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Infineon Technologies S25FS256SDSBHI303
- Part No.:
- S25FS256SDSBHI303
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FS256SDSBHI303.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,614
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Product details
Overview
S25FS256SDSBHI303 from Infineon is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, 1.8 V supply, industrial-plus temperature range (–40°C to +105°C), and BGA-24 6 × 8 mm package (FAC024 footprint). It supports Quad I/O, DDR Quad I/O read up to 80 MBps, 100,000 program-erase cycles, and hardware ECC for single-bit error correction.
For engineers reviewing the S25FS256SDSBHI303 datasheet, S25FS256SDSBHI303 pinout, S25FS256SDSBHI303 application, or S25FS256SDSBHI303 equivalent, key selection criteria include hybrid/uniform sector erase options (4/32/64/256 KB), OTP array (1024 bytes), AEC-Q100 Grade 2 qualification, SFDP/CFI support, and compatibility with S25FL-P/S25FL-S families.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with embedded algorithms for suspend/resume during program and erase operations. It supports both standard SPI (modes 0/3) and enhanced protocols including QPI mode and DDR Quad I/O for high-throughput XIP-capable boot code storage.
The flash integrates dual-sector protection schemes: status-register-based block protection and password-controlled Advanced Sector Protection (ASP), enabling secure boot partitioning and firmware update isolation in safety-critical systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mbit (32 MB) - sufficient for full firmware images and parameter storage in resource-constrained embedded hosts |
| Supply Voltage | 1.7 V to 2.0 V - optimized for low-power 1.8 V system rails with tight regulation tolerance |
| Read Throughput | 80 MBps (DDR Quad I/O @ 80 MHz) - enables fast code execution directly from flash (XIP) in real-time applications |
| Erase Endurance | 100,000 cycles minimum - supports frequent field firmware updates over product lifetime |
| Data Retention | 20 years minimum at +85°C - ensures long-term reliability in industrial and automotive deployments |
| Temperature Grade | Industrial Plus (–40°C to +105°C) - qualified for under-hood and high-ambient industrial control environments |
| Package | BGA-24, FAC024 footprint (4 × 6 ball array, 0.5 mm pitch) - compact, thermally efficient layout for space-constrained PCBs |
Pinout & Package
Package: BGA-24, FAC024 footprint (4 × 6 ball array, 0.5 mm pitch, 6 mm × 8 mm body).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Power Supply | 1.8 V core supply input; decoupling required within 5 mm of ball for stable DDR timing |
| VSS | Ground | Signal and power ground reference; must be connected to solid ground plane |
| CS# | Chip Select | Active-low enable for command/address/data transfer; supports multi-device daisy-chaining |
| SCK | Serial Clock | Input clock for SPI interface; supports up to 133 MHz SDR or 80 MHz DDR operation |
| IO0 | Serial Input / Data I/O | Primary bidirectional data line; used for command, address, and data in all modes |
| IO1 | Serial Output / Data I/O | Secondary bidirectional line; enables Dual/Quad I/O and DDR transfers |
| IO2 | Write Protect / Data I/O | Hardware write-protection control or third I/O line in Quad mode |
| IO3 / RESET# | Reset Input / Data I/O | Active-low hardware reset or fourth I/O line; resets internal state without power cycle |
| WP# | Write Protect | Dedicated hardware protection pin; overrides software block protection when asserted |
| NC | No Connect | Unbonded pad; must be left floating or tied to VSS per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction with no host CPU overhead or latency penalty |
| Program/Erase Suspend | Allows background read access during active programming or erasing - critical for real-time interrupt handling |
| Advanced Sector Protection (ASP) | Password-protected individual sector locking prevents unauthorized firmware modification or readout |
| OTP Array | 1024-byte one-time programmable region for secure keys, calibration data, or unique device identifiers |
| SFDP & CFI Support | Standardized parameter discovery enables automatic driver configuration without hard-coded timing values |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code, GUI assets, and calibration tables in digital dashboards requiring AEC-Q100 Grade 2 compliance. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with XIP-capable Quad DDR reads for sub-100 ms boot time. Use Value: 80 MBps DDR Quad I/O and 20-year data retention ensure reliable operation across vehicle lifetime and thermal cycling. | Use Scenario: Holding firmware, configuration logic, and I/O mapping data in modular programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability program storage with ASP and OTP for secure firmware updates and device identity binding. Use Value: 100,000 erase cycles and hybrid sector architecture allow frequent field upgrades without wear-out concerns. |
| Medical Imaging Boot Memory | Edge AI Gateway Configuration |
Use Scenario: Hosting certified boot loader and safety-monitoring firmware in FDA-regulated diagnostic imaging equipment. IC Role / Device Role / Timing Role: Secure, tamper-resistant boot memory with hardware write protection and password-locked sectors. Use Value: Advanced Sector Protection and 1024-byte OTP enable cryptographic key storage and regulatory audit trail integrity. | Use Scenario: Storing edge inference models, sensor fusion parameters, and OTA update staging buffers in compact IoT gateways. IC Role / Device Role / Timing Role: High-bandwidth configuration store supporting rapid model reload via Quad I/O burst wrap mode. Use Value: 66 MBps Quad read throughput and SFDP auto-configuration reduce host driver development effort and boot latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FS256SAGBHI301 | Same die, identical electrical specs and pinout; differs only in marking and traceability documentation | No functional difference; accepted interchangeably in legacy designs with Cypress branding | Select when sourcing from pre-Infineon inventory or for cross-qualified BOM continuity |
| Winbond W25Q256JWSIQ | 256 Mb, 1.8 V, but uses 3-byte addressing by default; lacks DDR mode and ASP; no AEC-Q100 Grade 2 rating | Suitable for cost-sensitive consumer applications; not recommended for automotive or safety-critical industrial use | Choose only if DDR performance, advanced security, or extended temperature operation are not required |
Compared with S25FS256SDSBHI303, the Cypress alternative offers identical functionality with branding variance, while the Winbond part trades DDR speed, ASP security, and automotive qualification for lower unit cost and simpler command set.
Availability
S25FS256SDSBHI303 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging systems, and edge AI gateways requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant flash memory.
Supply support for S25FS256SDSBHI303 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and memory solutions for automotive, industrial, and IoT markets.
The FS-S Flash family targets high-reliability embedded systems needing secure, high-speed, and long-life nonvolatile storage - especially where AEC-Q100 qualification, hardware ECC, and flexible sector protection are mandatory.
FAQ
Is S25FS256SDSBHI303 pin-compatible with earlier S25FL-S devices?
Yes - it maintains identical pinout and command-set compatibility with S25FL-P and S25FL-S families, including SOIC, WSON, and BGA packages. The FAC024 BGA footprint matches S25FL256SAGBHI301, enabling drop-in replacement in existing layouts without redesign.
Does this device support execute-in-place (XIP) operation?
Yes - it supports continuous read mode and burst wrap addressing for true XIP execution. Quad I/O and DDR Quad I/O modes deliver up to 80 MBps bandwidth, enabling deterministic real-time code fetch from flash without local RAM buffering.
What security mechanisms prevent unauthorized firmware access?
It provides three layers: (1) hardware WP# pin for physical write lock, (2) status register-based block protection for contiguous sector ranges, and (3) Advanced Sector Protection (ASP) with password-controlled individual sector locking and optional read-access restriction.
How does the hybrid sector architecture benefit firmware update design?
Hybrid sector layout - eight 4-KB sectors plus one 32-KB sector at top/bottom, with remaining 64-KB sectors - allows dedicated small sectors for bootloader storage (fast, low-risk updates) and large sectors for application image storage (efficient bulk erase), minimizing update time and failure risk.
S25FS256SDSBHI303 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FS256SDSBHI303 FAQ
1.How can I place an order for S25FS256SDSBHI303 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS256SDSBHI303 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS256SDSBHI303 reliable?
The price and inventory of S25FS256SDSBHI303 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SDSBHI303 is usually 5 days.
3.What payment methods are accepted for S25FS256SDSBHI303?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SDSBHI303 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS256SDSBHI303?
S25FS256SDSBHI303 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS256SDSBHI303 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS256SDSBHI303?
For technical support, including S25FS256SDSBHI303 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SDSBHI303 requirements.
6.How does Aetrix verify that S25FS256SDSBHI303 is sourced from the original manufacturer or authorized distributors?
All S25FS256SDSBHI303 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SDSBHI303 meets industry standards.
7.What is the process for return or replacement of S25FS256SDSBHI303?
All S25FS256SDSBHI303 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SDSBHI303, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS256SDSBHI303 part is unused and in its original packaging.
Return procedure for S25FS256SDSBHI303:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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