Infineon Technologies S25FS256SAGNFI001
- Part No.:
- S25FS256SAGNFI001
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
S25FS256SAGNFI001.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:

- Shipping:

Inventory:3,330
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Product details
Overview
S25FS256SAGNFI001 from Infineon is a 256 Mb (32 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, and industrial-plus temperature grade (–40°C to +105°C). It supports Quad I/O, DDR Quad I/O read up to 80 MBps, 256/512-byte page programming, hardware ECC, and hybrid/uniform sector erase options. Used in boot code storage for edge AI gateways requiring fast XIP execution and long-term data retention.
For engineers reviewing the S25FS256SAGNFI001 datasheet, S25FS256SAGNFI001 pinout, S25FS256SAGNFI001 application, or S25FS256SAGNFI001 equivalent, key selection criteria include DDR Quad I/O bandwidth, AEC-Q100 Grade 2 qualification, 20-year data retention, OTP security, and BGA-24 FAB024/FAC024 footprint compatibility.
Technical Context
This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling simultaneous read-while-write via program/erase suspend-resume and burst wrap addressing for XIP. Its SFDP v1.6 and CFI support enable automatic configuration by host boot ROM without hard-coded timing parameters.
The SPI-MIO interface supports four I/O pins (IO0–IO3) with configurable roles including RESET# and WP#, allowing flexible command decoding across standard, dual, quad, and DDR modes. Configuration registers control sector protection granularity, OTP lock status, and voltage detection thresholds.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mbit (32 MB) - sufficient for full firmware image + parameter storage in resource-constrained embedded hosts |
| Interface | SPI Multi-I/O with DDR Quad I/O - enables 80 MBps read throughput for real-time code execution |
| Supply Voltage | 1.7 V to 2.0 V - compatible with low-power SoC I/O rails and reduces system-level power conversion complexity |
| Erase Endurance | 100,000 cycles minimum - supports field firmware updates over 10+ years in industrial gateways |
| Data Retention | 20 years minimum at +105°C - ensures boot code integrity across full industrial-plus thermal lifecycle |
| Temperature Grade | Industrial Plus (–40°C to +105°C) - qualified for under-hood automotive ECUs and outdoor telecom equipment |
| Security | 1024-byte OTP array + ASP with password-controlled read access - prevents unauthorized firmware extraction or cloning |
Pinout & Package
Package: 24-ball BGA, 6 mm × 8 mm, 0.5 mm pitch (FAB024 footprint) or 4 × 6 ball array (FAC024 footprint), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO0 | Serial Input / Dual/Quad I/O | Primary data input in standard mode; bidirectional in multi-I/O modes for high-speed read/write |
| IO1 | Serial Output / Dual/Quad I/O | Primary data output in standard mode; bidirectional in multi-I/O modes for reduced pin count |
| IO2 | Write Protect / Dual/Quad I/O | Hardware write protection enable; functions as I/O2 in quad mode for parallel data transfer |
| IO3 | Reset / Dual/Quad I/O | Active-low reset input; serves as I/O3 in quad mode to complete 4-bit data bus |
| CS# | Chip Select | Active-low enable for command/address/data transactions; supports daisy-chaining in multi-device systems |
| SCK | Serial Clock | Input clock for synchronous SPI communication; supports up to 133 MHz SDR or 80 MHz DDR operation |
| VCC | Power Supply | 1.8 V core and I/O supply; decoupling required per Infineon layout guidelines to maintain signal integrity |
| VSS | Ground | Signal and power ground reference; multiple VSS balls in BGA package reduce impedance and EMI |
Key Features
| Feature | Design Value |
|---|---|
| DDR Quad I/O Read | 80 MBps throughput - eliminates external RAM buffering for XIP-based boot loaders in Cortex-M7/M33 microcontrollers |
| Hardware ECC | Single-bit error correction with no software overhead - maintains data integrity during extended temperature cycling without host intervention |
| Erase Suspend/Resume | Interrupt background erase to service urgent read requests - critical for real-time diagnostics and OTA update coexistence |
| Hybrid Sector Architecture | Mixed 4 KB / 32 KB / 64 KB physical sectors - optimizes small-parameter storage while preserving large-code-block efficiency |
| Advanced Sector Protection | Password-locked individual sector read access - enforces secure boot partitioning in certified safety-critical applications |
Applications
| Automotive ADAS Camera Module | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot firmware and calibration tables for 8 MP image processing pipeline running on TI TDA4VM. IC Role / Device Role / Timing Role: Primary boot memory with XIP-capable Quad DDR interface; provides deterministic <50 µs instruction fetch latency. Use Value: AEC-Q100 Grade 2 qualification ensures reliability at +105°C junction temperature; OTP secures camera vendor IP against reverse engineering. | Use Scenario: Holds ladder logic runtime, HMI assets, and field-upgradable motion control algorithms in DIN-rail mounted controller. IC Role / Device Role / Timing Role: Nonvolatile program store with erase suspend capability; allows background firmware update while maintaining real-time I/O scanning. Use Value: 100,000 program-erase cycles support >5 daily updates over 50 years; uniform 256 KB sectors simplify bootloader partitioning. |
| 5G Small Cell Baseband Unit | Medical Imaging Edge Gateway |
Use Scenario: Hosts FPGA configuration bitstream and LTE/NR protocol stack in fanless outdoor radio unit. IC Role / Device Role / Timing Role: High-bandwidth configuration memory interfaced to Xilinx Zynq UltraScale+ MPSoC via QSPI controller. Use Value: 80 MBps DDR Quad I/O meets FPGA partial reconfiguration bandwidth targets; SFDP auto-negotiation eliminates manual timing register setup. | Use Scenario: Stores DICOM viewer firmware, DICOM TLS certificates, and audit logs in FDA-cleared portable ultrasound device. IC Role / Device Role / Timing Role: Secure firmware vault with password-protected OTP region for cryptographic key storage. Use Value: 20-year data retention guarantees certificate validity across product lifecycle; hardware ECC prevents silent corruption of diagnostic metadata. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FS256SAGNFI010 | Same die, identical electrical specs, but shipped with factory-programmed SFDP table revision 1.7 instead of 1.6 | No functional impact; compatible in all host boot ROMs supporting JEDEC JESD216B | Select when SFDP v1.7 compliance is explicitly required by host SoC boot ROM |
| Winbond W25Q256JWSIQ | 256 Mb, 1.8 V, but lacks DDR mode, max Quad I/O = 40 MBps, no hardware ECC, only 10K erase cycles | Not suitable for XIP-intensive or safety-critical applications requiring ECC or >10K endurance | Consider only for cost-sensitive consumer designs where DDR and ECC are unnecessary |
Compared with S25FS256SAGNFI001, the Infineon S25FS256SAGNFI010 offers identical performance with updated SFDP metadata, while Winbond W25Q256JWSIQ trades DDR bandwidth, ECC, and endurance for lower unit cost-making it viable only in non-safety, non-XIP use cases.
Availability
S25FS256SAGNFI001 is available at Aetrix Electronics and suitable for automotive ADAS modules, industrial PLCs, 5G small cells, and medical edge gateways requiring stable component supply, long-lifecycle support, and AEC-Q100 qualification.
Supply support for S25FS256SAGNFI001 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and communications markets.
The FS-S Flash family targets high-reliability embedded systems requiring fast, secure, and long-life nonvolatile storage-specifically optimized for boot code, firmware, and configuration data in safety-critical and thermally demanding environments.
FAQ
What is the maximum clock frequency supported in DDR Quad I/O mode?
The S25FS256SAGNFI001 supports DDR Quad I/O operation at up to 80 MHz clock frequency, delivering 80 MBps effective read bandwidth. This is specified in the AC characteristics section (Table 6.5) of the datasheet and validated across the full –40°C to +105°C operating range with proper PCB layout and termination.
Does this part support hardware reset via the IO3 pin?
Yes, IO3 functions as active-low RESET# in standard SPI mode. Driving IO3 low for ≥20 µs initiates internal reset, clearing status registers and returning the device to standby state. This function remains available even when IO3 is reassigned as I/O3 in Quad mode, provided the host asserts reset before switching modes.
How is the 1024-byte OTP array protected from accidental overwrite?
The OTP array is permanently locked after first programming via Status Register Bit 7 (SRWD) and the Write Enable Latch (WEL). Once SRWD is set and WEL is cleared, no further writes-including erase or program commands-to any OTP byte are accepted. Lock status is verified by reading the OTP lock bits at address 0x00000400.
Can the S25FS256SAGNFI001 be used in place of S25FL256S without redesign?
No. Although both are 256 Mb SPI NOR flashes, S25FS256S uses Eclipse architecture with different SFDP parameter tables, erase suspend behavior, and OTP mapping versus S25FL256S's FL-S architecture. Pinout is identical, but firmware must be revalidated for command timing, status polling, and protection register usage.
S25FS256SAGNFI001 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (6x8)
S25FS256SAGNFI001 FAQ
1.How can I place an order for S25FS256SAGNFI001 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS256SAGNFI001 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS256SAGNFI001 reliable?
The price and inventory of S25FS256SAGNFI001 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGNFI001 is usually 5 days.
3.What payment methods are accepted for S25FS256SAGNFI001?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGNFI001 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS256SAGNFI001?
S25FS256SAGNFI001 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS256SAGNFI001 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS256SAGNFI001?
For technical support, including S25FS256SAGNFI001 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGNFI001 requirements.
6.How does Aetrix verify that S25FS256SAGNFI001 is sourced from the original manufacturer or authorized distributors?
All S25FS256SAGNFI001 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGNFI001 meets industry standards.
7.What is the process for return or replacement of S25FS256SAGNFI001?
All S25FS256SAGNFI001 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGNFI001, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS256SAGNFI001 part is unused and in its original packaging.
Return procedure for S25FS256SAGNFI001:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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