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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S25FS256SAGMFI001

Name: S25FS256SAGMFI001
Brand: Infineon Technologies
SKU: S25FS256SAGMFI001
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S25FS256SAGMFI001

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 16-SOIC (0.295", 7.50mm Width)

Datasheet:: S25FS256SAGMFI001.pdf

Description:: IC FLASH 256MBIT SPI/QUAD 16SOIC

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S25FS256SAGMFI001 from Infineon is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, operating at 1.8 V supply, supporting DDR Quad I/O read up to 80 MBps, 100,000 program-erase cycles, and 20-year data retention. It features hardware ECC, hybrid/uniform sector erase options, and AEC-Q100 Grade 2 qualification (–40°C to +105°C), deployed in automotive instrument clusters for firmware storage.

For engineers reviewing the S25FS256SAGMFI001 datasheet, S25FS256SAGMFI001 pinout, S25FS256SAGMFI001 application, or S25FS256SAGMFI001 equivalent, key selection criteria include DDR Quad I/O bandwidth, AEC-Q100 Grade 2 temperature compliance, OTP array size, hybrid sector architecture, and BGA-24 FAB024/FAC024 footprint compatibility.

Technical Context

This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with embedded hardware ECC for single-bit error correction and automatic recovery during read operations. Its SPI-MIO interface supports four I/O modes (Single/Dual/Quad/DDR Quad), configurable via status and configuration registers, and enables XIP-capable continuous burst reads.

The flash supports dual-sector erase architectures: hybrid (eight 4-KB + one 32-KB or 224-KB sectors plus uniform 64/256-KB blocks) and uniform (all 64-KB or all 256-KB sectors), with program/erase suspend-resume and SFDP/CFI for runtime configuration discovery.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mbit (32 MB) - sufficient for full MCU boot image + OTA update partition in automotive ECUs
Supply Voltage	1.7 V to 2.0 V - matches low-voltage SoC I/O rails and reduces system power delivery complexity
Max Read Rate	80 MBps (DDR Quad I/O @ 80 MHz) - enables sub-400 ms firmware load time for 32 MB images
Endurance	100,000 program-erase cycles - supports frequent field updates in telematics gateways
Data Retention	20 years at +85°C - meets automotive long-life reliability requirements without refresh
Erase Architecture	Hybrid: eight 4-KB + one 224-KB sector + remaining 256-KB blocks - balances small-parameter update granularity with large-firmware efficiency
OTP Size	1024 bytes - stores immutable keys, calibration constants, or VIN-binding data in secure silicon region

Pinout & Package

Package: 24-ball BGA, 6 mm × 8 mm, 0.5 mm pitch (FAB024 footprint) or 4 × 6 ball array (FAC024 footprint), Pb-free, RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
CS#	Chip Select	Active-low enable for command/address/data transfer; supports multi-device daisy-chain or parallel addressing
SCK	Serial Clock	Input clock for SDR (up to 133 MHz) or DDR (up to 80 MHz) operation; phase/polarity configurable per SPI mode 0/3
IO0–IO3	Multi-I/O Data Lines	Bi-directional pins supporting Single/Dual/Quad/DDR Quad I/O protocols; IO2 = WP#, IO3 = RESET# in alternate function
VCC	Core Supply	1.8 V ±0.1 V power input; decoupling required within 5 mm of package for stable DDR timing
VSS	Ground	Signal and power return; dedicated VSS balls in BGA layout minimize ground bounce during high-speed I/O switching
NC / RFU	No Connect / Reserved	Unbonded or internally unused; must be left floating or tied to VSS per layout guidelines to avoid noise coupling

Key Features

Feature	Design Value
Hardware ECC Engine	On-the-fly single-bit error correction with no software overhead or latency penalty during read access
Program/Erase Suspend	Allows background firmware update (program) to pause while servicing real-time interrupt-driven code fetch (read)
Advanced Sector Protection (ASP)	Password-controlled individual sector locking prevents unauthorized reprogramming of safety-critical boot code regions
SFDP & CFI Support	Enables automatic driver initialization and runtime parameter discovery without hard-coded timing or geometry assumptions
AEC-Q100 Grade 2	Qualified for –40°C to +105°C operation with full parametric validation - eliminates derating analysis for under-hood ECU designs

Applications

Automotive Instrument Cluster

ADAS Domain Controller

Use Scenario: Stores digital gauge graphics, firmware, and calibration tables for real-time rendering on TFT displays.

IC Role / Device Role / Timing Role: Non-volatile code and asset storage with XIP-capable continuous read mode for zero-latency GUI execution.

Use Value: DDR Quad I/O bandwidth ensures <500 ms boot-to-display time; 20-year retention avoids recalibration drift over vehicle lifetime.

Use Scenario: Holds sensor fusion algorithms, camera ISP firmware, and safety monitor code in centralized ADAS ECUs.

IC Role / Device Role / Timing Role: Secure, high-reliability boot memory with OTP-locked safety-critical vectors and ASP-protected update partitions.

Use Value: AEC-Q100 Grade 2 rating guarantees operation at +105°C near radar processors; hardware ECC prevents silent corruption in safety-critical paths.

Telematics Control Unit (TCU)

EV Battery Management System (BMS)

Use Scenario: Stores cellular modem firmware, OTA update staging area, and encrypted connectivity credentials.

IC Role / Device Role / Timing Role: Dual-role memory: persistent config store + high-throughput update buffer with suspend/resume for seamless background downloads.

Use Value: 100,000-cycle endurance supports daily OTA updates over 27 years; hybrid sector layout isolates small credential writes from large firmware erases.

Use Scenario: Retains cell-balancing parameters, fault logs, and ISO 26262 ASIL-B certified boot code across thermal cycling.

IC Role / Device Role / Timing Role: Safety-isolated non-volatile memory with write-protection enforced by both hardware (WP#) and software (ASP password).

Use Value: OTP array secures cryptographic keys used in secure boot; 256-KB uniform sectors simplify ASIL-B compliant firmware partitioning.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Cypress S25FS256SAGNFI001	Same die, identical specs, but WSON-8 (6×5 mm) package - no BGA option	Limited to space-constrained PCBs without BGA routing capability; lacks FAB024/FAC024 thermal/power scalability	Select only when SOIC/WSON footprint is mandatory and DDR bandwidth >66 MBps is not required
Winbond W25Q256JWSIQ	3V supply (2.7–3.6 V), QPI-only interface, no DDR mode, 64-KB uniform sectors only	Not AEC-Q100 qualified; unsuitable for automotive under-hood use; lacks hybrid sector flexibility	Consider only for industrial control systems requiring QPI simplicity and 3V compatibility, not automotive or high-reliability apps

Compared with S25FS256SAGMFI001, the S25FS256SAGNFI001 offers identical functionality in a smaller WSON package but forfeits BGA thermal performance and DDR bandwidth, while the W25Q256JWSIQ trades automotive qualification and DDR capability for broader voltage tolerance and QPI ease-of-use in non-automotive contexts.

Availability

S25FS256SAGMFI001 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS domain controllers, and EV battery management systems requiring stable component supply, AEC-Q100 compliance, and high-speed DDR Quad I/O performance.

Supply support for S25FS256SAGMFI001 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power systems, sensors, and secure microcontrollers, with core expertise in automotive, industrial, and power management ICs.

The FS-S Flash family targets automotive and industrial applications demanding high reliability, extended temperature operation, and advanced security - designed specifically to replace legacy parallel NOR and meet ASIL-B boot memory requirements.

FAQ

Is S25FS256SAGMFI001 pin-compatible with earlier S25FL-S series devices?

Yes - it maintains footprint compatibility with S25FL-P and S25FL-S families in same package variants (e.g., BGA-24 FAB024), including identical pin functions for CS#, SCK, IO0–IO3, VCC, and VSS. However, DDR mode activation and SFDP version differ, requiring minor driver updates for full feature enablement.

Does this device support execute-in-place (XIP) operation?

Yes - it supports continuous burst read mode with wrap addressing, enabling true XIP execution directly from flash memory. This eliminates need for external RAM loading of code, reducing BoM cost and boot latency in resource-constrained automotive MCUs.

What is the purpose of the IO2 and IO3 pins beyond standard I/O?

IO2 serves as Write Protect (WP#) for hardware-based sector lock control, and IO3 doubles as RESET# for synchronous device reset - both configurable via status register bits. These dual functions reduce external component count in safety-critical designs where discrete WP/RESET logic would add failure points.

How does the hybrid sector architecture improve firmware update efficiency?

Hybrid sector layout provides eight 4-KB sectors for fine-grained parameter updates (e.g., calibration data), one 224-KB sector for bootloader storage, and remaining 256-KB blocks for application firmware - minimizing erase time and wear on small critical regions while maximizing throughput for large code images.

S25FS256SAGMFI001 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: FS-S

Package/Case:: 16-SOIC (0.295", 7.50mm Width)

Packaging:: Tube

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 32M x 8

Memory Interface:: SPI - Quad I/O, QPI

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: 1.7V ~ 2V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 16-SOIC

S25FS256SAGMFI001 FAQ

1.How can I place an order for S25FS256SAGMFI001 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FS256SAGMFI001 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FS256SAGMFI001 reliable?

The price and inventory of S25FS256SAGMFI001 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGMFI001 is usually 5 days.

3.What payment methods are accepted for S25FS256SAGMFI001?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGMFI001 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FS256SAGMFI001?

S25FS256SAGMFI001 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FS256SAGMFI001 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FS256SAGMFI001?

For technical support, including S25FS256SAGMFI001 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGMFI001 requirements.

6.How does Aetrix verify that S25FS256SAGMFI001 is sourced from the original manufacturer or authorized distributors?

All S25FS256SAGMFI001 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGMFI001 meets industry standards.

7.What is the process for return or replacement of S25FS256SAGMFI001?

All S25FS256SAGMFI001 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGMFI001, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FS256SAGMFI001 part is unused and in its original packaging.

Return procedure for S25FS256SAGMFI001:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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