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Infineon Technologies S25FS256SDSMFI003
- Part No.:
- S25FS256SDSMFI003
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FS256SDSMFI003.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,232
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Product details
Overview
S25FS256SDSMFI003 from Infineon is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, 1.8 V supply, and industrial temperature grade (–40°C to +85°C). It supports Quad I/O, DDR Quad I/O, SFDP/CFI configuration, hardware ECC, and hybrid/uniform sector erase options. Used in boot code storage for embedded microcontrollers requiring fast XIP-capable read performance.
For engineers reviewing the S25FS256SDSMFI003 datasheet, S25FS256SDSMFI003 pinout, S25FS256SDSMFI003 application, or S25FS256SDSMFI003 equivalent, key selection criteria include 133 MHz Fast Read speed (66 MBps Quad), 100,000 program-erase cycles, OTP security, AEC-Q100 Grade 3 qualification, and BGA-24 FAB024 package compatibility.
Technical Context
This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density NOR flash with deterministic latency and robust data retention. It supports both SDR and DDR SPI modes, with configurable 24-/32-bit addressing and full command subset compatibility with legacy S25FL-P/S families.
The flash integrates dual-sector protection schemes: status register-based block protection and password-controlled Advanced Sector Protection (ASP), plus a 1024-byte one-time programmable (OTP) array for secure boot keys or calibration data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mbit (32 MB) - sufficient for full firmware images and parameter tables in resource-constrained edge devices |
| Supply Voltage | 1.7 V to 2.0 V - optimized for low-power 1.8 V system rails with tight regulation tolerance |
| Read Speed | 66 MBps (Quad I/O @ 133 MHz) - enables efficient execute-in-place (XIP) execution without external RAM buffering |
| Erase Endurance | 100,000 cycles minimum - supports field-upgradable firmware with frequent OTA update cycles |
| Data Retention | 20 years minimum at 85°C - ensures long-term reliability in unattended industrial deployments |
| Temperature Range | –40°C to +85°C (Industrial Grade) - validated for operation in extended ambient environments without derating |
| Package | BGA-24, 6 × 8 mm, FAB024 footprint (5 × 5 ball array) - compact, solder-reflow compatible for high-density PCB layouts |
Pinout & Package
Package: BGA-24, 6 × 8 mm, FAB024 footprint (5 × 5 ball array), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Power Supply | 1.8 V core supply input; decoupling required within 5 mm of ball for stable DDR timing |
| VSS | Ground | Signal and power return path; must be connected to solid ground plane for noise immunity |
| CS# | Chip Select | Active-low enable for command/address/data transfer; supports daisy-chain configuration |
| SCK | Serial Clock | Input clock for SDR/DDR modes; max 133 MHz (SDR), 80 MHz (DDR); phase/polarity modes 0/3 supported |
| IO0 | Serial Input / Data I/O 0 | Bi-directional pin for command/address input and data output in single/dual/quad modes |
| IO1 | Serial Output / Data I/O 1 | Bi-directional pin supporting dual/quad I/O reads and writes; used for SO in legacy SPI mode |
| IO2 | Write Protect / Data I/O 2 | Hardware WP# control or quad I/O lane; configurable via status register for flexible protection schemes |
| IO3 | Reset / Data I/O 3 | Active-low reset input or fourth quad I/O lane; enables hardware reset without host processor intervention |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction with no software overhead or latency penalty during read operations |
| Hybrid Sector Erase | Mixed 4-KB/32-KB/64-KB physical sectors allow fine-grained updates while preserving large contiguous blocks for firmware binaries |
| Advanced Sector Protection (ASP) | Password-protected per-sector locking prevents unauthorized firmware modification or readout of sensitive boot code |
| SFDP & CFI Support | Standardized parameter tables enable automatic host driver configuration without hard-coded timing or command assumptions |
| Deep Power-Down Mode | 6 µA typical current draw extends battery life in always-on IoT nodes during standby periods |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing real-time control firmware and configuration parameters in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary boot memory mapped for XIP execution; provides deterministic <100 ns access latency on Quad I/O burst reads. Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity across 15+ year equipment lifecycles without field replacement. | Use Scenario: Holding boot code and safety-critical sensor calibration data in front-camera modules compliant with ISO 26262 ASIL-B requirements. IC Role / Device Role / Timing Role: Secure boot memory with OTP and ASP; AEC-Q100 Grade 3 qualification validates operation under automotive thermal cycling. Use Value: Password-locked sector protection prevents tampering with camera initialization routines during vehicle service or diagnostics. |
| Medical Imaging Device Configuration | Edge AI Gateway Firmware |
Use Scenario: Storing DICOM protocol stacks and device-specific calibration profiles in portable ultrasound systems requiring FDA 510(k) traceability. IC Role / Device Role / Timing Role: Nonvolatile configuration store with 1024-byte OTP array for immutable regulatory metadata and serial number binding. Use Value: Hardware write protection and SFDP-defined timing parameters simplify IEC 62304-compliant firmware validation and revision control. | Use Scenario: Hosting Linux kernel, device tree, and inference model weights in fanless industrial gateways running Yocto-based OS images. IC Role / Device Role / Timing Role: High-bandwidth Quad DDR interface delivers 80 MBps sustained read throughput for rapid boot and model loading. Use Value: Uniform 256-KB erase blocks align with Yocto image partitioning, reducing wear leveling complexity in OTA update workflows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FS256SAGMFV003 | Same die, identical electrical specs and pinout; rebranded part post-Infineon acquisition | No functional difference; identical qualification and lifecycle status | Select when sourcing from legacy Cypress-distributed inventory or dual-sourcing programs |
| Winbond W25Q256JWSIQ | 256 Mb, 3.3 V supply, different SFDP layout, no DDR support, lower endurance (100K vs 100K same) | Lacks DDR Quad I/O and ASP; requires voltage translation in 1.8 V systems | Choose only if 3.3 V rail is available and DDR/XIP performance is not required |
Compared with S25FS256SDSMFI003, the Cypress rebrand offers identical functionality and supply chain continuity, while the Winbond alternative trades DDR performance and 1.8 V native operation for broader distributor availability at the cost of design flexibility in low-voltage systems.
Availability
S25FS256SDSMFI003 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, medical imaging systems, and edge AI gateways requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified flash memory.
Supply support for S25FS256SDSMFI003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.
The FS-S Flash family targets high-reliability embedded systems needing deterministic boot performance, secure firmware storage, and extended temperature operation - with emphasis on AEC-Q100 compliance and seamless migration from legacy S25FL series.
FAQ
Is S25FS256SDSMFI003 pin-compatible with earlier S25FL-S devices?
Yes, it maintains identical pinout and command set compatibility with S25FL-P and S25FL-S families, including SOIC-16 and BGA-24 footprints. The FAB024 BGA variant matches S25FL256SAGMFV003 mechanically and electrically, enabling drop-in replacement without PCB redesign.
Does this device support Execute-in-Place (XIP) mode?
Yes, it supports continuous read mode with wrap-around burst for true XIP operation. Quad I/O and DDR Quad I/O commands deliver up to 80 MBps bandwidth, allowing direct CPU instruction fetch from flash without copying to RAM - verified across ARM Cortex-M7 and RISC-V cores.
What security mechanisms prevent unauthorized firmware access?
It provides three layers: hardware write protect (WP#), status register-based block protection, and Advanced Sector Protection (ASP) with password-locked sector read/write control. The 1024-byte OTP array stores cryptographic keys or device-unique identifiers that cannot be erased or rewritten.
Can S25FS256SDSMFI003 operate in deep power-down mode during system sleep?
Yes, deep power-down mode reduces current to 6 µA typical, with wake-up time of ≤100 µs. This mode retains all memory contents and register states, making it ideal for battery-powered edge sensors requiring sub-10 µA system sleep current budgets.
S25FS256SDSMFI003 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FS256SDSMFI003 FAQ
1.How can I place an order for S25FS256SDSMFI003 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS256SDSMFI003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS256SDSMFI003 reliable?
The price and inventory of S25FS256SDSMFI003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SDSMFI003 is usually 5 days.
3.What payment methods are accepted for S25FS256SDSMFI003?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SDSMFI003 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS256SDSMFI003?
S25FS256SDSMFI003 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS256SDSMFI003 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS256SDSMFI003?
For technical support, including S25FS256SDSMFI003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SDSMFI003 requirements.
6.How does Aetrix verify that S25FS256SDSMFI003 is sourced from the original manufacturer or authorized distributors?
All S25FS256SDSMFI003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SDSMFI003 meets industry standards.
7.What is the process for return or replacement of S25FS256SDSMFI003?
All S25FS256SDSMFI003 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SDSMFI003, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS256SDSMFI003 part is unused and in its original packaging.
Return procedure for S25FS256SDSMFI003:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FS256SDSMFI003 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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