Infineon Technologies S25FS256SAGMFM003
- Part No.:
- S25FS256SAGMFM003
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FS256SAGMFM003.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:3,179
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FS256SAGMFM003 from Infineon is a 256 Mb (32 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, and industrial temperature grade (–40°C to +85°C). It supports Quad I/O, DDR Quad I/O read up to 80 MBps, 256/512-byte page programming, hardware ECC, and hybrid/uniform sector erase options. Used for firmware storage in embedded controllers requiring XIP execution and secure boot.
For engineers reviewing the S25FS256SAGMFM003 datasheet, S25FS256SAGMFM003 pinout, S25FS256SAGMFM003 application, or S25FS256SAGMFM003 equivalent, key selection criteria include DDR Quad I/O bandwidth, 100K program-erase cycles, OTP array size, AEC-Q100 grade compatibility, and BGA-24 package footprint alignment with layout constraints.
Technical Context
This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density NOR flash with deterministic timing and robust data retention. It supports both SDR and DDR SPI protocols across clock modes 0 and 3, with configurable 24-/32-bit addressing and SFDP/CFI for auto-configuration.
The flash integrates dual-sector erase architectures: hybrid (eight 4-KB + one 32-KB or 224-KB sectors) and uniform (64-KB or 256-KB blocks), plus programmable block protection via status register bits and advanced sector protection with password-controlled access to OTP and boot sectors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mbit (32 MB) - sufficient for full firmware images including bootloader, OS, and application code in space-constrained designs |
| Interface | SPI Multi-I/O with Quad/DDR Quad support - enables 80 MBps read throughput for XIP-capable microcontrollers |
| Voltage Range | 1.7 V to 2.0 V - matches low-voltage SoC I/O domains and reduces power supply complexity |
| Erase Endurance | 100,000 program-erase cycles - supports field firmware updates over product lifetime without wear leveling |
| Data Retention | 20 years minimum at 85°C - ensures long-term reliability in industrial control and automotive ECUs |
| Temperature Grade | Industrial (–40°C to +85°C) - qualified for operation in factory automation, networking, and transportation systems |
| Security | 1024-byte OTP array + hardware ECC + ASP - enables secure boot key storage and tamper-resistant firmware partitioning |
Pinout & Package
Package: BGA-24, 6 mm × 8 mm, FAB024 5×5 ball footprint (Pb-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Power supply | 1.8 V core and I/O supply; decoupling required per Infineon layout guidelines |
| VSS | Ground | Signal and power return path; separate analog/digital ground not required |
| CS# | Chip select | Active-low enable for command/address/data transfer; supports multi-device daisy-chaining |
| SCK | Serial clock | Input clock for SDR (up to 133 MHz) or DDR (up to 80 MHz); phase/polarity configurable |
| IO0 | Serial input / I/O0 | Primary data line for standard SPI; bidirectional in Dual/Quad modes |
| IO1 | Serial output / I/O1 | Output in standard mode; used as second I/O in Dual/Quad; supports DDR read/write |
| IO2 | Write protect / I/O2 | Hardware write protection when asserted; functions as third I/O in Quad mode |
| IO3 | Reset / I/O3 | Hardware reset input; also serves as fourth I/O in Quad mode and DDR operations |
| WP# | Write protect | Dedicated hardware protection pin; independent of IO2 function when configured as WP# |
| RESET# | Reset | Asynchronous active-low reset; resets internal state machine and exits DPD mode |
Key Features
| Feature | Design Value |
|---|---|
| DDR Quad I/O Read | 80 MBps throughput - eliminates external RAM buffering for real-time XIP execution in MCU-based edge nodes |
| Hardware ECC | Single-bit error correction with no software overhead - maintains data integrity without CPU intervention during reads |
| Hybrid Sector Erase | Flexible 4-KB/32-KB top/bottom sectors + 64-KB main array - enables safe OTA update partitioning with minimal wasted space |
| Advanced Sector Protection | Password-locked sector access control - prevents unauthorized firmware modification or extraction in certified devices |
| OTP Array | 1024-byte one-time programmable region - stores cryptographic keys, calibration data, or device-specific identifiers permanently |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration data for programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with XIP support and fast Quad I/O read for deterministic boot timing. Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity across decades of unattended operation. | Use Scenario: Holding boot code and safety-critical sensor fusion algorithms in radar/EPS ECUs requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: Secure boot memory with OTP key storage and hardware ECC to meet ISO 26262 ASIL-B requirements. Use Value: Password-protected ASP prevents runtime firmware tampering, while DDR Quad I/O enables sub-100ms boot time. |
| Networking Equipment Configuration | Medical Imaging System Code Storage |
Use Scenario: Storing FPGA bitstreams, MAC tables, and protocol stacks in enterprise switches and routers. IC Role / Device Role / Timing Role: High-bandwidth SPI flash interfaced to ARM Cortex-A series SoCs for rapid configuration loading. Use Value: 80 MBps DDR Quad I/O read rate accelerates system initialization and firmware recovery after power loss. | Use Scenario: Hosting diagnostic firmware and image processing libraries in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Radiation-tolerant, low-power flash memory supporting deep power-down during standby to extend battery life. Use Value: 6 µA deep power-down current and industrial-grade thermal stability ensure reliable operation in mobile clinical environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FS256SAGNFM003 | Same die, identical electrical specs, but WSON-8 (6×8 mm) package instead of BGA-24 | Limited to PCBs with SOIC/WSON footprints; no BGA routing or thermal pad considerations | Select when board space allows surface-mount SOIC/WSON and BGA rework is undesirable |
| Winbond W25Q256JWSIQ | 256 Mb, 1.8 V, QPI/Quad SPI, but no DDR mode; 100K cycles, 20-year retention, no integrated ASP | Lacks password-protected sector access and DDR bandwidth; requires external ECC handling | Choose for cost-sensitive designs where DDR performance and advanced security are not required |
Compared with S25FS256SAGNFM003 and W25Q256JWSIQ, the S25FS256SAGMFM003 uniquely delivers DDR Quad I/O bandwidth, on-die ECC, and password-enforced sector protection in a thermally enhanced BGA-24 package-critical for safety-certified and high-throughput embedded systems.
Availability
S25FS256SAGMFM003 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, networking equipment, and medical imaging systems requiring stable component supply and long-lifecycle support.
Supply support for S25FS256SAGMFM003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.
The FS-S Flash family targets high-reliability embedded systems needing deterministic boot, secure firmware storage, and scalable density-designed specifically for AEC-Q100-compliant automotive ECUs and industrial controllers demanding 20-year data retention.
FAQ
What is the maximum DDR Quad I/O read speed supported by S25FS256SAGMFM003?
The device achieves 80 MBps DDR Quad I/O read throughput at 80 MHz clock frequency, verified per Infineon datasheet Rev. *O Section 3 (Performance Summary). This speed assumes proper signal integrity, matched trace lengths, and termination per the BGA-24 layout recommendations in Section 7.3.
Does S25FS256SAGMFM003 support 32-bit addressing for >16 MB memory maps?
Yes, it supports extended 32-bit addressing mode, enabling full access to its 256 Mb address space without bank switching. This is enabled via the Extended Address Register (EAR) and documented in Section 8.1 (Address Space Maps) and Command 0x15 (Enter 4-Byte Address Mode).
How is the 1024-byte OTP array protected against accidental programming?
The OTP region is write-protected by default and requires two-step unlocking: first issuing Write Enable (0x06), then executing the One-Time Program command (0x42) with correct address and data. Once programmed, bits cannot be reset; verification is performed automatically during write completion.
Can S25FS256SAGMFM003 operate in standard SPI mode without using Quad or DDR features?
Yes, it fully supports legacy SPI mode (single I/O, SDR) with commands like Read (0x03) and Fast Read (0x0B) at up to 133 MHz. All Multi-I/O and DDR functionality is optional and disabled by default; configuration is done via Status and Configuration Registers per Section 6.4 and 6.5.
S25FS256SAGMFM003 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FS256SAGMFM003 FAQ
1.How can I place an order for S25FS256SAGMFM003 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS256SAGMFM003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS256SAGMFM003 reliable?
The price and inventory of S25FS256SAGMFM003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGMFM003 is usually 5 days.
3.What payment methods are accepted for S25FS256SAGMFM003?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGMFM003 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS256SAGMFM003?
S25FS256SAGMFM003 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS256SAGMFM003 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS256SAGMFM003?
For technical support, including S25FS256SAGMFM003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGMFM003 requirements.
6.How does Aetrix verify that S25FS256SAGMFM003 is sourced from the original manufacturer or authorized distributors?
All S25FS256SAGMFM003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGMFM003 meets industry standards.
7.What is the process for return or replacement of S25FS256SAGMFM003?
All S25FS256SAGMFM003 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGMFM003, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS256SAGMFM003 part is unused and in its original packaging.
Return procedure for S25FS256SAGMFM003:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FS256SAGMFM003 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

