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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S25FS256SAGMFV000

Name: S25FS256SAGMFV000
Brand: Infineon Technologies
SKU: S25FS256SAGMFV000
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S25FS256SAGMFV000

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 16-SOIC (0.295", 7.50mm Width)

Datasheet:: S25FS256SAGMFV000.pdf

Description:: IC FLASH 256MBIT SPI/QUAD 16SOIC

Quantity:: RFQ Add To RFQ list

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Inventory:2,931

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Product details

Overview

S25FS256SAGMFV000 from Infineon is a 256 Mb (32 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, and industrial temperature grade (–40°C to +85°C). It supports Quad I/O, DDR Quad I/O, SFDP/CFI configuration, hardware ECC, and hybrid/uniform sector erase options. Used in boot code storage for embedded microcontrollers in industrial control systems.

For engineers reviewing the S25FS256SAGMFV000 datasheet, S25FS256SAGMFV000 pinout, S25FS256SAGMFV000 application, or S25FS256SAGMFV000 equivalent, key selection criteria include 133 MHz Fast Read speed (66 MBps), 256-byte/512-byte page programming, 100,000 program-erase cycles, AEC-Q100 Grade 3 qualification, and BGA-24 (FAB024) package compatibility.

Technical Context

This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density, low-voltage operation at 1.7–2.0 V. It supports both SDR and DDR SPI protocols across clock polarity modes 0 and 3, with configurable 24-/32-bit addressing and burst wrap or XIP continuous read modes.

The flash integrates dual-sector erase architectures: hybrid (eight 4-KB + one 32-KB or 224-KB sectors) and uniform (64-KB or 256-KB blocks), plus OTP array (1024 bytes), hardware/software block protection, and password-controlled Advanced Sector Protection (ASP) for secure firmware storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mbit (32 MB) - sufficient for full MCU boot image + firmware + parameter storage in space-constrained designs
Interface	SPI Multi-I/O with Quad/DDR Quad support - enables 80 MBps read throughput for real-time XIP execution
Supply Voltage	1.7 V to 2.0 V - compatible with low-power 1.8 V system rails and reduces active current vs. 3.3 V flash
Erase Endurance	100,000 cycles minimum - supports field firmware updates over 10+ years in industrial gateways
Data Retention	20 years minimum at +85°C - ensures long-term reliability of stored calibration data and security keys
Temperature Grade	Industrial (–40°C to +85°C) - validated for operation in factory automation PLCs and motor drives
Package	BGA-24, 6 × 8 mm, FAB024 footprint (5 × 5 ball array) - surface-mount compatible with high-density PCB layouts

Pinout & Package

Package: BGA-24, 6 × 8 mm body, FAB024 footprint (5 × 5 ball array), Pb-free, RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
VCC	Power supply	1.7–2.0 V core voltage input; decoupling required per Infineon layout guidelines
VSS	Ground	Signal and power return path; must be connected to low-impedance ground plane
CS#	Chip select	Active-low enable for command/address/data transfer; supports multi-device daisy-chaining
SCK	Serial clock	Input clock for SDR/DDR SPI; max 133 MHz SDR or 80 MHz DDR operation
IO0	Serial input / I/O0	Primary bidirectional data line; used in single/dual/quad I/O modes per instruction
IO1	Serial output / I/O1	Secondary bidirectional line; enables dual/quad read/write with IO0–IO3
IO2	Write protect / I/O2	Hardware write-protection enable or quad I/O data lane; configurable via status register
IO3	Reset / I/O3	Active-low reset input or fourth quad I/O lane; default function is RESET# on power-up

Key Features

Feature	Design Value
Hardware ECC	On-the-fly single-bit error correction with no software overhead or latency penalty
Program/Erase Suspend	Allows background read access during long erase operations (e.g., 256-KB sector erase ~275 ms)
Advanced Sector Protection (ASP)	Password-protected individual sector locking prevents unauthorized firmware overwrite or extraction
SFDP & CFI Support	Self-describing configuration allows automatic driver initialization without hard-coded timing parameters
Hybrid Sector Architecture	Enables fast small-sector updates (4-KB) while preserving large-block efficiency for bulk firmware images

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot loader, RTOS kernel, and safety-critical control logic in programmable logic controllers.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory accessed via SPI-XIP during cold start and firmware update cycles.

Use Value: 20-year data retention and 100K erase cycles ensure reliable operation across 15+ year product lifecycles in unattended installations.

Use Scenario: Holding certified boot code and sensor fusion firmware for camera/radar ECUs in Level 2+ ADAS systems.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified SPI flash providing secure, deterministic boot within 500 ms startup window.

Use Value: Hardware ECC and ASP prevent corruption or tampering of safety-critical firmware during vehicle lifetime.

Medical Imaging System Configuration

Smart Grid Communication Module

Use Scenario: Storing calibration profiles, DICOM metadata templates, and regulatory compliance logs in portable ultrasound devices.

IC Role / Device Role / Timing Role: Nonvolatile parameter store with OTP-secured calibration constants accessed during power-on self-test.

Use Value: 1024-byte OTP array guarantees immutability of FDA-required calibration signatures across device generations.

Use Scenario: Hosting protocol stacks (DLMS/COSEM, IEC 61850) and encryption keys in utility smart meters and concentrators.

IC Role / Device Role / Timing Role: Secure firmware repository supporting remote OTA updates with rollback protection and signature verification.

Use Value: Uniform 256-KB sector erase enables atomic firmware swaps without interrupting grid monitoring functions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Cypress S25FS256TAFMFI000	Same density, 3.0 V supply, SOIC-16 package only - no BGA option or DDR support	Requires level-shifting in 1.8 V systems; unsuitable for space-constrained BGA-only designs	Select when legacy 3.0 V infrastructure exists and DDR performance is not required
Winbond W25Q256JWEIQ	256 Mb, 1.8 V, QPI mode supported, but no hardware ECC or ASP; 64-KB uniform sectors only	Lacks secure sector locking and error correction - requires external SW ECC or failsafe update logic	Select for cost-sensitive consumer applications where security and endurance are secondary

Compared with S25FS256SAGMFV000, the Cypress alternative trades DDR performance and BGA packaging for 3.0 V compatibility, while the Winbond part omits hardware ECC and ASP-increasing firmware validation burden and reducing field reliability in mission-critical deployments.

Availability

S25FS256SAGMFV000 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging subsystems, and smart grid communication modules requiring stable component supply and long-term lifecycle support.

Supply support for S25FS256SAGMFV000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.

The FS-S Flash family targets high-reliability embedded systems needing secure, low-voltage, high-speed boot memory with extended endurance and automotive qualification.

FAQ

Is S25FS256SAGMFV000 pin-compatible with earlier S25FL-S series devices?

Yes - it maintains identical pinout and command set compatibility with S25FL-S devices in SOIC-16 and BGA-24 packages, including identical CS#, SCK, IO0–IO3, WP#, and RESET# signal mapping and timing behavior per JEDEC JESD216.

Does this device support execute-in-place (XIP) operation?

Yes - it supports continuous read mode with wrap-around addressing, enabling true XIP execution from flash without copying to RAM, verified across all supported read commands including Quad I/O and DDR Quad I/O up to 133 MHz SDR clock rate.

What is the purpose of the IO3/RESET# pin in normal operation?

In standard operation, IO3 functions as the active-low RESET# input. It can be reconfigured as a fourth I/O line (IO3) only after issuing the Enable Reset Disable (ERDSR) command and setting the appropriate status register bit - default power-up state is RESET#.

How is the 1024-byte OTP array physically implemented and protected?

The OTP array resides in a dedicated silicon region outside main flash array, permanently programmed via high-voltage pulse. Once locked via Status Register bit SRP0/SRP1, it becomes read-only and immune to erase or program commands - verified by Infineon's secure silicon certification process.

S25FS256SAGMFV000 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: FS-S

Package/Case:: 16-SOIC (0.295", 7.50mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 32M x 8

Memory Interface:: SPI - Quad I/O, QPI

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: 1.7V ~ 2V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 16-SOIC

S25FS256SAGMFV000 FAQ

1.How can I place an order for S25FS256SAGMFV000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FS256SAGMFV000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FS256SAGMFV000 reliable?

The price and inventory of S25FS256SAGMFV000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGMFV000 is usually 5 days.

3.What payment methods are accepted for S25FS256SAGMFV000?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGMFV000 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FS256SAGMFV000?

S25FS256SAGMFV000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FS256SAGMFV000 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FS256SAGMFV000?

For technical support, including S25FS256SAGMFV000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGMFV000 requirements.

6.How does Aetrix verify that S25FS256SAGMFV000 is sourced from the original manufacturer or authorized distributors?

All S25FS256SAGMFV000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGMFV000 meets industry standards.

7.What is the process for return or replacement of S25FS256SAGMFV000?

All S25FS256SAGMFV000 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGMFV000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FS256SAGMFV000 part is unused and in its original packaging.

Return procedure for S25FS256SAGMFV000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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