Infineon Technologies S25FS256SAGMFV001
- Part No.:
- S25FS256SAGMFV001
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FS256SAGMFV001.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:2,115
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Product details
Overview
S25FS256SAGMFV001 from Infineon is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, operating at 1.8 V supply, supporting DDR Quad I/O read up to 80 MBps, hybrid and uniform sector erase options, and integrated hardware ECC for single-bit error correction. It is used in industrial and automotive boot code storage where high reliability, fast XIP-capable reads, and AEC-Q100 Grade 2 qualification (–40°C to +105°C) are required.
For engineers reviewing the S25FS256SAGMFV001 datasheet, S25FS256SAGMFV001 pinout, S25FS256SAGMFV001 application, or S25FS256SAGMFV001 equivalent, key selection criteria include 1.8 V operation, DDR Quad I/O bandwidth, OTP array size, hybrid sector layout flexibility, and AEC-Q100 Grade 2 temperature compliance.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with dual-plane memory organization, enabling concurrent program/erase suspend-resume operations. It supports both legacy SPI command subsets (compatible with S25FL-A/K/P/S families) and enhanced Multi-I/O protocols including QPI mode and SFDP v1.6 parameter discovery.
The internal ECC engine operates transparently during read cycles and corrects single-bit errors without software intervention, while the configurable protection scheme combines status register-based block lock, hardware WP# control, and password-protected Advanced Sector Protection (ASP) for secure boot code partitioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mbit (32 MB) non-volatile storage capacity for full firmware images or multi-application partitions |
| Supply Voltage | 1.7 V to 2.0 V - enables direct integration with 1.8 V I/O domains without level shifting |
| Max Read Rate | 80 MBps via DDR Quad I/O - supports real-time XIP execution of code from flash in resource-constrained systems |
| Erase Endurance | 100,000 program-erase cycles - ensures long-term field reliability in frequent firmware update scenarios |
| Data Retention | 20 years minimum at +85°C - meets automotive and industrial lifecycle requirements without refresh |
| Temperature Grade | AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood and industrial control unit deployment |
| OTP Size | 1024 bytes one-time programmable array - stores cryptographic keys or immutable device identifiers |
Pinout & Package
Package: BGA-24, 6 × 8 mm, FAB024 footprint (5 × 5 ball array), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; supports daisy-chain configuration in multi-device systems |
| SCK | Serial Clock | Input clock for SDR (up to 133 MHz) or DDR (up to 80 MHz) operation; phase/polarity modes 0 and 3 supported |
| IO0 / SI | Serial Input / Data Line 0 | Primary data input in single/dual/quad modes; functions as SI in standard SPI, IO0 in MIO/QPI |
| IO1 / SO | Serial Output / Data Line 1 | Primary data output in single/dual/quad modes; functions as SO in standard SPI, IO1 in MIO/QPI |
| IO2 / WP# | Write Protect / Data Line 2 | Hardware write protection when asserted low; also serves as bidirectional I/O line in quad mode |
| IO3 / RESET# | Reset / Data Line 3 | Hardware reset input (active-low); doubles as I/O3 in quad mode; enables safe recovery from lockup states |
| VCC | Power Supply | 1.8 V core and I/O supply; decoupling required per datasheet layout guidelines to maintain signal integrity |
| VSS | Ground | Signal and power ground reference; multiple VSS balls ensure low-impedance return path for high-speed I/O |
Key Features
| Feature | Design Value |
|---|---|
| DDR Quad I/O Interface | Enables 80 MBps read throughput using double-data-rate on four bidirectional lines - reduces bus congestion vs. parallel NOR |
| Hybrid Sector Architecture | Combines eight 4-KB + one 32-KB sectors at top/bottom with remaining 64-KB sectors - optimizes small-code + large-data partitioning |
| Integrated Hardware ECC | Single-bit error correction applied automatically on every read - eliminates need for external error-handling logic or software overhead |
| Advanced Sector Protection (ASP) | Password-controlled per-sector read/write lock - secures boot loader and calibration data against unauthorized access or overwrite |
| Serial Flash Discoverable Parameters (SFDP) | JEDEC JESD216 v1.6 compliant parameter table - allows host MCU to auto-configure timing, addressing, and command sets at boot |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Storing calibrated display firmware and safety-critical boot code in digital instrument clusters requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: Primary boot memory providing XIP-capable instruction fetch directly to MCU core via Quad I/O interface. Use Value: 20-year data retention and 100K erase cycles ensure functional safety over vehicle lifetime without field updates compromising integrity. |
Use Scenario: Holding field-upgradable control logic and HMI assets in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile configuration and application image store accessed via SPI-MIO for deterministic boot and runtime reload. Use Value: Hybrid sector layout allows independent erasure of UI assets (in 4-KB sectors) without disturbing core control firmware (in 64-KB blocks). |
| Medical Imaging Boot Loader | Edge AI Gateway Configuration |
|
Use Scenario: Securing certified boot loader and regulatory-compliant initialization routines in FDA-class II imaging devices. IC Role / Device Role / Timing Role: Trusted storage for signed boot code validated by host SoC before execution; leverages OTP and ASP for tamper resistance. Use Value: 1024-byte OTP array stores root-of-trust keys; ASP enforces password-gated read access to prevent reverse engineering. |
Use Scenario: Hosting model metadata, sensor calibration profiles, and OTA update staging area in battery-powered edge inference gateways. IC Role / Device Role / Timing Role: Low-power persistent memory supporting deep power-down (6 µA) between inference cycles while retaining configuration state. Use Value: 0.006 mA deep power-down current extends battery life; SFDP auto-configuration simplifies porting across heterogeneous host platforms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FS256SAGNFM001 | Same die, identical electrical specs, but WSON-8 (6×5 mm) package - no BGA footprint compatibility | Limited to space-constrained PCBs without BGA assembly capability; lacks FAB024 mechanical mounting stability | Select only if board layout prohibits BGA or requires smaller footprint and thermal profile permits WSON limits |
| Winbond W25Q256JWSIQ | 256 Mb, 1.8 V, but uses traditional SPI (no DDR Quad I/O); max read rate 40 MBps; no integrated ECC | Suitable for cost-sensitive designs where XIP performance and error resilience are secondary to BOM simplicity | Choose when DDR bandwidth and hardware ECC are not required, and legacy SPI host compatibility is prioritized |
Compared with S25FS256SAGMFV001, the Cypress alternative offers identical functionality in a different package but sacrifices BGA mechanical robustness, while the Winbond part trades DDR speed and ECC for lower cost and simpler interface support - making it viable only in non-safety-critical, bandwidth-tolerant applications.
Availability
S25FS256SAGMFV001 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot loaders, and edge AI gateways requiring stable component supply, AEC-Q100 qualification, and long-term data integrity.
Supply support for S25FS256SAGMFV001 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions, with global R&D and manufacturing infrastructure.
The FS-S Flash product line delivers high-reliability, AEC-Q100-qualified serial NOR memory optimized for automotive and industrial boot code storage, featuring advanced data protection, DDR performance, and long-term endurance.
FAQ
Does S25FS256SAGMFV001 support Quad Peripheral Interface (QPI) mode?
Yes, the device supports QPI mode with 4-line bidirectional data transfer and command compression, reducing instruction overhead and improving effective bandwidth. QPI is enabled via configuration register bit CR3[1], and requires host MCU firmware support for command set translation and latency management per datasheet section 4.4.
What is the physical sector layout for hybrid erase option?
In hybrid sector mode, the device provides either eight 4-KB sectors plus one 32-KB sector (top or bottom), or eight 4-KB sectors plus one 224-KB sector (top or bottom), with all remaining sectors sized at 64 KB or 256 KB respectively. This layout is fixed per device variant and cannot be reconfigured in-system.
How does the internal ECC operate during read cycles?
The hardware ECC engine automatically checks each 512-byte page during read operations and corrects single-bit errors transparently. No software intervention or additional latency is introduced unless a multi-bit error occurs, which triggers an uncorrectable error flag in the status register and halts the read sequence.
Is the OTP array reprogrammable after initial programming?
No, the 1024-byte OTP array is permanently programmed using high-voltage pulses and cannot be erased or rewritten. Once written, bits can only transition from '1' to '0'; any attempt to reprogram results in permanent corruption. Programming must be performed once, during final test or secure provisioning.
S25FS256SAGMFV001 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FS256SAGMFV001 FAQ
1.How can I place an order for S25FS256SAGMFV001 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS256SAGMFV001 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS256SAGMFV001 reliable?
The price and inventory of S25FS256SAGMFV001 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGMFV001 is usually 5 days.
3.What payment methods are accepted for S25FS256SAGMFV001?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGMFV001 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS256SAGMFV001?
S25FS256SAGMFV001 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS256SAGMFV001 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS256SAGMFV001?
For technical support, including S25FS256SAGMFV001 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGMFV001 requirements.
6.How does Aetrix verify that S25FS256SAGMFV001 is sourced from the original manufacturer or authorized distributors?
All S25FS256SAGMFV001 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGMFV001 meets industry standards.
7.What is the process for return or replacement of S25FS256SAGMFV001?
All S25FS256SAGMFV001 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGMFV001, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS256SAGMFV001 part is unused and in its original packaging.
Return procedure for S25FS256SAGMFV001:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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