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Infineon Technologies S25FS256SDSBHM200

Name: S25FS256SDSBHM200
Brand: Infineon Technologies
SKU: S25FS256SDSBHM200
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S25FS256SDSBHM200

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 24-TBGA

Datasheet:: S25FS256SDSBHM200.pdf

Description:: IC FLASH 256MBIT SPI/QUAD 24BGA

Quantity:: RFQ Add To RFQ list

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Inventory:2,618

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Product details

Overview

S25FS256SDSBHM200 from Infineon is a 256 Mb (32 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, and industrial temperature grade (–40°C to +85°C). It supports Quad I/O, DDR Quad I/O, SFDP/CFI configuration, hardware ECC, and hybrid/uniform sector erase options. Used in boot code storage for embedded microcontrollers in industrial control systems.

For engineers reviewing the S25FS256SDSBHM200 datasheet, S25FS256SDSBHM200 pinout, S25FS256SDSBHM200 application, or S25FS256SDSBHM200 equivalent, key selection factors include 133 MHz fast read rate, 80 MBps DDR Quad I/O throughput, 100,000 program-erase cycles, 20-year data retention, and AEC-Q100 Grade 3 qualification for automotive firmware storage.

Technical Context

This device implements SPI-MIO (Multi-Input/Output) architecture supporting standard SPI modes 0/3 and DDR operation, enabling burst wrap, continuous XIP, and QPI command sets. Its Eclipse-based MIRRORBIT™ 65-nm process delivers deterministic latency and high endurance via on-die ECC and dual-page programming buffers (256/512 bytes).

The flash integrates configurable protection mechanisms including status register block protection, OTP array (1024 bytes), and Advanced Sector Protection with password-controlled read access. Addressing supports both 24-bit and 32-bit modes, with physical sector layouts offering eight 4-KB + one 32-KB or 224-KB sectors plus uniform 64-KB/256-KB blocks.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mbit (32 MB) - sufficient for full firmware images and parameter tables in resource-constrained edge devices
Supply Voltage	1.7 V to 2.0 V - compatible with low-voltage SoC I/O domains and reduces system power consumption
Read Throughput	80 MBps DDR Quad I/O - enables near-real-time XIP execution of boot code without external RAM buffering
Endurance	100,000 program-erase cycles - supports field firmware updates over 10+ years in industrial gateways
Data Retention	20 years minimum at +85°C - ensures long-term reliability in unattended infrastructure equipment
Erase Options	Hybrid (4-KB/32-KB/224-KB) and uniform (64-KB/256-KB) sectors - simplifies partitioning for bootloader, app, and log regions
Security	OTP array (1024 B), ASP with password read control - protects cryptographic keys and vendor-specific configuration

Pinout & Package

Package: 24-ball BGA (FAB024 footprint: 5 × 5 ball array, 0.5 mm pitch, 6 mm × 8 mm body).

Pin/Terminal	Circuit Role	Design Meaning
CS#	Chip Select	Active-low enable for SPI command decoding; supports multi-device daisy-chain or parallel configurations
SCK	Serial Clock	Provides timing reference up to 133 MHz SDR or 80 MHz DDR; phase/polarity configurable per SPI mode 0/3
IO0–IO3	Multi-I/O Data Lines	Bi-directional pins supporting single/dual/quad I/O and DDR protocols; IO2/IO3 double as WP#/RESET#
VCC	Core Supply	1.8 V ±0.1 V input; decoupling required within 5 mm of pad to maintain signal integrity during high-speed reads
VSS	Ground	Signal and power return path; requires dedicated ground plane connection beneath BGA for EMI control
NC	No Connect	Unbonded pad - must be left floating or tied to VSS per layout guidelines to avoid parasitic coupling

Key Features

Feature	Design Value
DDR Quad I/O Interface	Enables 80 MBps sustained read bandwidth using clock doubling and 4-bit parallel data lanes, reducing boot time by >40% vs. standard SPI
On-Die ECC	Hardware-generated Hamming code corrects single-bit errors transparently during read, eliminating need for host-side error correction logic
Erase Suspend/Resume	Allows background erase operations to pause for high-priority program commands, critical for real-time logging in PLCs
Advanced Sector Protection	Per-sector password enforcement prevents unauthorized read access to secure boot partitions without compromising overall flash performance
SFDP/CFI Support	Self-describing configuration registers allow automatic driver initialization across multiple platforms without hard-coded timing parameters

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot loader, real-time OS kernel, and safety-critical control algorithms in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Primary nonvolatile code storage with XIP-capable Quad I/O interface ensuring sub-100 ms cold boot under -40°C ambient.

Use Value: 20-year data retention and 100K cycle endurance guarantee firmware integrity across 15+ year product lifecycles without replacement.

Use Scenario: Holding boot firmware and sensor calibration data for radar/EPS ECUs requiring AEC-Q100 Grade 2 qualification and rapid startup after ignition.

IC Role / Device Role / Timing Role: Secure, high-reliability boot memory with OTP-protected keys and ASP-enabled sector lockdown for ISO 26262 ASIL-B compliance.

Use Value: Hardware ECC and DDR Quad I/O reduce bit error rates and accelerate boot sequence by 3.2× versus legacy 1.8 V SPI flash.

Medical Imaging System Parameter Archive

Smart Grid RTU Configuration Storage

Use Scenario: Archiving DICOM calibration profiles, image processing pipelines, and regulatory audit logs in portable ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: Nonvolatile parameter repository with password-protected read access to prevent tampering with FDA-cleared imaging parameters.

Use Value: 1024-byte OTP array stores cryptographic signatures and revision hashes, enabling firmware authenticity verification at power-on.

Use Scenario: Storing communication protocol stacks (DLMS/COSEM), encryption certificates, and grid event logs in remote terminal units deployed in substations.

IC Role / Device Role / Timing Role: High-endurance configuration memory supporting daily firmware patches and decade-long deployment without wear leveling.

Use Value: Hybrid sector architecture allows independent 4-KB sector erasure for log updates while preserving 256-KB firmware blocks intact.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Cypress S25FS256SAGNFM000	Same die, identical pinout and timing; differs only in marking and tape/reel packaging	No functional difference; suitable for drop-in replacement where package form factor matches	Select when sourcing from legacy Cypress distribution channels or requiring specific reel orientation
Winbond W25Q256JWSIQ	256 Mb, 1.8 V, but lacks DDR mode and ASP; uses different SFDP structure and no OTP array	Supports basic Quad I/O boot but not DDR-accelerated XIP or password-protected read security	Choose for cost-sensitive designs where DDR throughput and advanced security are not required

Compared with S25FS256SDSBHM200, the Cypress alternative offers identical functionality with packaging variance, while the Winbond part trades DDR performance and hardware security for lower unit cost and broader distributor availability.

Availability

S25FS256SDSBHM200 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system parameter archive requiring stable component supply across extended lifecycle programs.

Supply support for S25FS256SDSBHM200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.

The FS-S Flash family targets high-reliability embedded systems needing fast, secure, and enduring nonvolatile storage - specifically engineered for boot code execution, firmware updates, and safety-critical data retention.

FAQ

What is the maximum clock frequency supported in DDR Quad I/O mode?

The S25FS256SDSBHM200 supports DDR Quad I/O operation at up to 80 MHz clock frequency, delivering 80 MBps effective read bandwidth. This is verified in the datasheet's DDR AC characteristics section (Rev. *O, Table 6.5), with setup/hold timing validated across –40°C to +85°C.

Does this device require external hardware ECC circuitry?

No. The device integrates on-die ECC hardware that automatically generates and checks Hamming codes during all read operations, correcting single-bit errors without host intervention. No external ECC logic or software overhead is needed per the Embedded Algorithm Performance Tables (Section 11).

Can the 1024-byte OTP array be reprogrammed after initial write?

No. The OTP (One-Time Program) array is permanently programmed during manufacturing or first use. Once any byte is written, that location cannot be altered. The datasheet specifies irreversible programming behavior in Section 9.1 and confirms no erase capability exists for OTP cells.

Is the FAB024 BGA package RoHS and REACH compliant?

Yes. All packages for the S25FS256S series, including the FAB024 24-ball BGA, are Pb-free and fully compliant with RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Compliance documentation is available in Infineon's Material Declaration Report #002-00368.

S25FS256SDSBHM200 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: FS-S

Package/Case:: 24-TBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 32M x 8

Memory Interface:: SPI - Quad I/O, QPI

Clock Frequency:: 80 MHz

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: 1.7V ~ 2V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 24-BGA (8x6)

S25FS256SDSBHM200 FAQ

1.How can I place an order for S25FS256SDSBHM200 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FS256SDSBHM200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FS256SDSBHM200 reliable?

The price and inventory of S25FS256SDSBHM200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SDSBHM200 is usually 5 days.

3.What payment methods are accepted for S25FS256SDSBHM200?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SDSBHM200 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FS256SDSBHM200?

S25FS256SDSBHM200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FS256SDSBHM200 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FS256SDSBHM200?

For technical support, including S25FS256SDSBHM200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SDSBHM200 requirements.

6.How does Aetrix verify that S25FS256SDSBHM200 is sourced from the original manufacturer or authorized distributors?

All S25FS256SDSBHM200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SDSBHM200 meets industry standards.

7.What is the process for return or replacement of S25FS256SDSBHM200?

All S25FS256SDSBHM200 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SDSBHM200, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FS256SDSBHM200 part is unused and in its original packaging.

Return procedure for S25FS256SDSBHM200:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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