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Infineon Technologies S25FS512SAGNFA013

Name: S25FS512SAGNFA013
Brand: Infineon Technologies
SKU: S25FS512SAGNFA013
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S25FS512SAGNFA013

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 8-WDFN Exposed Pad

Datasheet:: S25FS512SAGNFA013.pdf

Description:: IC FLASH 512MBIT SPI/QUAD 8WSON

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Product details

Overview

S25FS512SAGNFA013 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, operating at 1.8 V supply. It supports DDR Quad I/O read up to 80 MBps, features hardware ECC for single-bit error correction, 100,000 program-erase cycles, and AEC-Q100 Grade 2 automotive qualification (−40°C to +105°C). Used in automotive ADAS boot code storage and industrial firmware update modules.

For engineers reviewing the S25FS512SAGNFA013 datasheet, S25FS512SAGNFA013 pinout, S25FS512SAGNFA013 application, or S25FS512SAGNFA013 equivalent, key selection criteria include SPI-MIO timing compliance, hybrid/uniform sector erase flexibility, OTP array size, SFDP/CFI configuration support, and deep power-down current (6 µA).

Technical Context

This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with dual-bank SRAM buffer and dedicated X/Y decoders for concurrent read-while-write operation. It supports both legacy SPI and QPI command sets, with configurable 24-/32-bit addressing and burst wrap or continuous XIP modes.

The control logic integrates automatic ECC encoding/decoding on all program/erase paths, plus programmable block protection via status register bits and advanced sector protection (ASP) with password-controlled read access. Reset behavior is defined by IO3/RESET# pin state during power-up or warm reset sequences.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	512 Mb (64 MB) - sufficient for full firmware images including bootloader, OS kernel, and application binaries in automotive ECUs.
Interface	SPI Multi-I/O with DDR Quad I/O - enables 80 MBps read throughput using double-data-rate on four I/O lines.
Erase Architecture	Hybrid sector option: eight 4-KB + one 224-KB sectors at top/bottom; uniform option: all 256-KB blocks - supports fine-grained OTA update partitioning.
Data Retention	20 years minimum - validated under industrial and automotive temperature stress profiles per JEDEC JESD22-A117.
Endurance	100,000 program-erase cycles - specified across full temperature range, enabling frequent field firmware updates.
Supply Voltage	1.7 V to 2.0 V - compatible with low-voltage SoC I/O domains and reduces system-level power delivery complexity.
Temperature Grade	AEC-Q100 Grade 2 (−40°C to +105°C) - qualified for under-hood automotive applications without derating.

Pinout & Package

Package: 16-lead SOIC 300 mil (SO3016), Pb-free, industrial and automotive qualified.

Pin/Terminal	Circuit Role	Design Meaning
CS#	Chip Select	Active-low enable for command/address/data transfer; must be held stable during DDR or QPI mode transitions.
SCK	Serial Clock	Input clock for SPI timing; supports modes 0 and 3; DDR operation requires precise duty-cycle control per datasheet Figure 6.1.
IO0 / SI	Serial Input / Data I/O 0	Primary data input in standard SPI; bidirectional in Dual/Quad I/O modes; used for command/address loading.
IO1 / SO	Serial Output / Data I/O 1	Primary data output in standard SPI; bidirectional in Dual/Quad I/O modes; carries read data and status responses.
IO2 / WP#	Write Protect / Data I/O 2	Hardware write protection when pulled low; functions as Quad I/O line when WP# disabled via status register.
IO3 / RESET#	Reset / Data I/O 3	Hardware reset input; also serves as fourth I/O line in Quad/DDR Quad modes; internal pull-up ensures safe reset on power-up.
VCC	Power Supply	1.7–2.0 V core supply; decoupling capacitor (≥1 µF ceramic) required within 5 mm of pin per layout guidelines.
VSS	Ground	Signal and power ground reference; separate analog/digital ground not required due to integrated noise suppression design.

Key Features

Feature	Design Value
Hardware ECC	On-the-fly single-bit error correction with no software overhead; ECC metadata stored in spare bytes, transparent to host controller.
OTP Array	1024-byte one-time-programmable area for secure keys or calibration data; programmed via dedicated unlock-and-write sequence.
ASP Protection	Password-controlled sector locking and optional read-access restriction - prevents unauthorized firmware extraction or modification.
Erase Flexibility	Configurable hybrid or uniform sector map - allows mixing small sectors for parameter storage and large sectors for firmware binaries.
Deep Power Down	6 µA typical current draw - enables ultra-low-power retention during vehicle sleep modes without external power gating.

Applications

Automotive ADAS ECU Boot Storage

Industrial PLC Firmware Update Module

Use Scenario: Stores boot ROM and safety-critical firmware for radar processing units requiring ASIL-B compliance.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory accessed via XIP-capable SPI controller during cold start; supports fast Quad Read for deterministic boot latency.

Use Value: 20-year data retention and AEC-Q100 Grade 2 rating ensure reliability over vehicle lifetime; hybrid sector erase enables atomic firmware patching without full image reflash.

Use Scenario: Holds field-upgradable firmware images and configuration parameters in modular automation controllers.

IC Role / Device Role / Timing Role: Secondary firmware repository accessed over isolated SPI bus; uses SFDP to auto-negotiate timing parameters with host MCU.

Use Value: 100,000 endurance cycles allow daily firmware validation in test environments; OTP array secures vendor-specific calibration offsets.

Medical Imaging System Configuration Memory

Avionics Display Unit Boot Loader

Use Scenario: Stores calibrated sensor profiles and UI assets for portable ultrasound devices subject to IEC 62304 Class C software requirements.

IC Role / Device Role / Timing Role: Nonvolatile configuration store accessed during power-on initialization; leverages ECC to prevent silent corruption of critical calibration tables.

Use Value: Hardware ECC eliminates need for host-side CRC checks on every read; deep power-down mode extends battery life between clinical sessions.

Use Scenario: Hosts certified boot loader and DO-178C Level A flight-critical code in cockpit display systems.

IC Role / Device Role / Timing Role: Secure boot memory with ASP-enabled password protection; verified via hardware reset vector fetch and status register lock.

Use Value: Password-controlled read access prevents unauthorized firmware inspection; uniform 256-KB erase blocks simplify DO-178C verification traceability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Cypress S25FL512SAGNFA010	Same die, identical pinout and timing; differs only in date code and minor wafer lot binning - fully interchangeable.	No functional difference; same AEC-Q100 Grade 2 qualification and automotive lifecycle support.	Select when sourcing from legacy Cypress channel inventory; identical electrical and thermal behavior.
Winbond W25Q512JWQI	512 Mb, 1.8 V, but uses different ECC implementation (software-assisted), no ASP, and lacks DDR Quad I/O mode.	Not suitable for XIP-critical ADAS boot; limited to non-safety firmware storage where ECC coverage is host-managed.	Consider only for cost-sensitive industrial designs without automotive qualification or high-speed read requirements.

Compared with S25FS512SAGNFA013, the Cypress alternative offers drop-in compatibility and identical performance, while the Winbond part trades DDR throughput and hardware security features for lower unit cost in non-automotive contexts.

Availability

S25FS512SAGNFA013 is available at Aetrix Electronics and suitable for automotive ADAS systems, industrial PLC firmware updates, medical imaging configuration storage, and avionics display boot loaders requiring stable component supply across extended product lifecycles.

Supply support for S25FS512SAGNFA013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and trusted memory solutions, with global R&D and manufacturing infrastructure.

The S25FS-S family targets high-reliability embedded systems requiring AEC-Q100 qualification, hardware-based security, and deterministic SPI-MIO performance for boot and firmware storage.

FAQ

Does S25FS512SAGNFA013 support Quad Peripheral Interface (QPI) mode?

Yes, it supports QPI mode with 4-line command/address/data transfer, enabling higher bandwidth than standard SPI. QPI entry is triggered by a specific 0x35 command followed by a 0x00 dummy byte, and requires prior configuration of the volatile status register. All timing parameters for QPI are specified in Section 6.3 of the datasheet.

What is the function of the IO3/RESET# pin during normal operation?

During active operation, IO3/RESET# serves as the fourth I/O line (IO3) in Quad and DDR Quad I/O modes. Its reset functionality is disabled unless the pin is actively driven low while CS# is high, initiating a hardware warm reset. Internal pull-up ensures default reset deassertion during power-up.

How is the hybrid sector erase option configured?

The hybrid sector option is fixed at wafer fabrication and cannot be changed in-system. The physical layout - eight 4-KB sectors plus one 224-KB sector at top or bottom - is determined by the die mask. Uniform sector mapping is selected via status register bit SR[2], but only if the device was manufactured with uniform option enabled.

Can the OTP array be erased or rewritten after programming?

No, the 1024-byte OTP array is permanently programmed using Fowler-Nordheim tunneling and cannot be erased or rewritten. Programming requires a two-step unlock sequence (0x65 followed by 0x66) and is verified by reading back the target address; once committed, bits can only transition from '1' to '0'.

S25FS512SAGNFA013 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: FS-S

Package/Case:: 8-WDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 64M x 8

Memory Interface:: SPI - Quad I/O, QPI

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: 2ms

Access Time:: -

Voltage - Supply:: 1.7V ~ 2V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 8-WSON (6x8)

S25FS512SAGNFA013 FAQ

1.How can I place an order for S25FS512SAGNFA013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FS512SAGNFA013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FS512SAGNFA013 reliable?

The price and inventory of S25FS512SAGNFA013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS512SAGNFA013 is usually 5 days.

3.What payment methods are accepted for S25FS512SAGNFA013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS512SAGNFA013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FS512SAGNFA013?

S25FS512SAGNFA013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FS512SAGNFA013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FS512SAGNFA013?

For technical support, including S25FS512SAGNFA013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS512SAGNFA013 requirements.

6.How does Aetrix verify that S25FS512SAGNFA013 is sourced from the original manufacturer or authorized distributors?

All S25FS512SAGNFA013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS512SAGNFA013 meets industry standards.

7.What is the process for return or replacement of S25FS512SAGNFA013?

All S25FS512SAGNFA013 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS512SAGNFA013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FS512SAGNFA013 part is unused and in its original packaging.

Return procedure for S25FS512SAGNFA013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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