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Infineon Technologies S25FS256SDSMFI001

Part No.:
S25FS256SDSMFI001
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixS25FS256SDSMFI001.pdf
Description:
IC FLASH 256MBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:416

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Product details

Overview

S25FS256SDSMFI001 from Infineon is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, 1.8 V supply, industrial temperature grade (–40°C to +85°C), and BGA-24 6 × 8 mm package (FAC024 footprint). It supports Quad I/O, DDR Quad I/O read up to 80 MBps, 100,000 program-erase cycles, and hardware ECC for single-bit error correction.

For engineers reviewing the S25FS256SDSMFI001 datasheet, S25FS256SDSMFI001 pinout, S25FS256SDSMFI001 application, or S25FS256SDSMFI001 equivalent, key selection criteria include hybrid/uniform sector erase options, SFDP/CFI configuration support, OTP array size, AEC-Q100 grade compatibility, and DDR vs. SDR timing compliance in embedded boot code storage.

Technical Context

This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with dual-plane read capability and configurable addressing (24-/32-bit). Its SPI-MIO interface supports standard SPI modes 0/3, plus extended command subsets compatible with S25FL-P/S families.

The internal ECC engine operates transparently during read/program, correcting single-bit errors without software intervention. Erase suspend/resume and program suspend/resume enable real-time background operations critical for deterministic firmware update sequences in safety-critical systems.

Key Specifications

ParameterValue and Actual Design Meaning
Density256 Mbit (32 MB) - sufficient for full MCU boot image + parameter storage in industrial controllers
InterfaceSPI Multi-I/O with Quad/DDR Quad support - enables XIP-capable continuous burst reads at 80 MBps
Erase Endurance100,000 cycles minimum - validated for frequent field firmware updates over 10+ year product life
Data Retention20 years minimum at 85°C - ensures long-term reliability in unattended infrastructure equipment
Supply Voltage1.7 V to 2.0 V - optimized for low-power 1.8 V system rails with tight regulation tolerance
Temperature GradeIndustrial (–40°C to +85°C) - qualified for deployment in factory automation and outdoor edge nodes
OTP Size1024 bytes - provides secure storage for cryptographic keys, calibration data, or device-specific identifiers

Pinout & Package

Package: BGA-24, 6 × 8 mm, FAC024 footprint (4 × 6 ball array), Pb-free, known tested die.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable for command/address/data transfer; supports multi-device daisy-chain or parallel configurations
SCKSerial ClockInput clock for SDR (up to 133 MHz) or DDR (up to 80 MHz) operation; phase/polarity configurable per mode 0/3
IO0Serial Input / Data I/O 0Bi-directional data line for standard SPI or first lane in Dual/Quad I/O read/write transfers
IO1Serial Output / Data I/O 1Bi-directional data line; second lane in Dual/Quad I/O; used for SO in legacy SPI mode
IO2Write Protect / Data I/O 2Hardware write protection control or third data lane; enables sector-level lock via status register bit
IO3 / RESET#Reset Input / Data I/O 3Active-low hardware reset or fourth data lane; allows in-system recovery without power cycle
VCCPower Supply1.8 V core supply; decoupling required within 10 mm of pad for stable DDR timing margin
VSSGroundSignal and power ground reference; multiple VSS balls ensure low-impedance return path for high-speed I/O

Key Features

FeatureDesign Value
Hybrid Sector ArchitectureEight 4-KB + one 224-KB physical sectors at top/bottom address space - enables fast boot code access while preserving large contiguous blocks for firmware images
Hardware ECC EngineOn-the-fly single-bit error correction with no CPU overhead - eliminates need for external error-checking logic in mission-critical boot paths
Erase/Program SuspendInterruptible erase and program operations - allows real-time response to host commands without data corruption risk
SFDP & CFI SupportStandardized parameter tables accessible via JEDEC JESD216 - enables automatic driver configuration across heterogeneous host platforms
Advanced Sector ProtectionPassword-controlled individual sector locking - prevents unauthorized read/write to security-critical regions like bootloader or key storage

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing boot firmware and runtime configuration for programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory accessed via XIP-capable Quad I/O interface during cold start and firmware updates.

Use Value: 20-year data retention and 100K erase cycles ensure reliable operation across decades of scheduled maintenance cycles without replacement.

Use Scenario: Holding safety-certified boot code and sensor calibration data in automotive camera or radar ECUs requiring AEC-Q100 Grade 2 qualification.

IC Role / Device Role / Timing Role: Secure, high-reliability flash storage with OTP and ASP for ASIL-B compliant boot integrity verification.

Use Value: Hardware ECC and password-protected sector locking prevent bit-flip-induced corruption and unauthorized firmware tampering.

Edge AI Gateway ConfigurationMedical Imaging System Parameter Store

Use Scenario: Hosting FPGA bitstreams, model weights, and network stack parameters in compact, fanless edge gateways deployed in remote locations.

IC Role / Device Role / Timing Role: High-bandwidth Quad DDR I/O flash enabling rapid FPGA reconfiguration and OTA model updates over constrained cellular links.

Use Value: 80 MBps DDR Quad read speed reduces boot latency by >40% versus legacy SPI NOR, accelerating time-to-service after power-on.

Use Scenario: Storing calibrated imaging parameters, DICOM metadata templates, and regulatory audit logs in FDA-cleared diagnostic ultrasound and MRI systems.

IC Role / Device Role / Timing Role: Tamper-evident, long-life non-volatile memory with 1024-byte OTP for storing cryptographic keys tied to device identity and calibration certificates.

Use Value: Industrial-grade temperature range and 20-year retention meet IEC 62304 software lifecycle requirements for Class C medical devices.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FS256SAGMFI001Same die, identical electrical specs and pinout - rebranded part post-Infineon acquisitionNo functional difference; legacy design-in may retain Cypress branding for documentation continuitySelect when maintaining existing BOM references or sourcing from legacy distributor stock
Winbond W25Q256JWSIQ3.3 V supply, different SFDP layout, no DDR mode, 64-KB uniform sectors onlyLacks DDR performance and hybrid sector flexibility; requires voltage translation in 1.8 V systemsChoose only if 3.3 V rail is available and DDR throughput is not required for boot latency targets

Compared with S25FS256SDSMFI001, the Cypress variant offers identical functionality under Infineon's unified product line, while the Winbond alternative trades DDR speed and flexible erase granularity for broader voltage compatibility and lower cost in less demanding applications.

Availability

S25FS256SDSMFI001 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, edge AI gateways, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for S25FS256SDSMFI001 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.

The FS-S Flash family was designed specifically for high-reliability embedded boot code storage, combining MIRRORBIT™ density efficiency with robust data integrity features for safety-critical firmware execution.

FAQ

Is S25FS256SDSMFI001 pin-compatible with earlier S25FL-S series devices?

Yes - it maintains identical pinout and command set compatibility with S25FL-S devices using the same FAC024 BGA package. This enables drop-in replacement in existing designs without PCB revision, provided the host controller supports SFDP-based initialization and DDR mode configuration.

Does this device support Execute-in-Place (XIP) operation?

Yes - the S25FS256SDSMFI001 supports continuous burst read mode with wrap addressing, enabling true XIP execution directly from flash memory. This eliminates the need to copy boot code to RAM before execution, reducing startup time and SRAM usage in resource-constrained microcontrollers.

What is the function of the IO3/RESET# pin in normal operation?

In normal operation, IO3 serves as the fourth data I/O lane for Quad I/O and DDR Quad I/O transfers. When asserted low, it triggers a hardware reset that clears internal state and returns the device to standby mode - useful for recovering from bus contention or protocol errors without cycling VCC.

How is the 1024-byte OTP array protected against accidental overwrite?

The OTP array is write-protected by default after power-up. Programming requires issuing the Write Enable command followed by the Program OTP command with valid address and data; subsequent writes to programmed locations are blocked permanently, and no erase operation is supported - ensuring irreversible, tamper-resistant storage of keys or identifiers.

S25FS256SDSMFI001 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FS-S
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
80 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

S25FS256SDSMFI001 FAQ

1.How can I place an order for S25FS256SDSMFI001 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FS256SDSMFI001 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FS256SDSMFI001 reliable?

The price and inventory of S25FS256SDSMFI001 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SDSMFI001 is usually 5 days.

3.What payment methods are accepted for S25FS256SDSMFI001?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SDSMFI001 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FS256SDSMFI001?

S25FS256SDSMFI001 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FS256SDSMFI001 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FS256SDSMFI001?

For technical support, including S25FS256SDSMFI001 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SDSMFI001 requirements.

6.How does Aetrix verify that S25FS256SDSMFI001 is sourced from the original manufacturer or authorized distributors?

All S25FS256SDSMFI001 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SDSMFI001 meets industry standards.

7.What is the process for return or replacement of S25FS256SDSMFI001?

All S25FS256SDSMFI001 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SDSMFI001, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FS256SDSMFI001 part is unused and in its original packaging.

Return procedure for S25FS256SDSMFI001:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S25FS256SDSMFI001 Tags

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