Infineon Technologies S25FS256SDSBHV200

Overview

S25FS256SDSBHV200 from Infineon is a 256 Mb (32 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, industrial-plus temperature grade (–40°C to +105°C), and BGA-24 6 × 8 mm package (FAC024 footprint). It supports Quad I/O, DDR Quad I/O read up to 80 MBps, 256-byte/512-byte page programming, hybrid/uniform sector erase, and integrated ECC for single-bit error correction.

For engineers reviewing the S25FS256SDSBHV200 datasheet, S25FS256SDSBHV200 pinout, S25FS256SDSBHV200 application, or S25FS256SDSBHV200 equivalent, key selection criteria include SPI-MIO timing compliance, 1.8 V VCC tolerance, FAC024 BGA mechanical compatibility, SFDP/CFI configuration support, and AEC-Q100 Grade 2 qualification for extended-temperature embedded storage.

Technical Context

This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density NOR flash with deterministic low-latency XIP-capable reads. It supports both standard SPI (modes 0/3) and enhanced Multi-I/O protocols including QPI and DDR Quad I/O, with configurable 24-/32-bit addressing.

The internal hardware ECC engine corrects single-bit errors on-the-fly during read operations, while program/erase suspend-resume functionality enables real-time background operations. Sector protection is implemented via status register bits, OTP array, and password-controlled Advanced Sector Protection (ASP).

Key Specifications

Pinout & Package

Package: BGA-24, 6 × 8 mm body, FAC024 footprint (4 × 6 ball array), Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Compared with S25FS256SDSBHV200, the Cypress alternative offers identical density but omits DDR Quad I/O and BGA packaging, while the Winbond part operates at 3.3 V and lacks hardware ECC-making the Infineon device uniquely suited for high-reliability, low-voltage, BGA-based industrial and automotive designs.

Availability

S25FS256SDSBHV200 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical imaging control units, and avionics display systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 2 qualification.

Supply support for S25FS256SDSBHV200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.

The FS-S Flash family targets high-reliability embedded systems needing fast, secure, and endurance-optimized serial NOR flash with advanced features like DDR I/O, hardware ECC, and ASP-designed specifically for automotive ADAS, industrial automation, and medical electronics.

FAQ

What is the maximum clock frequency supported in DDR Quad I/O mode?

The S25FS256SDSBHV200 supports up to 80 MHz DDR clock frequency in Quad I/O mode, delivering 80 MBps effective read bandwidth. This is specified under AC characteristics section 6.5 of the datasheet, with strict setup/hold timing requirements relative to SCK edges. Operation above this frequency risks data corruption and violates guaranteed timing margins.

Does this device require external ECC circuitry?

No. The S25FS256SDSBHV200 integrates hardware-based ECC that automatically detects and corrects single-bit errors during read operations. No external logic or software overhead is needed. The ECC engine operates transparently and is enabled by default; it covers the entire main memory array and does not extend to the OTP region.

Is the FAC024 BGA package lead-free and RoHS compliant?

Yes. The S25FS256SDSBHV200 in the FAC024 BGA package is fully Pb-free and RoHS-compliant, as confirmed in Section 7.4 of the datasheet and Infineon's material declaration documents. All solder balls use SnAgCu (SAC305) alloy, and the package meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) requirements.

Can this flash be used in XIP (eXecute-In-Place) mode?

Yes. The device supports continuous read mode and burst wrap addressing, enabling true XIP operation from MCU interfaces that support memory-mapped SPI. Verified in Section 4.4 and Table 10-4 of the datasheet, XIP requires QPI or Quad I/O mode with proper address alignment and is validated for Cortex-M and RISC-V cores with appropriate bus bridge configuration.