My Inquiry
My Account
Infineon Technologies S25FS512SAGMFB010
- Part No.:
- S25FS512SAGMFB010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FS512SAGMFB010.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,529
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FS512SAGMFB010 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, operating at 1.8 V supply. It implements MIRRORBIT™ Eclipse architecture, supports DDR Quad I/O read up to 80 MBps, features hardware ECC for single-bit correction, and offers hybrid/ uniform sector erase options for embedded firmware storage in industrial and automotive systems.
For engineers reviewing the S25FS512SAGMFB010 datasheet, S25FS512SAGMFB010 pinout, S25FS512SAGMFB010 application, or S25FS512SAGMFB010 equivalent, key selection criteria include 1.7–2.0 V supply range, AEC-Q100 Grade 1 (–40°C to +125°C) qualification, SOIC-16/WSON-8/BGA-24 package compatibility, SFDP/CFI support, and OTP array for secure boot configuration.
Technical Context
This device belongs to Infineon's FS-S Flash family, designed for high-reliability code execution-in-place (XIP) and firmware storage in safety-critical environments. It supports both legacy SPI and Quad Peripheral Interface (QPI) modes, with configurable 24-/32-bit addressing and burst wrap read capability.
The internal architecture integrates SRAM latches, X/Y decoders, and dedicated control logic for simultaneous command decode and data path management. ECC operates transparently during read, while program/erase suspend-resume enables real-time system responsiveness during background operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full MCU boot image + OTA update partition in automotive ECUs |
| Interface | SPI Multi-I/O with DDR Quad I/O - enables 80 MBps read throughput for low-latency XIP execution |
| Supply Voltage | 1.7 V to 2.0 V - matches low-voltage I/O domains of modern microcontrollers and SoCs |
| Data Retention | 20 years minimum - ensures firmware integrity over full vehicle lifecycle without refresh |
| Endurance | 100,000 program-erase cycles - supports frequent field updates in telematics and ADAS modules |
| ECC | Internal hardware single-bit error correction - eliminates need for external error-handling logic in safety systems |
| Temperature Range | –40°C to +125°C (AEC-Q100 Grade 1) - qualified for engine bay and powertrain control applications |
Pinout & Package
Package: 16-lead SOIC 300 mil (SO3016), Pb-free, industrial and automotive qualified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; must be held low during entire instruction cycle |
| SCK | Serial Clock | Input clock for SDR/DDR operation; supports up to 133 MHz for Quad Read and 80 MHz for DDR Quad I/O |
| IO0 (SI) | Serial Input / Data Line 0 | Primary input for commands and addresses in single/dual/quad modes; bidirectional in MIO configurations |
| IO1 (SO) | Serial Output / Data Line 1 | Primary output for read data; functions as IO1 in dual/quad modes; supports dummy cycle insertion |
| IO2 (WP#) | Write Protect / Data Line 2 | Hardware write protection when asserted low; also serves as quad-mode data line IO2 |
| IO3 (RESET#) | Reset / Data Line 3 | Hardware reset input; doubles as IO3 in quad mode; enables warm reset without power cycle |
| VCC | Power Supply | 1.7–2.0 V core supply; requires local 1 µF ceramic decoupling per datasheet layout guidelines |
| VSS | Ground | Signal and supply reference; separate VSS pins in BGA/SOIC ensure noise immunity for timing-critical reads |
Key Features
| Feature | Design Value |
|---|---|
| DDR Quad I/O Read | 80 MBps throughput - reduces firmware load time by >2× vs standard Quad I/O, critical for fast boot sequences |
| Hybrid Sector Erase | Eight 4-KB + one 224-KB sectors at top/bottom - enables fine-grained update of boot code while preserving large application partitions |
| OTP Array | 1024-byte one-time-programmable space - stores immutable root-of-trust keys and cryptographic certificates |
| Advanced Sector Protection | Password- or boot-code-controlled individual sector lock - prevents unauthorized firmware modification in certified ECU designs |
| SFDP & CFI Support | Standardized parameter tables accessible via SPI - enables automatic driver initialization without hard-coded timing constants |
Applications
| Automotive Powertrain Control | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine control maps and real-time diagnostic routines in diesel ECU units. IC Role / Device Role / Timing Role: Nonvolatile code storage with XIP-capable Quad DDR read for sub-50 µs instruction fetch latency. Use Value: AEC-Q100 Grade 1 qualification and 20-year retention ensure compliance with ISO 26262 ASIL-B functional safety requirements. | Use Scenario: Holding firmware images and configuration data for modular programmable logic controllers in factory automation. IC Role / Device Role / Timing Role: High-endurance flash for field-upgradable logic programs with suspend/resume during runtime I/O scanning. Use Value: 100,000 program-erase cycles and hardware ECC allow daily firmware revisions over 27-year operational life. |
| Medical Imaging Boot Memory | Avionics Display System Storage |
Use Scenario: Secure boot loader and calibration data storage in MRI and CT scanner mainboards. IC Role / Device Role / Timing Role: OTP-protected root key storage and sector-locked firmware partitions for FDA 510(k) traceability. Use Value: Password-enabled Advanced Sector Protection prevents accidental or malicious overwrite of regulatory-critical binaries. | Use Scenario: Storing display firmware, font assets, and flight-critical UI logic in cockpit multifunction displays. IC Role / Device Role / Timing Role: Radiation-tolerant 65-nm MIRRORBIT™ array with deep power-down mode for DO-254 compliance. Use Value: 6 µA deep power-down current extends battery-backed operation during aircraft ground maintenance windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGMFI10 | Same die, identical pinout and timing; differs only in temperature grade marking (–40°C to +85°C industrial vs +125°C automotive) | Lacks AEC-Q100 Grade 1 qualification; unsuitable for under-hood deployment | Select when operating ambient stays below +85°C and automotive certification is not required |
| Winbond W25Q512JWIM (1.8 V variant) | No DDR support; max Quad Read at 133 MHz = 66 MBps; no built-in ECC; uses different SFDP structure | Requires external ECC logic and custom driver tuning; lower reliability in extended-temp environments | Choose for cost-sensitive industrial designs where DDR and hardware ECC are noncritical |
Compared with S25FL512SAGMFI10 and W25Q512JWIM, the S25FS512SAGMFB010 uniquely delivers AEC-Q100 Grade 1 operation, DDR Quad I/O bandwidth, and integrated ECC-making it the only option qualified for ASIL-B powertrain and avionics boot memory without external error mitigation.
Availability
S25FS512SAGMFB010 is available at Aetrix Electronics and suitable for automotive powertrain control, industrial PLC firmware storage, and medical imaging boot memory requiring stable component supply across long product lifecycles.
Supply support for S25FS512SAGMFB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The FS-S Flash product line targets high-reliability embedded systems requiring secure, fast, and long-life nonvolatile storage-specifically engineered for AEC-Q100-compliant automotive ECUs and industrial controllers demanding 20-year data retention.
FAQ
Is S25FS512SAGMFB010 pin-compatible with earlier S25FL-S family devices?
Yes, it maintains footprint and signal compatibility with S25FL-P and S25FL-S families, including identical SOIC-16, WSON-8, and BGA-24 packages. Command sets and register maps are backward-compatible, enabling drop-in replacement in existing PCB layouts without redesign.
Does this device support Execute-in-Place (XIP) operation?
Yes, it supports continuous read mode with burst wrap for true XIP execution. The device delivers deterministic latency and sustained bandwidth up to 80 MBps in DDR Quad I/O mode, allowing microcontrollers to execute code directly from flash without RAM loading.
What security mechanisms are implemented beyond OTP and sector protection?
In addition to the 1024-byte OTP array and Advanced Sector Protection, the device includes hardware-based write protection via WP# pin, status register lock bits, and password-protected read access control. No software-based encryption engines or TRNG are integrated.
Can S25FS512SAGMFB010 operate at 3.3 V?
No. It is strictly a 1.8 V core device with absolute maximum VCC of 2.0 V. Operation outside 1.7–2.0 V violates electrical specifications and may cause data corruption or premature wear. Level-shifting is required for interfacing with 3.3 V host controllers.
S25FS512SAGMFB010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 2ms
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FS512SAGMFB010 FAQ
1.How can I place an order for S25FS512SAGMFB010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS512SAGMFB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS512SAGMFB010 reliable?
The price and inventory of S25FS512SAGMFB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS512SAGMFB010 is usually 5 days.
3.What payment methods are accepted for S25FS512SAGMFB010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS512SAGMFB010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS512SAGMFB010?
S25FS512SAGMFB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS512SAGMFB010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS512SAGMFB010?
For technical support, including S25FS512SAGMFB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS512SAGMFB010 requirements.
6.How does Aetrix verify that S25FS512SAGMFB010 is sourced from the original manufacturer or authorized distributors?
All S25FS512SAGMFB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS512SAGMFB010 meets industry standards.
7.What is the process for return or replacement of S25FS512SAGMFB010?
All S25FS512SAGMFB010 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS512SAGMFB010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS512SAGMFB010 part is unused and in its original packaging.
Return procedure for S25FS512SAGMFB010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FS512SAGMFB010 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
