Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S25FS512SAGNFA010

Part No.:
S25FS512SAGNFA010
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixS25FS512SAGNFA010.pdf
Description:
IC FLASH 512MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,580

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S25FS512SAGNFA010 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, operating at 1.8 V supply. It supports DDR Quad I/O read up to 80 MBps, features hardware ECC for single-bit error correction, 100,000 program-erase cycles, and offers hybrid/uniform sector erase options in industrial (-40°C to +85°C) and automotive AEC-Q100 grade 2 (-40°C to +105°C) temperature ranges.

For engineers reviewing the S25FS512SAGNFA010 datasheet, S25FS512SAGNFA010 pinout, S25FS512SAGNFA010 application, or S25FS512SAGNFA010 equivalent, this device delivers high-speed XIP-capable read performance, configurable protection via OTP and ASP, and footprint compatibility with prior S25FL-P/S SPI flash families in SOIC, WSON, and BGA packages.

Technical Context

This SPI Multi-I/O flash implements Eclipse architecture with 65-nm MIRRORBIT™ technology, supporting both legacy SPI and QPI command sets. Its dual-mode addressing (24-/32-bit) and SFDP/CFI interfaces enable automatic configuration discovery and flexible memory mapping in boot-critical systems.

The device integrates dedicated control logic for erase suspend/resume, program suspend/resume, and real-time ECC correction during read operations. Its IO0–IO3 pins support configurable roles across SDR/DDR, single/dual/quad I/O modes, and hardware reset via IO3/RESET#.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mb (64 MB) - sufficient for full firmware images and parameter storage in automotive ECUs and industrial controllers
InterfaceSPI Multi-I/O with DDR Quad I/O - enables 80 MBps read throughput for XIP execution without external buffering
Erase Endurance100,000 program-erase cycles - supports frequent field firmware updates in connected devices
Data Retention20 years minimum - ensures long-term reliability in unattended infrastructure equipment
Supply Voltage1.7 V to 2.0 V - compatible with low-voltage SoC I/O domains and reduces system power consumption
Temperature RangeIndustrial plus (-40°C to +105°C) - qualified for under-hood automotive and high-ambient industrial environments
ECC SupportInternal hardware single-bit error correction - eliminates need for software ECC overhead in safety-critical boot code paths

Pinout & Package

Package: 16-lead SOIC 300 mil (SO3016), Pb-free, industrial-plus temperature grade.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable for SPI command latching; must be held low during entire instruction cycle
SCKSerial ClockProvides timing reference for all SPI transfers; supports modes 0 and 3, DDR toggling on both edges
IO0 / SISerial Input / Data I/O 0Primary data input in SDR mode; bidirectional in multi-I/O modes; used for command/address/data transfer
IO1 / SOSerial Output / Data I/O 1Primary data output in SDR mode; bidirectional in multi-I/O modes; supports quad read burst wrap
IO2 / WP#Write Protect / Data I/O 2Hardware write protection when asserted low; also functions as quad I/O data line in multi-I/O commands
IO3 / RESET#Reset / Data I/O 3Hardware warm reset trigger; also serves as fourth I/O line in quad/DDR quad modes
VCCPower Supply1.7–2.0 V core supply; decoupling required within 10 mm of pin per datasheet layout guidelines
VSSGroundSignal and power return path; separate ground plane recommended for noise-sensitive applications

Key Features

FeatureDesign Value
DDR Quad I/O Read80 MBps throughput - enables zero-wait-state XIP execution from flash in microcontroller-based systems
Hybrid Sector EraseEight 4-KB sectors + one 224-KB sector at top/bottom - supports secure boot code partitioning with fast small-sector updates
Advanced Sector ProtectionPassword-controlled individual sector lock - prevents unauthorized firmware modification in certified automotive modules
OTP Array1024-byte one-time-programmable space - stores cryptographic keys or calibration data irreversibly
SFDP/CFI SupportStandardized parameter tables - allows automatic driver initialization without hard-coded timing or configuration values

Applications

Automotive Powertrain ECUIndustrial PLC Firmware Storage

Use Scenario: Storing calibrated engine control maps and diagnostic firmware in AEC-Q100 grade 2 ECUs.

IC Role / Device Role / Timing Role: Primary nonvolatile boot and application code storage with hardware reset coordination and ECC-protected reads.

Use Value: 20-year data retention and 100K endurance ensure reliable operation over vehicle lifetime without field recalls.

Use Scenario: Holding ladder logic programs and I/O configuration in DIN-rail mounted programmable logic controllers.

IC Role / Device Role / Timing Role: High-reliability firmware repository supporting remote updates via industrial Ethernet gateways.

Use Value: Hybrid sector architecture allows atomic update of critical control routines while preserving configuration data in protected 4-KB sectors.

Medical Imaging Boot MemorySmart Grid RTU Configuration

Use Scenario: Secure boot loader storage in FDA-cleared MRI subsystems requiring traceable firmware integrity.

IC Role / Device Role / Timing Role: Trusted boot source with OTP-stored root keys and ASP-enforced read/write access controls.

Use Value: Password-locked sector protection prevents tampering with safety-critical startup sequences during service interventions.

Use Scenario: Storing time-synchronized communication stacks and metering calibration in outdoor-rated remote terminal units.

IC Role / Device Role / Timing Role: Temperature-resilient nonvolatile storage supporting -40°C to +105°C ambient operation without derating.

Use Value: Industrial-plus grade qualification eliminates thermal margin concerns in sun-exposed utility enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S25FS256SAGNFA010256 Mb density, identical pinout and command setLimited to smaller firmware images; lower cost where memory headroom is constrainedSelect when application firmware fits within 32 MB and BOM cost sensitivity outweighs future scalability needs
MX25L51245GZC-10G512 Mb, 3.3 V supply, no DDR mode, no ASP or OTP arrayRequires level-shifting for 1.8 V SoCs; lacks password-protected sector lockingChoose only for legacy 3.3 V designs where security and advanced erase flexibility are not required

Compared with S25FS256SAGNFA010, the S25FS512SAGNFA010 doubles capacity without changing footprint or timing; versus MX25L51245GZC-10G, it adds 1.8 V operation, DDR bandwidth, and hardware security features essential for modern automotive and industrial deployments.

Availability

S25FS512SAGNFA010 is available at Aetrix Electronics and suitable for automotive powertrain ECUs, industrial PLCs, medical imaging subsystems, and smart grid RTUs requiring stable component supply across extended product lifecycles.

Supply support for S25FS512SAGNFA010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and connectivity solutions for automotive, industrial, and IoT markets.

The S25FS-S family targets high-reliability embedded systems requiring secure, high-speed, long-life nonvolatile memory with automotive qualification and advanced data protection features.

FAQ

What package type does S25FS512SAGNFA010 use?

S25FS512SAGNFA010 uses a 16-lead SOIC 300 mil (SO3016) package with Pb-free finish. This package is pin-compatible with other S25FS-S and S25FL-S family members and supports reflow soldering per JEDEC J-STD-020 standards.

Does this device support execute-in-place (XIP) operation?

Yes, S25FS512SAGNFA010 supports continuous read mode for XIP execution. It delivers sustained read throughput up to 80 MBps in DDR Quad I/O mode, enabling zero-wait-state code execution directly from flash in compatible microcontrollers.

How is hardware write protection implemented?

Hardware write protection is implemented via the WP#/IO2 pin: when driven low, it disables all program and erase commands to protected sectors. Protection granularity is controlled by status register bits and can be combined with Advanced Sector Protection for password-locked individual sectors.

Is SFDP supported, and what version?

Yes, S25FS512SAGNFA010 supports Serial Flash Discoverable Parameters (SFDP) version 1.6. The SFDP table provides standardized timing, erase, and configuration parameters, enabling automatic driver initialization without hardcoded values.

S25FS512SAGNFA010 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FS-S
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
2ms
Access Time:
-
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (6x8)

S25FS512SAGNFA010 FAQ

1.How can I place an order for S25FS512SAGNFA010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FS512SAGNFA010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FS512SAGNFA010 reliable?

The price and inventory of S25FS512SAGNFA010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS512SAGNFA010 is usually 5 days.

3.What payment methods are accepted for S25FS512SAGNFA010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS512SAGNFA010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FS512SAGNFA010?

S25FS512SAGNFA010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FS512SAGNFA010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FS512SAGNFA010?

For technical support, including S25FS512SAGNFA010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS512SAGNFA010 requirements.

6.How does Aetrix verify that S25FS512SAGNFA010 is sourced from the original manufacturer or authorized distributors?

All S25FS512SAGNFA010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS512SAGNFA010 meets industry standards.

7.What is the process for return or replacement of S25FS512SAGNFA010?

All S25FS512SAGNFA010 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS512SAGNFA010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FS512SAGNFA010 part is unused and in its original packaging.

Return procedure for S25FS512SAGNFA010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S25FS512SAGNFA010 Tags

  • S25FS512SAGNFA010
  • S25FS512SAGNFA010 PDF
  • S25FS512SAGNFA010 Datasheet
  • S25FS512SAGNFA010 Specifications
  • S25FS512SAGNFA010 Images
  • Infineon Technologies
  • Infineon Technologies S25FS512SAGNFA010
  • Buy S25FS512SAGNFA010
  • S25FS512SAGNFA010 Price
  • S25FS512SAGNFA010 Distributor
  • S25FS512SAGNFA010 Supplier
  • S25FS512SAGNFA010 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER