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Infineon Technologies S25FS256SAGNFI003
- Part No.:
- S25FS256SAGNFI003
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
S25FS256SAGNFI003.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,559
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Product details
Overview
S25FS256SAGNFI003 from Infineon is a 256 Mb (32 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, and industrial temperature grade (–40°C to +85°C). It supports Quad I/O, DDR Quad I/O, SFDP/CFI configuration, hardware ECC, and hybrid/uniform sector erase options for embedded boot and firmware storage in microcontroller-based systems.
For engineers reviewing the S25FS256SAGNFI003 datasheet, S25FS256SAGNFI003 pinout, S25FS256SAGNFI003 application, or S25FS256SAGNFI003 equivalent, key selection factors include 133 MHz fast read rate (66 MBps Quad), 256/512-byte page programming, 100,000 program-erase cycles, AEC-Q100 Grade 3 qualification, and BGA-24 (FAB024/FAC024) package compatibility.
Technical Context
This device implements SPI-MIO (Multi-Input/Output) with support for standard SPI modes 0/3, dual/quad I/O, and DDR Quad I/O read commands. Its Eclipse architecture with 65-nm MIRRORBIT™ technology enables burst wrap and continuous XIP execution while maintaining deterministic latency.
The flash integrates configurable protection mechanisms including status register-based block protection, advanced sector protection (ASP) with password-controlled access, and a 1024-byte OTP array. Erase granularity includes hybrid sectors (eight 4-KB + one 32-KB or 224-KB) and uniform 64-KB/256-KB blocks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mbit (32 MB) - sufficient for full MCU firmware images and parameter storage in resource-constrained edge devices |
| Supply Voltage | 1.7 V to 2.0 V - compatible with low-power 1.8 V system rails and reduces active current vs. 3.3 V flash |
| Read Speed | 66 MBps (Quad I/O @ 133 MHz) - enables near-real-time code execution from flash without local RAM caching |
| Erase Endurance | 100,000 cycles - supports field firmware updates over product lifetime in industrial gateways |
| Data Retention | 20 years minimum - ensures long-term reliability of stored calibration data and security keys |
| Temperature Range | –40°C to +85°C (Industrial Grade) - validated for operation in uncontrolled ambient environments |
| ECC | Internal hardware single-bit error correction - eliminates need for external error-handling logic in safety-critical boot paths |
Pinout & Package
Package: 24-ball BGA, 6 mm × 8 mm footprint, available in FAB024 (5×5 ball array) and FAC024 (4×6 ball array) configurations. Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for command/address/data transfer; supports multi-device daisy-chaining on shared SPI bus |
| SCK | Serial Clock | Provides timing reference up to 133 MHz SDR or 80 MHz DDR; phase/polarity configurable per SPI mode 0/3 |
| IO0–IO3 | Multi-I/O Data Lines | Bi-directional pins supporting single/dual/quad I/O and DDR protocols; IO3 doubles as RESET# input |
| WP# | Write Protect | Hardware-enabled sector lock; asserts during power-up to prevent accidental writes until explicitly disabled |
| VCC / VSS | Power / Ground | 1.8 V core supply with dedicated ground plane; decoupling required within 5 mm of VCC pin per layout guidelines |
| NC | No Connect | Unbonded pad; must remain floating or grounded per PCB design rules to avoid noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| DDR Quad I/O Read | 80 MBps throughput at 80 MHz clock - doubles effective bandwidth over SDR Quad, reducing boot time by ~30% vs. legacy SPI flash |
| Hybrid Sector Architecture | Eight 4-KB + one 32-KB sectors at top/bottom address space - enables secure bootloader partitioning with fine-grained update control |
| OTP Array | 1024-byte one-time programmable region - stores immutable device identifiers, cryptographic keys, or calibration constants resistant to field reprogramming |
| Advanced Sector Protection | Password- or boot-code controlled individual sector locking - prevents unauthorized firmware modification while allowing selective OTA updates |
| Automatic Hardware ECC | On-the-fly single-bit correction without CPU intervention - maintains data integrity across temperature cycling and voltage droop events |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing real-time control firmware and configuration tables in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory mapped via XIP interface; delivers deterministic instruction fetch latency under 100 ns. Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity across 15+ year equipment lifecycles without replacement. | Use Scenario: Holding boot code and sensor fusion algorithms for camera/radar ECUs in Level 2+ ADAS systems. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified SPI flash providing secure, fast-read boot image with hardware ECC for ASIL-B compliance. Use Value: DDR Quad I/O read speed (80 MBps) reduces cold-boot time to <250 ms, meeting automotive startup timing requirements. |
| Medical Imaging Device Parameter Storage | Smart Energy Meter Firmware Update |
Use Scenario: Retaining calibrated imaging parameters and regulatory audit logs in portable ultrasound and X-ray units. IC Role / Device Role / Timing Role: Secure silicon region (OTP) stores immutable calibration coefficients; ASP enforces write-protection during clinical use. Use Value: 1024-byte OTP + password-controlled ASP prevents tampering with FDA-mandated calibration data. | Use Scenario: Hosting field-upgradable firmware and tariff tables in ANSI C12.22-compliant smart electricity meters. IC Role / Device Role / Timing Role: Dual-bank erase architecture allows background firmware download while executing current version (swap-and-execute). Use Value: Hybrid sector layout (4-KB/32-KB) enables atomic 4-KB firmware patching without disrupting metering accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FS256T (now Infineon) | Same die, identical pinout and command set; differs only in marking and internal lot traceability | No functional difference; qualifies as direct replacement in existing designs | Select when requiring latest revision with updated reliability screening |
| Winbond W25Q256JW | 256 Mb, 1.8 V, but lacks DDR Quad I/O and ASP; uses different SFDP parameter layout | Supports basic Quad I/O boot but not XIP-optimized DDR reads or password-protected sector locking | Choose for cost-sensitive designs where DDR performance and advanced security are not required |
Compared with S25FS256SAGNFI003, the S25FS256T offers identical functionality with enhanced process monitoring, while the W25Q256JW trades DDR bandwidth and ASP security for lower unit cost and broader distributor availability.
Availability
S25FS256SAGNFI003 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging device parameter storage requiring stable component supply and long-term lifecycle support.
Supply support for S25FS256SAGNFI003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.
The FS-S Flash family targets high-reliability embedded systems needing fast, secure, and long-life non-volatile storage with SPI-MIO interface scalability and AEC-Q100 qualification.
FAQ
What package type does S25FS256SAGNFI003 use?
S25FS256SAGNFI003 uses a 24-ball BGA package with 6 mm × 8 mm footprint, available in two ball arrays: FAB024 (5×5) and FAC024 (4×6). Both variants are Pb-free, RoHS-compliant, and designed for automated surface-mount assembly with standard reflow profiles.
Does this device support execute-in-place (XIP) operation?
Yes, S25FS256SAGNFI003 supports continuous XIP mode using Fast Read, Dual I/O, Quad I/O, and DDR Quad I/O commands. The device delivers deterministic read latency and burst wrap addressing, enabling direct code execution from flash without copying to RAM in MCU-based systems.
How is data protection implemented on this flash device?
Data protection includes hardware write protect (WP#), status register-based block protection, and Advanced Sector Protection (ASP) with password or boot-code control. The 1024-byte OTP array provides immutable storage for keys and identifiers, and internal ECC corrects single-bit errors automatically during read operations.
Is S25FS256SAGNFI003 qualified for automotive applications?
Yes - S25FS256SAGNFI003 is AEC-Q100 qualified for Grade 3 (–40°C to +85°C) and Grade 2 (–40°C to +105°C). It meets automotive reliability standards including HTOL, ESD, and thermal cycling, and supports secure boot features required for ASIL-B compliant ECUs.
S25FS256SAGNFI003 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (6x8)
S25FS256SAGNFI003 FAQ
1.How can I place an order for S25FS256SAGNFI003 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS256SAGNFI003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS256SAGNFI003 reliable?
The price and inventory of S25FS256SAGNFI003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGNFI003 is usually 5 days.
3.What payment methods are accepted for S25FS256SAGNFI003?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGNFI003 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS256SAGNFI003?
S25FS256SAGNFI003 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS256SAGNFI003 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS256SAGNFI003?
For technical support, including S25FS256SAGNFI003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGNFI003 requirements.
6.How does Aetrix verify that S25FS256SAGNFI003 is sourced from the original manufacturer or authorized distributors?
All S25FS256SAGNFI003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGNFI003 meets industry standards.
7.What is the process for return or replacement of S25FS256SAGNFI003?
All S25FS256SAGNFI003 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGNFI003, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS256SAGNFI003 part is unused and in its original packaging.
Return procedure for S25FS256SAGNFI003:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FS256SAGNFI003 Tags
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