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Infineon Technologies S25HL02GTDPBHM050
- Part No.:
- S25HL02GTDPBHM050
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25HL02GTDPBHM050.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,943
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Product details
Overview
S25HL02GTDPBHM050 from Infineon is a 2-Gb Dual Die Package (DDP) SEMPER™ NOR flash memory with Quad SPI interface, 1.8 V/3.0 V dual supply support, ISO 26262 ASIL-B compliant functional safety architecture, and EnduraFlex™ high-endurance partitioning for automotive and industrial boot code storage. It delivers up to 102 MBps DDR read throughput, supports 256 KB and 4 KB sector erase, and integrates SECDED ECC, SafeBoot, and 1024-byte OTP secure silicon.
For engineers reviewing the S25HL02GTDPBHM050 datasheet, S25HL02GTDPBHM050 pinout, S25HL02GTDPBHM050 application, or S25HL02GTDPBHM050 equivalent, key selection criteria include ASIL-B compliance status, Quad SPI DDR timing at 102 MHz, 256 KB vs. 4 KB sector erase granularity, 2.56M program-erase cycles in main array, and 24-ball BGA 8 × 8 mm package compatibility with automotive ECU and ADAS controller layouts.
Technical Context
This device implements Infineon's 45-nm MIRRORBIT™ technology storing two bits per cell within a monolithic control logic + stacked-die MCP structure. Its embedded microcontroller manages SafeBoot initialization reporting, SFDP parameter discovery, and CRC-based data integrity checks across all memory operations.
The EnduraFlex™ architecture enables independent endurance tuning: 4 KB sectors rated for 300,000 cycles and main array for 2,560,000 cycles, while SECDED ECC operates transparently on all read paths. Quad SPI supports five protocols including 4S-4D-4D DDR mode, with clock-synchronized dual-edge data transfer achieving 102 MBps sustained bandwidth.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (2 × 1 Gb die in DDP configuration) |
| Interface Protocol | Quad SPI supporting 4S-4S-4S (SDR) and 4S-4D-4D (DDR) modes |
| Max Read Throughput | 102 MBps in DDR mode (102 MHz clock, dual-edge sampling) |
| Endurance (Main Array) | 2,560,000 program-erase cycles - enables >10-year firmware update lifetime in telematics ECUs |
| Data Retention | 25 years at 85°C - validated for automotive Grade 2 (–40°C to +105°C) operation |
| ECC Scheme | SECDED (Single Error Correction, Double Error Detection) applied to all array reads |
| Supply Voltage Range | 1.7–2.0 V (HS-T) or 2.7–3.6 V (HL-T) - supports dual-rail power domains in ADAS SoC systems |
Pinout & Package
Package: 24-ball BGA, 8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable signal; drives device into Standby when HIGH, except during internal erase/program operations |
| CK | Clock Input | Rising/falling edge timing reference for SDR/DDR protocols; determines maximum interface speed (up to 102 MHz DDR) |
| DQ0 / SI | Serial Input / I/O | Primary data line for SPI single/dual/quad modes; used as SI in 1S-1S-1S, DQ0 in 1S-4S-4S and 4S-4S-4S |
| DQ1 / SO | Serial Output / I/O | Primary output line in single SPI; bidirectional in dual/quad modes; outputs read data on falling edge (SDR) or both edges (DDR) |
| DQ2 / WP# | Write Protect / I/O | Optional hardware write protection; weak internal pull-up allows floating if unused in quad mode |
| DQ3 / RESET# | Reset / I/O | Configurable as hardware reset (active-low) when CS# is HIGH or quad mode disabled; internal weak pull-up ensures default HIGH state |
| VCC | Core Power Supply | Supplies core logic and memory array; accepts either 1.8 V (HS-T) or 3.0 V (HL-T) rail |
| VSS | Ground Reference | Common return path for all digital and analog circuitry; requires low-impedance PCB connection |
Key Features
| Feature | Design Value |
|---|---|
| ISO 26262 ASIL-B Compliance | Validated functional safety architecture with SafeBoot failure reporting and configuration corruption recovery |
| EnduraFlex™ Partitioning | Independent endurance ratings: 300K cycles for 4 KB sectors, 2.56M cycles for 256 KB sectors |
| Secure Silicon Region | 1024-byte OTP area for cryptographic keys, device IDs, or secure boot parameters |
| Quad SPI DDR Mode | 102 MBps sustained read bandwidth using dual-edge clock sampling - reduces host CPU wait states |
| Legacy + Advanced Sector Protection | Hardware-enforced locking of individual 4 KB sectors and configurable block-level protection zones |
Applications
| Automotive ECU Boot Memory | ADAS Sensor Fusion Controller |
|---|---|
Use Scenario: Storing boot firmware and safety-critical calibration data in engine control units requiring ASIL-B compliance. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with SafeBoot validation and SECDED-protected read access during cold start. Use Value: 25-year data retention at 105°C and 2.56M program-erase cycles ensure field reliability over 15+ year vehicle lifetimes. | Use Scenario: Hosting real-time sensor fusion algorithms and neural network weights in radar/vision processing modules. IC Role / Device Role / Timing Role: High-bandwidth instruction/data fetch source via Quad SPI DDR mode to feed multi-core RISC-V processors. Use Value: 102 MBps DDR read rate minimizes instruction cache misses, enabling deterministic <50 µs latency for safety-critical interrupt handling. |
| Industrial PLC Firmware Storage | Medical Imaging System Configuration |
Use Scenario: Secure storage of programmable logic controller firmware with remote OTA update capability. IC Role / Device Role / Timing Role: Dual-voltage (1.8 V/3.0 V) flash memory supporting legacy 3.3 V backplanes and modern low-power 1.8 V SoCs. Use Value: Hybrid sector architecture allows atomic 4 KB updates to runtime parameters without erasing full 256 KB sectors. | Use Scenario: Storing DICOM configuration profiles, calibration tables, and regulatory audit logs in FDA-cleared imaging devices. IC Role / Device Role / Timing Role: Cryptographically secured storage using 1024-byte OTP region for private keys and device identity binding. Use Value: Built-in CRC and SECDED ECC guarantee bit-level integrity of diagnostic calibration data across 10,000+ power cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25HL02GTDPBHI050 | Same die, identical electrical specs, but Industrial Plus (–40°C to +105°C) temperature grade instead of Automotive Grade 2 | Lacks AEC-Q100 qualification; not suitable for under-hood automotive deployments | Select when operating ambient stays ≤105°C and AEC-Q100 certification is not required |
| Winbond W25Q02JW | 2 Gb Quad SPI NOR flash, no ASIL-B compliance, no EnduraFlex™, lower endurance (100K cycles), no SECDED ECC | No functional safety features; limited to non-safety-critical consumer or industrial applications | Select only for cost-sensitive, non-automotive designs where safety certification and long-term endurance are not mandated |
Compared with S25HL02GTDPBHM050, the Cypress alternative offers identical performance in non-automotive thermal environments, while the Winbond part lacks safety architecture, ECC, and endurance - making it unsuitable for ASIL-B systems despite matching density and interface.
Availability
S25HL02GTDPBHM050 is available at Aetrix Electronics and suitable for automotive electronic control units, ADAS sensor fusion controllers, and industrial programmable logic controllers requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.
Supply support for S25HL02GTDPBHM050 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The SEMPER™ Flash product line targets functional safety-critical applications in automotive, industrial, and medical systems, delivering ASIL-B certified NOR flash with integrated error correction, secure silicon, and endurance-optimized memory partitioning.
FAQ
What is the difference between HS-T and HL-T voltage grades?
HS-T (High-Speed, Thin oxide) supports 1.7–2.0 V operation optimized for low-voltage, high-speed performance; HL-T (High-Level, Thick oxide) supports 2.7–3.6 V for legacy 3.3 V system compatibility. Both grades deliver identical timing and endurance specs, but must be selected based on host SoC I/O voltage rails.
Does S25HL02GTDPBHM050 support hardware reset via dedicated RESET# pin?
No - this variant uses DQ3 / RESET# shared pin configuration. Hardware reset is enabled only when Quad SPI is disabled or CS# is HIGH. A true dedicated RESET# pin is available only on variants with separate RESET# ball (e.g., S25HL02GTDPBHM051).
How does SafeBoot detect and recover from configuration corruption?
SafeBoot validates register settings and boot configuration headers at power-on. If mismatch or CRC failure is detected, it enters SafeBoot mode, reports error via status register, and loads factory-default configuration - allowing host firmware to reprogram corrupted settings without device replacement.
Can the 4 KB sectors be programmed independently of 256 KB sectors?
Yes - hybrid sector architecture allows independent programming and erasing of any 4 KB sector regardless of adjacent 256 KB sector state. Each 4 KB sector has its own protection lock bit, enabling fine-grained firmware parameter updates without disturbing larger code regions.
S25HL02GTDPBHM050 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 1.7ms
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (8x8)
S25HL02GTDPBHM050 FAQ
1.How can I place an order for S25HL02GTDPBHM050 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25HL02GTDPBHM050 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25HL02GTDPBHM050 reliable?
The price and inventory of S25HL02GTDPBHM050 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25HL02GTDPBHM050 is usually 5 days.
3.What payment methods are accepted for S25HL02GTDPBHM050?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25HL02GTDPBHM050 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25HL02GTDPBHM050?
S25HL02GTDPBHM050 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25HL02GTDPBHM050 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25HL02GTDPBHM050?
For technical support, including S25HL02GTDPBHM050 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25HL02GTDPBHM050 requirements.
6.How does Aetrix verify that S25HL02GTDPBHM050 is sourced from the original manufacturer or authorized distributors?
All S25HL02GTDPBHM050 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25HL02GTDPBHM050 meets industry standards.
7.What is the process for return or replacement of S25HL02GTDPBHM050?
All S25HL02GTDPBHM050 units undergo pre-shipment inspection (PSI). If there is an issue with S25HL02GTDPBHM050, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25HL02GTDPBHM050 part is unused and in its original packaging.
Return procedure for S25HL02GTDPBHM050:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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