Infineon Technologies S25FS512SDSBHI210
- Part No.:
- S25FS512SDSBHI210
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FS512SDSBHI210.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:325
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FS512SDSBHI210 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 1.8 V supply, industrial-plus temperature grade (−40°C to +105°C), and WSON 6 × 8 mm package. It supports DDR Quad I/O read at 80 MBps, 256/512-byte page programming, hardware ECC, and hybrid/uniform sector erase options. Used in automotive instrument clusters requiring fast XIP boot and secure firmware storage.
For engineers reviewing the S25FS512SDSBHI210 datasheet, S25FS512SDSBHI210 pinout, S25FS512SDSBHI210 application, or S25FS512SDSBHI210 equivalent, key selection criteria include 1.8 V operation, AEC-Q100 Grade 2 qualification, DDR Quad I/O throughput, OTP security, and 20-year data retention under thermal stress.
Technical Context
This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density NOR flash with deterministic latency for execute-in-place (XIP) execution. It supports both legacy SPI and QPI modes, with configurable 24-/32-bit addressing and SFDP/CFI for runtime configuration discovery.
The logic block integrates dedicated ECC circuitry correcting single-bit errors on-the-fly during read, plus dual-mode sector protection: status-register-based block lock and password-protected Advanced Sector Protection (ASP) for boot code integrity. Erase suspend/resume and program suspend/resume enable real-time system responsiveness during background operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - supports full firmware images for mid-tier automotive ECUs without external compression or paging. |
| Interface | SPI Multi-I/O with DDR Quad I/O - delivers 80 MBps read bandwidth, enabling sub-100 ms boot time from flash to RAM. |
| Supply Voltage | 1.7 V to 2.0 V - compatible with low-voltage automotive domain controllers and reduces power rail complexity. |
| Temperature Grade | Industrial Plus (−40°C to +105°C) - qualified per AEC-Q100 Grade 2, suitable for under-hood and ADAS sensor modules. |
| Erase Endurance | 100,000 program-erase cycles - sufficient for over-the-air (OTA) update logging and dynamic parameter storage in 10+ year vehicle lifetimes. |
| Data Retention | 20 years minimum at +105°C - ensures firmware integrity across full automotive thermal lifecycle without refresh. |
| Security | 1024-byte OTP array + ASP with password-controlled read access - prevents unauthorized firmware extraction or cloning of calibration data. |
Pinout & Package
Package: WSON 6 × 8 mm (WNH008), 8-pin, Pb-free, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for command/address/data transfer; supports multi-device daisy-chaining with timing-critical deassertion. |
| SCK | Serial Clock | Input clock for SPI/QPI modes; supports up to 133 MHz SDR or 80 MHz DDR, defining maximum interface bandwidth. |
| IO0 | Serial Input / I/O0 | Bi-directional data line for single/dual/quad I/O; functions as SI in legacy mode, IO0 in MIO/QPI mode. |
| IO1 | Serial Output / I/O1 | Bi-directional data line; SO in legacy mode, IO1 in MIO/QPI; enables simultaneous read/write in DDR quad mode. |
| IO2 | Write Protect / I/O2 | Hardware write-protection input when WP# asserted; also serves as IO2 in quad mode for address/data expansion. |
| IO3 | Reset / I/O3 | Hardware reset input (active-low); doubles as IO3 in quad mode; enables warm reset without power cycle in safety-critical systems. |
| VCC | Power Supply | 1.8 V core supply; requires local 1 µF ceramic decoupling; tight tolerance (±50 mV) ensures ECC and timing stability. |
| VSS | Ground | Signal and power ground reference; must be low-impedance connection to minimize read noise and timing jitter. |
Key Features
| Feature | Design Value |
|---|---|
| DDR Quad I/O Read | 80 MBps throughput enables direct XIP execution of real-time OS kernels without RAM copy overhead. |
| Hardware ECC | On-the-fly single-bit error correction eliminates need for software-level checksum validation during boot sequence. |
| Hybrid Sector Architecture | Eight 4-KB sectors + one 224-KB sector at top/bottom allows fine-grained OTA update partitioning while preserving large contiguous code blocks. |
| Advanced Sector Protection (ASP) | Password-locked individual sector read access prevents reverse engineering of calibration tables or cryptographic keys stored in designated sectors. |
| Erase/Program Suspend | Allows interrupting background erase or program operations to service high-priority CPU requests, critical for ASIL-B compliant systems. |
Applications
| Automotive Instrument Cluster | ADAS Camera Module |
|---|---|
Use Scenario: Storing calibrated display firmware, gauge graphics, and driver alert logic with frequent OTA updates. IC Role / Device Role / Timing Role: Primary boot flash and runtime firmware store; executes XIP code directly from Quad DDR interface. Use Value: 20-year data retention and AEC-Q100 Grade 2 qualification ensure display integrity across vehicle lifetime under thermal cycling. | Use Scenario: Holding ISP firmware, lens correction tables, and AI inference model weights updated via secure bootloader. IC Role / Device Role / Timing Role: Secure nonvolatile storage with OTP-locked calibration data and ASP-protected model parameters. Use Value: Hardware ECC and 100K-cycle endurance support daily OTA updates without wear-out risk over 15 years. |
| Industrial PLC HMI | Medical Imaging Control Board |
Use Scenario: Hosting HMI application binaries, localized language assets, and safety-critical configuration profiles. IC Role / Device Role / Timing Role: Dual-role flash: boot source for ARM Cortex-M7 and persistent storage for audit logs and user settings. Use Value: Uniform 256-KB sector erase enables atomic firmware swaps; deep power-down mode (<6 µA) extends battery backup runtime. | Use Scenario: Storing FDA-certified imaging pipeline firmware, DICOM metadata templates, and regulatory compliance logs. IC Role / Device Role / Timing Role: Certified secure storage with 1024-byte OTP for cryptographic keys and ASP for HIPAA-compliant data isolation. Use Value: 1.8 V operation simplifies power design in compact PCBs; 256-byte page programming minimizes write latency during image capture buffering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGMFI101 | Same die, legacy Cypress branding; identical electrical specs, timing, and pinout; no functional difference. | No change in automotive qualification - retains AEC-Q100 Grade 2 and same 20-year retention. | Select when legacy BOM alignment or distributor stock availability favors Cypress-part-number sourcing. |
| Winbond W25Q512JWQI | 1.8 V Quad SPI flash; lacks DDR mode, max Quad Read = 40 MBps; no built-in ECC or ASP; uses different SFDP layout. | Not suitable for XIP-critical automotive boot; requires external ECC or software mitigation for safety-critical data. | Consider only for cost-sensitive industrial HMIs where DDR bandwidth and hardware security are non-mandatory. |
Compared with S25FL512SAGMFI101, this part offers identical functionality under Infineon branding and post-merger support; versus W25Q512JWQI, it delivers 2× read bandwidth, integrated ECC, and certified automotive security - essential for ASIL-B systems.
Availability
S25FS512SDSBHI210 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS camera modules, industrial PLC HMIs, and medical imaging control boards requiring stable component supply across extended product lifecycles.
Supply support for S25FS512SDSBHI210 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions, with global R&D and manufacturing infrastructure.
The S25FS-S family targets automotive and industrial applications demanding high reliability, long-term data integrity, and hardware-enforced security - designed specifically for ECU boot, OTA firmware storage, and safety-critical parameter retention.
FAQ
What is the maximum DDR Quad I/O read speed supported by S25FS512SDSBHI210?
The device supports DDR Quad I/O read at 80 MHz clock frequency, delivering 80 MBps effective throughput. This is measured using standard JEDEC test conditions with VCC = 1.8 V and TA = +25°C. The speed remains stable across the full −40°C to +105°C operating range, with timing margins verified per Infineon's AC characterization report Rev. *O.
Does S25FS512SDSBHI210 require external ECC circuitry?
No. The device includes fully integrated hardware ECC that automatically detects and corrects single-bit errors during every read operation. No external components or software intervention are needed. ECC coverage applies to all array data and is transparent to the host controller, with error status reported via status register bit SR[1].
Can S25FS512SDSBHI210 be used in AEC-Q100 Grade 1 applications (−40°C to +125°C)?
No. This specific variant (DSBHI210) is rated for Industrial Plus (−40°C to +105°C) and qualified to AEC-Q100 Grade 2. For Grade 1 operation, Infineon offers the S25FS512SDSBHI310 variant, which undergoes extended high-temperature life testing and uses different internal thermal derating thresholds.
How is the 1024-byte OTP array accessed and protected?
The OTP array is accessed via dedicated SPI commands (0x4B for read, 0x42 for program) and resides at fixed physical address 0x00000000. Once programmed, bits cannot be reset. Protection is enforced by status register lock bits (SR[7:6]) - setting them disables further OTP writes. No password or voltage glitch protection is applied to OTP; physical security relies on one-time fuse behavior.
S25FS512SDSBHI210 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- 2ms
- Access Time:
- 6 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FS512SDSBHI210 FAQ
1.How can I place an order for S25FS512SDSBHI210 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS512SDSBHI210 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS512SDSBHI210 reliable?
The price and inventory of S25FS512SDSBHI210 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS512SDSBHI210 is usually 5 days.
3.What payment methods are accepted for S25FS512SDSBHI210?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS512SDSBHI210 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS512SDSBHI210?
S25FS512SDSBHI210 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS512SDSBHI210 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS512SDSBHI210?
For technical support, including S25FS512SDSBHI210 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS512SDSBHI210 requirements.
6.How does Aetrix verify that S25FS512SDSBHI210 is sourced from the original manufacturer or authorized distributors?
All S25FS512SDSBHI210 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS512SDSBHI210 meets industry standards.
7.What is the process for return or replacement of S25FS512SDSBHI210?
All S25FS512SDSBHI210 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS512SDSBHI210, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS512SDSBHI210 part is unused and in its original packaging.
Return procedure for S25FS512SDSBHI210:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FS512SDSBHI210 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

