Infineon Technologies S25FS256SAGMFI003
- Part No.:
- S25FS256SAGMFI003
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FS256SAGMFI003.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:1,444
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Product details
Overview
S25FS256SAGMFI003 from Infineon is a 256 Mb (32 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, and industrial temperature grade (–40°C to +85°C). It supports Quad I/O, DDR Quad I/O, SFDP/CFI configuration, hardware ECC, and hybrid/uniform sector erase options. Used in boot code storage for industrial microcontrollers and FPGA configuration.
For engineers reviewing the S25FS256SAGMFI003 datasheet, S25FS256SAGMFI003 pinout, S25FS256SAGMFI003 application, or S25FS256SAGMFI003 equivalent, key selection factors include 133 MHz fast read rate, 80 MBps DDR Quad I/O throughput, 100,000 program-erase cycles, 20-year data retention, and AEC-Q100 Grade 3 qualification for automotive control modules.
Technical Context
This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density NOR flash with deterministic latency and XIP-capable continuous read mode. It supports both 24-bit and 32-bit addressing, SPI clock modes 0/3, and full command compatibility with S25FL-P/S25FL-S families.
The embedded algorithm handles automatic ECC generation/correction for single-bit errors, page programming with suspend/resume, and hybrid sector erase (eight 4-KB + one 32-KB sectors) or uniform 256-KB block erase. Security includes OTP array, hardware/software block protection, and password-controlled Advanced Sector Protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mbit (32 MB) - sufficient for full FPGA bitstreams or dual-image firmware storage |
| Interface | SPI Multi-I/O with Quad/DDR Quad support - enables 80 MBps read bandwidth for real-time code execution |
| Supply Voltage | 1.7 V to 2.0 V - compatible with low-voltage SoC I/O domains and reduces system power |
| Erase Endurance | 100,000 cycles minimum - supports field firmware updates over 10+ years in industrial gateways |
| Data Retention | 20 years minimum at 85°C - ensures long-term reliability in unattended edge devices |
| Temperature Range | –40°C to +85°C (Industrial) - validated for operation in factory automation controllers |
| Read Throughput | 80 MBps (DDR Quad I/O @ 80 MHz) - meets boot latency requirements for ARM Cortex-A series processors |
Pinout & Package
Package: 24-ball BGA (FAC024 footprint: 4 × 6 ball array, 0.5 mm pitch, 6 mm × 8 mm body).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO0–IO3 | Multi-function I/O pins | Support SI/SO/WP#/RESET# roles; enable Quad I/O and DDR protocols without external logic |
| CS# | Chip Select | Active-low enable for command decoding; supports daisy-chaining in multi-flash systems |
| SCK | Serial Clock | Accepts up to 133 MHz SDR or 80 MHz DDR clock - defines maximum interface bandwidth |
| VCC / VSS | Power / Ground | 1.8 V core supply with dedicated ground plane - minimizes noise coupling during high-speed reads |
| WP# | Write Protect | Hardware-enabled sector lock; prevents accidental firmware overwrite during power transients |
| RESET# | Reset Input | Asynchronous hard reset - restores device to known state after brown-out or watchdog timeout |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | Single-bit error correction per 512-byte sector - eliminates need for host-side error handling logic |
| Hybrid sector architecture | Eight 4-KB + one 32-KB sectors at top/bottom - enables secure boot partitioning with granular update control |
| Advanced Sector Protection (ASP) | Password-protected individual sector locking - enforces secure firmware update policies in medical devices |
| SFDP/CFI compliance | Standardized parameter tables readable via SPI - enables automatic driver initialization on Linux/RTOS platforms |
| Program/Erase suspend | Interruptible operations - allows time-critical interrupt servicing without flash operation loss |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing dual-image firmware and configuration data in programmable logic controllers deployed in factory environments. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with XIP-capable continuous read mode for deterministic startup timing. Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity across extended maintenance intervals without replacement. | Use Scenario: Holding safety-critical boot code and sensor calibration data in radar ECU modules operating under AEC-Q100 Grade 2 conditions. IC Role / Device Role / Timing Role: Certified NOR flash providing secure, ECC-protected boot path with ASP-enforced sector lockdown. Use Value: Password-controlled Advanced Sector Protection prevents unauthorized reprogramming of ASIL-B functional safety partitions. |
| FPGA Configuration Storage | Edge AI Gateway Code Storage |
Use Scenario: Loading bitstream and runtime firmware into Xilinx Zynq or Intel Cyclone SoC-FPGAs in telecom infrastructure equipment. IC Role / Device Role / Timing Role: High-bandwidth Quad I/O interface delivering 80 MBps DDR reads to meet FPGA configuration time budgets. Use Value: Uniform 256-KB erase blocks align with FPGA image partitioning schemes, simplifying OTA update management. | Use Scenario: Hosting Linux kernel, rootfs, and ML inference models in fanless industrial gateways with thermal constraints. IC Role / Device Role / Timing Role: Low-power deep power-down mode (6 µA) extends uptime in battery-backed edge nodes. Use Value: 0.006 mA deep power-down current enables >5-year operation on coin-cell backup without refresh cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FS256SAGNFI000 | Same die, identical electrical specs, but WSON-8 (6×5 mm) package - no BGA footprint | Limited to space-constrained PCBs where BGA assembly is unavailable | Select when board-level rework capability or standard reflow is required over BGA |
| Winbond W25Q256JWSIQ | 256 Mb, 1.8 V, but lacks DDR Quad I/O and ASP; uses different SFDP layout | Requires modified driver stack and offers no password-protected sector locking | Choose only if DDR bandwidth and advanced security are not required |
Compared with S25FS256SAGMFI003, the S25FS256SAGNFI000 provides identical functionality in a surface-mount WSON package for simplified assembly, while the W25Q256JWSIQ trades DDR performance and ASP security for broader ecosystem driver support and lower unit cost.
Availability
S25FS256SAGMFI003 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, FPGA configuration systems, and edge AI gateways requiring stable component supply and long-term lifecycle assurance.
Supply support for S25FS256SAGMFI003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.
The FS-S Flash product line delivers high-reliability, low-voltage serial NOR flash optimized for secure boot, real-time code execution, and long-life embedded storage in harsh environments.
FAQ
What is the maximum supported SPI clock frequency for DDR Quad I/O mode?
The S25FS256SAGMFI003 supports DDR Quad I/O at up to 80 MHz clock frequency, delivering 80 MBps effective read throughput. This is specified in the AC characteristics section (Rev. *O, Table 6.5) and validated across the full industrial temperature range. Exceeding 80 MHz in DDR mode may result in timing violations and data corruption.
Does this part include built-in error correction, and how is it implemented?
Yes - the device integrates hardware-based ECC that automatically generates and checks Hamming codes for every 512-byte sector. Single-bit errors are corrected transparently during read operations without host intervention. No software ECC driver or additional memory overhead is required, and correction occurs inline with data output.
Can the OTP array be programmed multiple times, and what is its primary use case?
No - the 1024-byte OTP array is one-time programmable and permanently locked after initial write. It is commonly used to store cryptographic keys, device-specific identifiers, or calibration constants that must remain immutable across the product lifetime, such as in medical or automotive safety-critical systems.
Is the FAC024 BGA package lead-free and RoHS compliant?
Yes - the FAC024 package is Pb-free and fully RoHS 2015/863/EU compliant, with NiPdAu surface finish on all balls. Infineon confirms halogen-free status per IEC 61249-2-21, and the part meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) for standard SMT assembly processes.
S25FS256SAGMFI003 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FS256SAGMFI003 FAQ
1.How can I place an order for S25FS256SAGMFI003 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS256SAGMFI003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS256SAGMFI003 reliable?
The price and inventory of S25FS256SAGMFI003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGMFI003 is usually 5 days.
3.What payment methods are accepted for S25FS256SAGMFI003?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGMFI003 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS256SAGMFI003?
S25FS256SAGMFI003 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS256SAGMFI003 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS256SAGMFI003?
For technical support, including S25FS256SAGMFI003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGMFI003 requirements.
6.How does Aetrix verify that S25FS256SAGMFI003 is sourced from the original manufacturer or authorized distributors?
All S25FS256SAGMFI003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGMFI003 meets industry standards.
7.What is the process for return or replacement of S25FS256SAGMFI003?
All S25FS256SAGMFI003 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGMFI003, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS256SAGMFI003 part is unused and in its original packaging.
Return procedure for S25FS256SAGMFI003:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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