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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S25FS256SAGMFM001

Name: S25FS256SAGMFM001
Brand: Infineon Technologies
SKU: S25FS256SAGMFM001
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S25FS256SAGMFM001

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 16-SOIC (0.295", 7.50mm Width)

Datasheet:: S25FS256SAGMFM001.pdf

Description:: IC FLASH 256MBIT SPI/QUAD 16SOIC

Quantity:: RFQ Add To RFQ list

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Inventory:3,504

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Product details

Overview

S25FS256SAGMFM001 from Infineon is a 256 Mb (32 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, and industrial temperature grade (–40°C to +85°C). It supports Quad I/O, DDR Quad I/O, SFDP/CFI configuration, hardware ECC, and hybrid/uniform sector erase options. Used in boot code storage for embedded microcontrollers in industrial control systems.

For engineers reviewing the S25FS256SAGMFM001 datasheet, S25FS256SAGMFM001 pinout, S25FS256SAGMFM001 application, or S25FS256SAGMFM001 equivalent, key selection criteria include 133 MHz fast read rate, 80 MBps DDR Quad I/O throughput, 100,000 program-erase cycles, 20-year data retention, and AEC-Q100 Grade 3 qualification for automotive firmware storage.

Technical Context

This device implements SPI-MIO (Multi-Input/Output) with support for standard SPI modes 0/3, Dual/Quad I/O, and DDR Quad I/O command sets. Its Eclipse architecture with 65-nm MIRRORBIT™ technology enables burst wrap and continuous XIP read modes alongside SFDP v1.6 and CFI compliance for automatic configuration discovery.

The flash integrates on-die ECC for single-bit correction and supports both hybrid sector erase (eight 4-KB + one 32-KB or 224-KB sectors) and uniform 64-KB/256-KB block erase. Erase suspend/resume and program suspend/resume are implemented at the embedded algorithm level.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mbit (32 MB) - sufficient for full MCU boot image + firmware + parameter storage in space-constrained designs
Supply Voltage	1.7 V to 2.0 V - compatible with low-voltage SoC I/O domains and reduces system power consumption
Max Read Rate	80 MBps DDR Quad I/O - enables near-parallel memory bandwidth without parallel bus routing
Erase Endurance	100,000 cycles minimum - supports field firmware updates over product lifetime in industrial gateways
Data Retention	20 years minimum at +85°C - ensures long-term reliability of stored calibration data and security keys
Temperature Range	–40°C to +85°C (Industrial Grade) - validated for operation in factory automation PLCs and motor drives
Package	BGA-24, 6 × 8 mm, FAB024 footprint (5 × 5 ball array) - high-density mounting with thermal pad for stable thermal performance

Pinout & Package

Package: BGA-24, 6 mm × 8 mm, FAB024 footprint (5 × 5 ball array), Pb-free, with exposed thermal pad.

Pin/Terminal	Circuit Role	Design Meaning
VCC	Power supply input	1.8 V core and I/O supply; decoupling required within 5 mm of ball for stable DDR timing
VSS	Ground reference	Signal and power ground; connects to PCB thermal pad for thermal dissipation and noise reduction
CS#	Chip select input	Active-low enable for command latching; must be asserted before SCK edge for valid SPI transaction
SCK	Serial clock input	Up to 133 MHz SDR or 80 MHz DDR; phase/polarity configurable per mode 0/3
IO0–IO3	Multi-function I/O pins	Support SI/SO/WP#/RESET# roles in standard SPI; enable Quad I/O or DDR Quad I/O in extended command mode
NC	No-connect balls	Unbonded internal pads; must be left floating or tied to VSS per layout guidelines

Key Features

Feature	Design Value
Hardware ECC	On-die single-bit error correction with no host CPU overhead or latency penalty during read operations
DDR Quad I/O Interface	80 MBps effective bandwidth using double-data-rate transfers on four bidirectional lines, reducing pin count vs. parallel NOR
Hybrid Sector Architecture	Flexible 4-KB/32-KB or 4-KB/224-KB top/bottom sectors plus uniform 64/256-KB blocks - simplifies bootloader partitioning and OTA update design
OTP Array	1024-byte one-time-programmable region for secure key storage, MAC addresses, or calibration constants with permanent write lock
Advanced Sector Protection	Password- or boot-code-controlled individual sector locking - prevents unauthorized firmware modification in deployed edge devices

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot loader, real-time OS kernel, and safety-critical application code in programmable logic controllers.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory mapped into MCU address space via XIP-capable Quad I/O interface.

Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity across 15+ year PLC service life without refresh.

Use Scenario: Holding boot code and sensor fusion firmware for camera/radar ECUs in Level 2+ ADAS systems.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified SPI flash providing deterministic boot time via DDR Quad I/O read at 80 MBps.

Use Value: Hardware ECC and ASP prevent corruption or tampering of safety-critical boot images during vehicle operation.

Medical Imaging Device Configuration

Smart Grid Communication Module

Use Scenario: Storing DICOM protocol stacks, calibration profiles, and regulatory-compliant audit logs in portable ultrasound units.

IC Role / Device Role / Timing Role: Secure nonvolatile storage with OTP for device-specific identifiers and encrypted parameter sets.

Use Value: 1024-byte OTP array enables HIPAA-compliant unique device ID binding without external secure element.

Use Scenario: Hosting firmware and communication stack (DLMS/COSEM, IEC 61850) in utility smart meters and RTUs.

IC Role / Device Role / Timing Role: Industrial-grade flash supporting remote firmware updates over RF or PLC links with suspend/resume erase capability.

Use Value: Erase suspend/resume allows background update while maintaining real-time metering accuracy during power line events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Cypress S25FS256SAGNFM001	Same die, identical electrical specs, but WSON-8 (6×5 mm) package - no BGA thermal pad	Limited to lower-power, space-constrained consumer IoT nodes; unsuitable for thermally demanding industrial enclosures	Select when board area is critical and thermal load < 150 mW; avoid for continuous Quad DDR operation above 70°C ambient
Winbond W25Q256JWSIQ	256 Mb, 1.8 V, but no DDR mode; max 133 MHz Quad I/O = 66 MBps; no integrated ECC	Requires host-side ECC implementation and lacks DDR timing margin for high-throughput XIP	Choose only if cost sensitivity outweighs bandwidth and reliability requirements; verify host driver support for external ECC

Compared with S25FS256SAGNFM001 and W25Q256JWSIQ, the S25FS256SAGMFM001 delivers superior thermal management via BGA thermal pad, deterministic DDR timing for XIP, and zero-overhead hardware ECC-critical for safety-certified industrial and automotive firmware storage.

Availability

S25FS256SAGMFM001 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging subsystems, and smart grid communication modules requiring stable component supply and long-term lifecycle support.

Supply support for S25FS256SAGMFM001 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure memory solutions, with global R&D and manufacturing infrastructure.

The FS-S Flash family targets high-reliability embedded systems requiring deterministic boot, secure firmware storage, and long-term data integrity-designed specifically for industrial automation, automotive, and medical applications.

FAQ

What is the function of the IO3/RESET# pin on S25FS256SAGMFM001?

The IO3/RESET# pin serves dual functions: as IO3 in Quad I/O and DDR Quad I/O modes, and as an active-low hardware reset input that forces the device into default SPI mode and clears internal state. When used as RESET#, it must be pulled high via 4.7 kΩ resistor; asserting it low halts ongoing operations and resets command logic without powering down the device.

Does S25FS256SAGMFM001 support execute-in-place (XIP) operation?

Yes, S25FS256SAGMFM001 supports continuous XIP mode using Quad I/O or DDR Quad I/O commands, enabling direct code execution from flash without copying to RAM. This requires MCU SPI controller support for wrap-around burst reads and proper cache coherency handling; XIP latency is 8 ns initial access + 6.25 ns per byte at 133 MHz.

How is the 1024-byte OTP array protected against accidental overwrite?

The OTP array is protected by a dedicated One-Time Program Lock bit in the Configuration Register. Once set, this bit permanently disables all program and erase commands to the OTP region. Programming requires issuing the Write Enable command followed by the Program OTP command with correct password; no hardware fuse is involved-protection is register-based and irreversible.

Can S25FS256SAGMFM001 operate at 1.7 V while maintaining full 133 MHz Quad I/O performance?

Yes, S25FS256SAGMFM001 guarantees full specification compliance-including 133 MHz Quad I/O read, 512-byte page programming, and 64-KB sector erase-at 1.7 V minimum supply voltage across the full industrial temperature range. DC and AC characteristics are fully characterized at 1.7 V, with no derating required for timing or endurance parameters.

S25FS256SAGMFM001 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: FS-S

Package/Case:: 16-SOIC (0.295", 7.50mm Width)

Packaging:: Tube

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 32M x 8

Memory Interface:: SPI - Quad I/O, QPI

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: 1.7V ~ 2V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 16-SOIC

S25FS256SAGMFM001 FAQ

1.How can I place an order for S25FS256SAGMFM001 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FS256SAGMFM001 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FS256SAGMFM001 reliable?

The price and inventory of S25FS256SAGMFM001 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGMFM001 is usually 5 days.

3.What payment methods are accepted for S25FS256SAGMFM001?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGMFM001 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FS256SAGMFM001?

S25FS256SAGMFM001 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FS256SAGMFM001 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FS256SAGMFM001?

For technical support, including S25FS256SAGMFM001 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGMFM001 requirements.

6.How does Aetrix verify that S25FS256SAGMFM001 is sourced from the original manufacturer or authorized distributors?

All S25FS256SAGMFM001 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGMFM001 meets industry standards.

7.What is the process for return or replacement of S25FS256SAGMFM001?

All S25FS256SAGMFM001 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGMFM001, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FS256SAGMFM001 part is unused and in its original packaging.

Return procedure for S25FS256SAGMFM001:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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