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Infineon Technologies S25HL02GTDPBHB053

Part No.:
S25HL02GTDPBHB053
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25HL02GTDPBHB053.pdf
Description:
IC FLASH 2GBIT SPI/QUAD 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,329

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Product details

Overview

S25HL02GTDPBHB053 from Infineon is a 2-Gb Dual Die Package (DDP) SEMPER™ NOR flash memory with Quad SPI interface, 1.8 V/3.0 V dual supply support, ISO 26262 ASIL-B compliant safety architecture, and 256 KB uniform or hybrid sector configuration. It delivers up to 102 MBps DDR read throughput, supports 2.56M program-erase cycles in main array, and operates across –40°C to +105°C for industrial-plus applications including automotive boot code storage.

For engineers reviewing the S25HL02GTDPBHB053 datasheet, S25HL02GTDPBHB053 pinout, S25HL02GTDPBHB053 application, or S25HL02GTDPBHB053 equivalent, key selection criteria include Quad SPI DDR timing compliance, ASIL-B functional safety certification, EnduraFlex™ endurance partitioning, 24-ball BGA package compatibility, and OTP secure silicon integration for firmware authentication.

Technical Context

This device implements Infineon's 45-nm MIRRORBIT™ technology with two bits per cell and integrates an embedded microcontroller for command execution, ECC (SECDED), CRC-based data integrity checking, and SafeBoot initialization monitoring. Its EnduraFlex™ architecture enables independent endurance and retention tuning across memory partitions.

The 24-ball BGA package houses two stacked 1-Gb dies sharing common control signals (CS#, CK, DQ[3:0]), supporting 1S-1S-4S, 1S-4S-4S, 1S-4D-4D, 4S-4S-4S, and 4S-4D-4D protocols with configurable 256/512-byte page buffers and SFDP-defined parameter discovery.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density2 Gb (2 × 1 Gb die in DDP configuration)
Interface ProtocolQuad SPI with DDR support up to 102 MHz clock → 102 MBps sustained read
Endurance2,560,000 program-erase cycles in main array; 300,000 in 4 KB sectors
Data RetentionMinimum 25 years at +85°C; extended via EnduraFlex™ partitioning
Voltage Range1.7–2.0 V (HS-T) or 2.7–3.6 V (HL-T); supports dual-voltage system design
Temperature GradeIndustrial Plus (–40°C to +105°C); AEC-Q100 Grade 2 qualified
Safety CertificationISO 26262 ASIL-B compliant; ASIL-D ready with SafeBoot and ECC

Pinout & Package

Package: 24-ball BGA, 8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable signal; initiates all transactions and controls standby entry/exit
CKClock InputRising-edge latched in SDR; both edges used in DDR mode for address/data transfer
DQ0 / SISerial Input / Data I/OSingle-bit input in SPI; primary bidirectional line in Dual/Quad modes
DQ1 / SOSerial Output / Data I/OSingle-bit output in SPI; bidirectional line supporting 2-/4-bit transfers
DQ2 / WP#Write Protect / Data I/OOptional hardware write lock; weak internal pull-up allows floating when unused
DQ3 / RESET#Reset / Data I/OConfigurable as hardware reset (active-low) or Quad SPI data line; internal pull-up
VCCCore Power SupplySupplies 1.7–2.0 V or 2.7–3.6 V; decoupling required per JEDEC BGA guidelines
VSSGround ReferenceCommon return path for core logic and I/O drivers; must be low-impedance

Key Features

FeatureDesign Value
ASIL-B Functional SafetyIntegrated SafeBoot, configuration corruption detection, and recovery path for automotive boot ROM
EnduraFlex™ ArchitectureIndependent endurance (2.56M cycles) and retention (25 yr) tuning per memory partition
SECDED ECCOn-the-fly single-bit correction and double-bit error detection across full memory array
OTP Secure Silicon1024-byte one-time-programmable region for cryptographic keys and firmware signatures
Hybrid Sector LayoutFlexible 4 KB top/bottom sectors + 256 KB uniform sectors for bootloader + application separation

Applications

Automotive ADAS Boot MemoryIndustrial PLC Firmware Storage

Use Scenario: Storing boot code and safety-critical firmware for radar ECU with cold-start requirements.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory providing deterministic read latency under ASIL-B constraints.

Use Value: SafeBoot reports initialization failures; ECC ensures bit-level reliability during power cycling in vehicle start-stop cycles.

Use Scenario: Holding firmware and configuration data for programmable logic controllers operating in factory environments.

IC Role / Device Role / Timing Role: High-reliability storage for field-upgradable firmware with sector-level protection.

Use Value: Hybrid sector architecture isolates 4 KB configuration sectors from 256 KB application code, enabling atomic updates without full erase.

Medical Imaging System BIOSAvionics Display Module Code

Use Scenario: Storing diagnostic BIOS and calibration tables in MRI subsystems requiring long-term data integrity.

IC Role / Device Role / Timing Role: Trusted boot source with 25-year retention guarantee and CRC-verified read path.

Use Value: Data Integrity CRC detects memory array errors before firmware execution, preventing corrupted boot sequences.

Use Scenario: Hosting display controller firmware in DO-178C-certified cockpit displays with thermal cycling exposure.

IC Role / Device Role / Timing Role: Radiation-tolerant, high-endurance flash for mission-critical display boot images.

Use Value: EnduraFlex™ partitions allocate high-endurance cycles to frequently updated display assets while preserving retention on static boot code.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25HL02GTDPBHB053 (now Infineon)No difference - same part number, identical revision and packagingNone - direct replacement within same product familySelect when continuity of legacy Cypress-designated BOMs is required
Infineon S25HL02GTDPBHB063Same die and interface, but Industrial Plus grade with +105°C max operating temperature vs. +85°CRequired for extended-temperature industrial or under-hood automotive use casesChoose for higher ambient thermal margin where +105°C operation is mandated

Compared with S25HL02GTDPBHB053, the 063 variant extends temperature range to +105°C without altering timing, endurance, or safety features-making it suitable for thermally demanding deployments while maintaining pin and firmware compatibility.

Availability

S25HL02GTDPBHB053 is available at Aetrix Electronics and suitable for automotive ADAS modules, industrial PLCs, medical imaging systems, and avionics display units requiring stable component supply, long-lifecycle support, and ASIL-B certified nonvolatile memory.

Supply support for S25HL02GTDPBHB053 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and safety-certified memory solutions.

The SEMPER™ Flash product line targets functional safety-critical applications in automotive, industrial, and medical systems, delivering ASIL-B compliance, high endurance, and robust data integrity through integrated ECC and SafeBoot.

FAQ

Is S25HL02GTDPBHB053 pin-compatible with earlier Cypress S25HL series devices?

Yes - this part retains identical 24-ball BGA pinout, electrical signaling, and command set as legacy Cypress S25HL devices. The transition to Infineon branding does not affect mechanical or functional compatibility, and existing PCB layouts require no modification for drop-in replacement.

What is the role of the DQ3/RESET# pin in Quad SPI mode?

In Quad SPI mode, DQ3 functions exclusively as a bidirectional data line (DQ3). The RESET# functionality is disabled when Quad SPI is active. Hardware reset must be performed using CS# deassertion followed by power cycle or via dedicated RESET# pin if configured separately in non-Quad mode.

Does S25HL02GTDPBHB053 support execute-in-place (XIP) operation?

Yes - the device supports XIP via Quad SPI DDR protocol with linear burst reads, enabling direct code execution from flash without copying to RAM. Latency is minimized by 102 MBps DDR throughput and configurable wrap/linear burst modes aligned to cache line boundaries.

How is the OTP Secure Silicon region accessed and protected?

The 1024-byte OTP region is accessed via standard SPI commands after unlocking with specific vendor-specific register writes. Once programmed, bits cannot be erased; protection is enforced by hardware lock bits that disable further writes upon first programming, ensuring cryptographic key immutability.

S25HL02GTDPBHB053 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SEMPER™
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
2Gbit
Memory Organization:
256M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
1.7ms
Access Time:
6.5 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (8x8)

S25HL02GTDPBHB053 FAQ

1.How can I place an order for S25HL02GTDPBHB053 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25HL02GTDPBHB053 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25HL02GTDPBHB053 reliable?

The price and inventory of S25HL02GTDPBHB053 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25HL02GTDPBHB053 is usually 5 days.

3.What payment methods are accepted for S25HL02GTDPBHB053?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25HL02GTDPBHB053 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25HL02GTDPBHB053?

S25HL02GTDPBHB053 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25HL02GTDPBHB053 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25HL02GTDPBHB053?

For technical support, including S25HL02GTDPBHB053 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25HL02GTDPBHB053 requirements.

6.How does Aetrix verify that S25HL02GTDPBHB053 is sourced from the original manufacturer or authorized distributors?

All S25HL02GTDPBHB053 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25HL02GTDPBHB053 meets industry standards.

7.What is the process for return or replacement of S25HL02GTDPBHB053?

All S25HL02GTDPBHB053 units undergo pre-shipment inspection (PSI). If there is an issue with S25HL02GTDPBHB053, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25HL02GTDPBHB053 part is unused and in its original packaging.

Return procedure for S25HL02GTDPBHB053:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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