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Infineon Technologies S25FS256SDSBHB200

Name: S25FS256SDSBHB200
Brand: Infineon Technologies
SKU: S25FS256SDSBHB200
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S25FS256SDSBHB200

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 24-TBGA

Datasheet:: S25FS256SDSBHB200.pdf

Description:: IC FLASH 256MBIT SPI/QUAD 24BGA

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Product details

Overview

S25FS256SDSBHB200 from Infineon is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, 1.8 V supply, industrial temperature grade (–40°C to +85°C), and BGA-24 6 × 8 mm package (FAC024 footprint). It supports Quad I/O, DDR Quad I/O read up to 80 MBps, 256-byte/512-byte page programming, and hardware ECC for single-bit error correction. Used in boot code storage for embedded microcontrollers in industrial control systems.

For engineers reviewing the S25FS256SDSBHB200 datasheet, S25FS256SDSBHB200 pinout, S25FS256SDSBHB200 application, or S25FS256SDSBHB200 equivalent, key selection criteria include SPI-MIO timing compliance, hybrid vs uniform sector erase configuration, SFDP/CFI register accessibility, OTP array usage for secure boot, and FAC024 BGA mechanical compatibility with PCB layout constraints.

Technical Context

This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density NOR flash with deterministic read latency and XIP-capable continuous burst mode. It supports both standard SPI (modes 0/3) and enhanced Multi-I/O protocols including QPI and DDR Quad I/O, with configurable 24-/32-bit addressing.

The flash integrates dual-sector erase options: hybrid (eight 4-KB + one 224-KB sectors at top/bottom + remaining 256-KB sectors) or uniform (all 256-KB blocks), plus program/erase suspend-resume functionality and automatic on-the-fly ECC for reliability-critical firmware storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mbit (32 MB) - sufficient for full bootloader + firmware image + parameter storage in resource-constrained edge nodes
Supply Voltage	1.7 V to 2.0 V - compatible with low-voltage SoC I/O domains and reduces system power rail complexity
Max Read Rate	80 MBps (DDR Quad I/O @ 80 MHz) - enables fast XIP execution without external RAM buffering
Erase Endurance	100,000 cycles minimum - supports field firmware updates over 10+ years in industrial gateways
Data Retention	20 years minimum at +85°C - ensures long-term integrity of calibration data and security keys
Package	BGA-24, 6 × 8 mm, FAC024 footprint (4 × 6 ball array) - optimized for compact PCB layouts with thermal pad grounding
Temperature Grade	Industrial (–40°C to +85°C) - validated for operation in uncontrolled factory-floor environments

Pinout & Package

Package: BGA-24, 6 × 8 mm, FAC024 footprint (4 × 6 ball array), Pb-free, with exposed thermal pad (ball A1–D1 connected to VSS).

Pin/Terminal	Circuit Role	Design Meaning
VCC	Power supply input	1.8 V core supply; decoupling capacitor required within 5 mm for stable DDR timing
VSS	Ground reference	Signal and power ground; connects to thermal pad for thermal dissipation and noise reduction
CS#	Chip select input	Active-low enable for command/address/data transfer; must be held stable during DDR clock edges
SCK	Serial clock input	Supports up to 80 MHz DDR clock; phase/polarity configurable per SPI mode 0/3
IO0–IO3	Multi-function I/O pins	Configurable as SI/SO/WP#/RESET# or quad data lines; IO2/IO3 support hardware reset and write protection
NC	No-connect balls	Unbonded pads in FAC024 layout; must be left floating or grounded per PCB design rules

Key Features

Feature	Design Value
Hardware ECC engine	On-die single-bit error correction with no host CPU overhead; maintains data integrity across 20-year retention window
Program/Erase suspend-resume	Allows background firmware update while servicing real-time interrupts - critical for motion control PLCs
OTP array (1024 bytes)	Immutable storage for cryptographic keys or device-specific identifiers; programmed once during manufacturing
Hybrid sector architecture	Enables fine-grained update of boot code (4-KB sectors) while preserving large firmware images (256-KB sectors)
SFDP & CFI registers	Standardized parameter discovery allows automatic driver initialization without hard-coded timing constants

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot loader, safety-critical firmware, and runtime configuration in programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with XIP-capable continuous read mode and deterministic 80 MBps DDR Quad I/O access.

Use Value: Eliminates need for external SRAM cache; supports safe firmware rollback via hybrid sector erase without disrupting operational memory regions.

Use Scenario: Holding boot code and sensor fusion algorithms for radar/Ethernet ECUs in Level 2+ ADAS systems.

IC Role / Device Role / Timing Role: AEC-Q100 grade 2 qualified (–40°C to +105°C) flash used for secure, ECC-protected boot sequence under automotive thermal stress.

Use Value: OTP array stores asymmetric keys for secure boot verification; SFDP enables auto-negotiated timing across ECU variants.

Medical Imaging Control Board

Smart Grid RTU Configuration

Use Scenario: Storing FPGA configuration bitstreams and calibration tables in portable ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: High-reliability NOR flash with 20-year data retention and 100K P/E cycles for infrequently updated but mission-critical parameters.

Use Value: Uniform 256-KB sector option simplifies field upgrade partitioning; deep power-down current (6 µA) extends battery life in portable units.

Use Scenario: Hosting communication protocol stacks and grid event logs in remote terminal units operating in outdoor substations.

IC Role / Device Role / Timing Role: Industrial-grade flash with advanced sector protection (ASP) enabling password-controlled read access to sensitive grid telemetry.

Use Value: Block protection via status register prevents accidental overwrite during OTA updates; hybrid erase minimizes downtime during partial reconfiguration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Cypress S25FS256SAGNFI000	Same die, identical electrical specs and pinout; differs only in marking and packaging (SOIC-16 vs BGA-24)	Lacks FAC024 BGA footprint; unsuitable for space-constrained designs requiring 6×8 mm layout	Select when SOIC-16 board reuse or hand-soldering prototyping is required
Winbond W25Q256JWSIQ	256 Mb, 1.8 V, but uses 4-byte address mode only; no hybrid sector option; lower max DDR read rate (66 MBps)	Supports QPI but lacks SFDP v1.6 and ASP; no OTP array for secure key storage	Choose for cost-sensitive consumer applications where ECC and sector flexibility are non-critical

Compared with S25FS256SDSBHB200, the Cypress alternative offers identical functionality in SOIC-16, while Winbond provides lower-cost QPI compatibility at the expense of ECC, OTP, and flexible erase architecture - making Infineon's part uniquely suited for safety-aware industrial firmware storage.

Availability

S25FS256SDSBHB200 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging control board applications requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.

Supply support for S25FS256SDSBHB200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.

The FS-S Flash product line delivers high-reliability, SPI-MIO-enabled NOR flash targeting deterministic boot performance, secure firmware storage, and extended endurance in harsh operating environments.

FAQ

What is the function of the IO2 and IO3 pins on S25FS256SDSBHB200?

IO2 serves as Write Protect (WP#) for hardware-based sector lock, and IO3 functions as RESET# for asynchronous device reset. Both pins are configurable via status register bits and support dual-role operation in Multi-I/O modes. In Quad I/O mode, they become data lines IO2/IO3; in standard SPI, they retain protection/reset functions. Their behavior is defined by the Configuration Register CR2[7] and CR3[0].

Does S25FS256SDSBHB200 support 32-bit addressing in all command modes?

Yes - extended addressing is supported in all read, program, and erase commands via 32-bit address mode, enabled by setting Extended Addressing Register EAR[0] = 1. The device defaults to 24-bit mode for backward compatibility with legacy controllers, but 32-bit mode unlocks full 32 MB address space without bank switching overhead.

How is the OTP array accessed and protected?

The 1024-byte OTP array resides at address 0x00000000 and is accessed using dedicated One-Time Program Array commands (0x4B, 0x42). Once programmed, bits cannot be reset. Protection is enforced by Status Register SR3[7], which locks OTP after first write. Programming requires Write Enable (0x06) followed by OTP Program Enable (0xB1) before issuing OTP Write (0x42).

Can S25FS256SDSBHB200 operate in standard SPI mode without Multi-I/O features enabled?

Yes - it fully supports legacy SPI mode 0 and mode 3 with SI/SO only, using standard 8-bit opcodes and 24-bit addresses. All Multi-I/O features (Dual/Quad I/O, QPI, DDR) are disabled by default and require explicit configuration via Status and Configuration Registers. This ensures drop-in replacement capability for existing S25FL-S family designs without firmware changes.

S25FS256SDSBHB200 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: FS-S

Package/Case:: 24-TBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 32M x 8

Memory Interface:: SPI - Quad I/O, QPI

Clock Frequency:: 80 MHz

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: 1.7V ~ 2V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 24-BGA (8x6)

S25FS256SDSBHB200 FAQ

1.How can I place an order for S25FS256SDSBHB200 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FS256SDSBHB200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FS256SDSBHB200 reliable?

The price and inventory of S25FS256SDSBHB200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SDSBHB200 is usually 5 days.

3.What payment methods are accepted for S25FS256SDSBHB200?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SDSBHB200 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FS256SDSBHB200?

S25FS256SDSBHB200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FS256SDSBHB200 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FS256SDSBHB200?

For technical support, including S25FS256SDSBHB200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SDSBHB200 requirements.

6.How does Aetrix verify that S25FS256SDSBHB200 is sourced from the original manufacturer or authorized distributors?

All S25FS256SDSBHB200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SDSBHB200 meets industry standards.

7.What is the process for return or replacement of S25FS256SDSBHB200?

All S25FS256SDSBHB200 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SDSBHB200, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FS256SDSBHB200 part is unused and in its original packaging.

Return procedure for S25FS256SDSBHB200:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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