low enable for SPI command decoding; supports daisy-chaining in multi-device systems
SCK	Serial Clock	Input clock for SDR/DDR operation; phase/polarity modes 0 and 3 supported per JEDEC JESD251
IO0–IO3	Multi-I/O Data Lines	Bi-directional pins supporting single/dual/quad I/O and DDR modes; IO3 doubles as RESET# input
WP#	Write Protect	Hardware lock for status register and sector protection; active-low, compatible with standard GPIOs
VCC / VSS	Power / Ground	1.8 V core supply with dedicated ground; decoupling required within 5 mm of package per layout guidelines
NC	No Connect	Unbonded pad; must be left floating or tied to VSS per PCB design rules to avoid noise coupling

Key Features

Feature	Design Value
DDR Quad I/O Interface	Enables 80 MBps read bandwidth using standard SPI controllers with DDR support-no parallel bus required
Hybrid Sector Architecture	Combines fine-grained 4-KB sectors (for parameter storage) with large 224-KB sectors (for firmware), optimizing update granularity and wear leveling
Hardware ECC Engine	Corrects single-bit errors on-the-fly during read; eliminates need for software ECC overhead or external error-handling logic
Advanced Sector Protection (ASP)	Allows password-protected or boot-code-gated read/write access to individual sectors-critical for secure boot partitioning
SFDP & CFI Compliance	Self-describing configuration via JEDEC JESD216 allows automatic driver initialization without hard-coded timing or command tables

Applications

Automotive Instrument Cluster

ADAS Domain Controller

Use Scenario: Stores boot firmware, GUI assets, and real-time calibration data for digital dashboards.

IC Role / Device Role / Timing Role: Primary nonvolatile code storage with XIP-capable continuous read mode and AEC-Q100 Grade 2 thermal resilience.

Use Value: Enables fast cold-boot (<500 ms) and seamless firmware patching over CAN FD without requiring external RAM caching.

Use Scenario: Holds sensor fusion algorithms, camera calibration profiles, and safety-critical ASIL-B firmware images.

IC Role / Device Role / Timing Role: Secure, high-reliability flash with OTP-locked keys and ASP-controlled sector access for ISO 26262 compliance.

Use Value: Supports dual-image fail-safe boot and encrypted firmware updates while meeting 105°C junction temperature requirements.

Industrial PLC HMI

Medical Imaging Console

Use Scenario: Stores UI firmware, configuration templates, and historical log buffers in panel-mounted HMIs.

IC Role / Device Role / Timing Role: Industrial-grade (–40°C to +85°C) SPI flash with uniform 256-KB erase blocks for deterministic update timing.

Use Value: Eliminates field downtime during firmware upgrades by enabling background erase-suspend during runtime operation.

Use Scenario: Retains DICOM viewer firmware, DICOM header metadata schemas, and regulatory audit logs.

IC Role / Device Role / Timing Role: High-data-integrity storage with 20-year retention and hardware ECC-validated for Class II medical device lifecycle.

Use Value: Meets FDA 21 CFR Part 11 requirements for immutable firmware history and tamper-evident log storage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Cypress S25FS256SAGNFB003	Same die, identical electrical specs, but WSON-8 (6×5 mm) package - no BGA option	Limited to space-constrained PCBs without BGA routing capability; lacks FAB024/FAC024 footprint support	Select when board area is constrained and BGA assembly infrastructure is unavailable
Winbond W25Q256JWSIQ	256 Mb, 1.8 V, QPI/Quad SPI, but no DDR mode or hardware ECC; 64-KB uniform sectors only	Requires software ECC implementation and lacks DDR bandwidth for XIP-heavy workloads	Select for cost-sensitive industrial applications where DDR throughput and ECC are not mandatory

Compared with S25FS256SAGNFB003, the WSON variant trades BGA flexibility for smaller footprint; compared with W25Q256JWSIQ, the Infineon part delivers higher reliability via integrated ECC and faster DDR-based reads essential for automotive boot performance.

Availability

S25FS256SAGMFB003 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS domain controllers, and industrial PLC HMIs requiring stable component supply across extended product lifecycles.

Supply support for S25FS256SAGMFB003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to IATF 16949 and ISO 9001.

The FS-S Flash family targets automotive and industrial applications demanding high reliability, AEC-Q100 qualification, and advanced security features like ASP and OTP-designed specifically for ECU boot code and firmware storage.

FAQ

What is the maximum DDR Quad I/O read speed for S25FS256SAGMFB003?

The device achieves 80 MBps read throughput using DDR Quad I/O mode at 80 MHz clock frequency. This is measured under standard load conditions (VCC = 1.8 V, TA = 25°C) and requires proper impedance-controlled PCB routing and termination matching per Infineon's layout guidelines in Section 7.3 of the datasheet.

Does S25FS256SAGMFB003 support both hybrid and uniform sector erase options?

Yes-it offers two physical erase architectures: hybrid (eight 4-KB + one 224-KB sector) and uniform (256-KB blocks). The configuration is set at power-up via status register bits and remains fixed until reset; both options support erase suspend/resume and are factory-configurable per order code.

How is the 1024-byte OTP array used in secure boot implementations?

The OTP array stores immutable values such as public key hashes, root-of-trust certificates, or device-unique identifiers. Once programmed, it cannot be erased or rewritten. Boot ROM code validates firmware signatures against OTP-stored keys before execution, enforcing chain-of-trust integrity without relying on volatile memory or external security elements.

Is S25FS256SAGMFB003 pin-compatible with earlier S25FL-S series devices?

No-while command-set and footprint are compatible with S25FL-S devices in SOIC and WSON packages, the BGA-24 (FAB024/FAC024) variant has different pin assignments and ball mapping. Migration requires PCB redesign and validation of signal integrity for DDR timing margins per Section 6.5 of the datasheet.

S25FS256SAGMFB003 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: FS-S

Package/Case:: 16-SOIC (0.295", 7.50mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 32M x 8

Memory Interface:: SPI - Quad I/O, QPI

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: 1.7V ~ 2V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 16-SOIC

S25FS256SAGMFB003 FAQ

1.How can I place an order for S25FS256SAGMFB003 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FS256SAGMFB003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FS256SAGMFB003 reliable?

The price and inventory of S25FS256SAGMFB003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGMFB003 is usually 5 days.

3.What payment methods are accepted for S25FS256SAGMFB003?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGMFB003 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FS256SAGMFB003?

S25FS256SAGMFB003 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FS256SAGMFB003 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FS256SAGMFB003?

For technical support, including S25FS256SAGMFB003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGMFB003 requirements.

6.How does Aetrix verify that S25FS256SAGMFB003 is sourced from the original manufacturer or authorized distributors?

All S25FS256SAGMFB003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGMFB003 meets industry standards.

7.What is the process for return or replacement of S25FS256SAGMFB003?

All S25FS256SAGMFB003 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGMFB003, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FS256SAGMFB003 part is unused and in its original packaging.

Return procedure for S25FS256SAGMFB003:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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