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Infineon Technologies S25FS256SDSBHM203
- Part No.:
- S25FS256SDSBHM203
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FS256SDSBHM203.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,803
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Product details
Overview
S25FS256SDSBHM203 from Infineon is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, 1.8 V supply, industrial temperature grade (–40°C to +85°C), and BGA-24 6 × 8 mm package (FAB024 footprint). It supports Quad I/O, DDR Quad I/O read up to 80 MBps, 256-byte/512-byte page programming, and hardware ECC for single-bit error correction.
For engineers reviewing the S25FS256SDSBHM203 datasheet, S25FS256SDSBHM203 pinout, S25FS256SDSBHM203 application, or S25FS256SDSBHM203 equivalent, key selection criteria include hybrid/uniform sector erase options (4 KB/64 KB/256 KB), OTP array (1024 bytes), AEC-Q100 Grade 3 qualification, SFDP/CFI support, and compatibility with S25FL-P/S25FL-S families.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with dual-plane memory organization and on-die ECC logic. It executes SPI command subsets in modes 0 and 3, supports extended addressing (24-/32-bit), and enables XIP via Continuous Read mode with Burst Wrap capability.
The flash integrates configurable protection mechanisms including Status Register-based block protection, Advanced Sector Protection (ASP) with password-controlled read access, and hardware/software WP# control. Erase suspend/resume and program suspend/resume are supported across all sector types.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mbits (32 MB) - fixed storage capacity for firmware/image storage in resource-constrained embedded systems |
| Supply Voltage | 1.7 V to 2.0 V - optimized for low-power 1.8 V system rails with tight regulation tolerance |
| Read Throughput | 80 MBps (DDR Quad I/O @ 80 MHz) - enables fast boot code execution and real-time firmware updates |
| Erase Endurance | 100,000 program-erase cycles - supports frequent field firmware upgrades over product lifetime |
| Data Retention | 20 years minimum at +85°C - ensures long-term reliability in industrial environments without refresh |
| Temperature Grade | Industrial (–40°C to +85°C) - qualified for operation in uncontrolled ambient conditions without derating |
| Package | BGA-24, 6 × 8 mm, FAB024 (5 × 5 ball array) - surface-mount compatible with automated PCB assembly and thermal management |
Pinout & Package
Package: BGA-24, 6 mm × 8 mm body, FAB024 footprint (5 × 5 ball array), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Power Supply | 1.8 V core and I/O supply; decoupling required within 10 mm of ball |
| VSS | Ground | Signal and power return reference; must be connected to low-impedance ground plane |
| CS# | Chip Select | Active-low enable for SPI command decoding; supports multi-device daisy-chain or parallel configurations |
| SCK | Serial Clock | Input clock for SDR/DDR SPI operations; phase/polarity configurable per mode 0/3 |
| IO0 | Serial Input / IO0 | Primary data input in standard SPI; bidirectional in Dual/Quad I/O modes |
| IO1 | Serial Output / IO1 | Primary data output in standard SPI; bidirectional in Dual/Quad I/O modes |
| IO2 | Write Protect / IO2 | Hardware write protection when asserted low; also functions as Quad I/O line |
| IO3 / RESET# | Reset Input / IO3 | Asynchronous reset signal; also serves as fourth I/O line in Quad mode |
| NC | No Connect | Internally unused ball; must remain unconnected per design rules |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-die single-bit error correction with automatic detection and correction during read, eliminating need for external error-handling logic |
| Hybrid Sector Architecture | Configurable mix of eight 4-KB sectors + one 32-KB sector (or 224-KB) at top/bottom, enabling fine-grained firmware partitioning |
| OTP Array | 1024-byte one-time programmable region for secure key storage, calibration data, or device-specific identifiers |
| ASP with Password Control | Individual sector read protection enforced by boot code or user-defined password, preventing unauthorized firmware extraction |
| SFDP & CFI Support | Standardized parameter tables accessible via SPI commands, enabling automatic driver configuration without hard-coded timing values |
Applications
| Automotive Instrument Clusters | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated display assets, boot loader, and real-time OS image in digital dashboards with AEC-Q100 compliance requirements. IC Role / Device Role / Timing Role: Non-volatile firmware storage with XIP-capable Continuous Read mode and 20-year data retention at 85°C. Use Value: Eliminates external ECC controller; ASP prevents tampering with safety-critical UI assets. | Use Scenario: Holding field-upgradable control logic, configuration profiles, and diagnostic logs in modular automation controllers. IC Role / Device Role / Timing Role: High-endurance flash for repeated firmware patching in factory-floor environments with wide thermal cycling. Use Value: 100K erase cycles and hybrid sector layout allow independent update of logic vs. config partitions. |
| Medical Imaging Boot Memory | Edge AI Inference Accelerator Code Storage |
Use Scenario: Secure boot image storage for FDA-regulated imaging subsystems requiring traceable firmware integrity and long-term archival. IC Role / Device Role / Timing Role: Trusted storage with OTP for cryptographic keys and hardware-enforced read protection via ASP. Use Value: Meets IEC 62304 data retention and security requirements without software-level encryption overhead. | Use Scenario: Loading neural network weights and inference engine binaries into SRAM-based accelerators in battery-powered edge devices. IC Role / Device Role / Timing Role: High-bandwidth DDR Quad I/O interface delivering 80 MBps reads to minimize cold-start latency. Use Value: Reduces boot time by >40% compared to standard SPI flash, critical for responsive AI endpoint behavior. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FS256SAGNFM003 | Same die, identical electrical specs and pinout; differs only in marking and packaging logistics (SOIC-16 vs BGA) | Requires PCB redesign for SOIC-16 footprint; lacks BGA thermal performance and density | Select only if legacy SOIC layout reuse is mandatory and thermal constraints permit |
| Winbond W25Q256JWSIQ | 256 Mb, 1.8 V, but uses 4-byte address mode exclusively; no hybrid sector option; ECC requires external SW/FW | Not suitable for XIP or mixed-sector firmware layouts; higher firmware validation burden due to missing hardware ECC | Consider only for cost-sensitive designs where ECC and sector flexibility are non-critical |
Compared with S25FS256SDSBHM203, the Cypress alternative offers identical functionality in alternate packaging, while the Winbond part trades hardware reliability features (ECC, hybrid erase) for lower unit cost and simpler command set-making it viable only where firmware update frequency and data integrity requirements are relaxed.
Availability
S25FS256SDSBHM203 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical imaging boot memory, and edge AI inference accelerator code storage requiring stable component supply, AEC-Q100 qualification, and long-lifecycle support.
Supply support for S25FS256SDSBHM203 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The FS-S Flash family targets high-reliability embedded systems requiring robust firmware storage, hardware-assisted security, and seamless migration from legacy S25FL devices-emphasizing endurance, data retention, and standardized configuration interfaces.
FAQ
Is S25FS256SDSBHM203 pin-compatible with S25FL256S?
Yes, it is footprint-compatible with S25FL256S in the same BGA-24 FAB024 package, sharing identical ball map, voltage levels, and SPI command set. However, FS-S adds DDR Quad I/O, enhanced ASP, and updated SFDP v1.7 parameters not present in FL-series devices.
Does this device support Execute-in-Place (XIP) operation?
Yes, it supports XIP via Continuous Read mode with Burst Wrap addressing, allowing direct CPU instruction fetch from flash without copying to RAM. This requires proper cache coherency handling and is validated for ARM Cortex-M and RISC-V cores with appropriate bus interface timing.
What is the function of the IO3/RESET# pin during normal operation?
During active flash operation, IO3 serves as the fourth I/O line in Quad I/O and DDR Quad I/O modes. When asserted low independently of SPI activity, it triggers asynchronous hardware reset, clearing internal state and returning to standby mode-distinct from SPI Reset Enable commands.
Can the OTP array be reprogrammed after initial programming?
No, the 1024-byte OTP array is permanently programmed once written; each byte can be changed from FFh to any other value only once. Subsequent writes to already-programmed bytes have no effect, ensuring irreversible storage of keys or calibration constants.
S25FS256SDSBHM203 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FS256SDSBHM203 FAQ
1.How can I place an order for S25FS256SDSBHM203 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS256SDSBHM203 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS256SDSBHM203 reliable?
The price and inventory of S25FS256SDSBHM203 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SDSBHM203 is usually 5 days.
3.What payment methods are accepted for S25FS256SDSBHM203?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SDSBHM203 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS256SDSBHM203?
S25FS256SDSBHM203 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS256SDSBHM203 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS256SDSBHM203?
For technical support, including S25FS256SDSBHM203 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SDSBHM203 requirements.
6.How does Aetrix verify that S25FS256SDSBHM203 is sourced from the original manufacturer or authorized distributors?
All S25FS256SDSBHM203 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SDSBHM203 meets industry standards.
7.What is the process for return or replacement of S25FS256SDSBHM203?
All S25FS256SDSBHM203 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SDSBHM203, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS256SDSBHM203 part is unused and in its original packaging.
Return procedure for S25FS256SDSBHM203:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FS256SDSBHM203 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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