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Infineon Technologies S25HL02GTDPBHM053

Part No.:
S25HL02GTDPBHM053
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25HL02GTDPBHM053.pdf
Description:
IC FLASH 2GBIT SPI/QUAD 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,819

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Product details

Overview

S25HL02GTDPBHM053 from Infineon is a 2-Gb Dual Die Package (DDP) SEMPER™ NOR flash memory with Quad SPI interface, 1.8 V/3.0 V dual supply support, ISO 26262 ASIL-B compliant functional safety architecture, 256 KB uniform or hybrid sector configuration, and 25-year data retention. It serves as boot code storage in automotive ADAS ECUs requiring high reliability under –40°C to +105°C industrial-plus temperature operation.

For engineers reviewing the S25HL02GTDPBHM053 datasheet, S25HL02GTDPBHM053 pinout, S25HL02GTDPBHM053 application, or S25HL02GTDPBHM053 equivalent, key selection criteria include Quad SPI DDR read throughput (102 MBps), SECDED ECC coverage, EnduraFlex™ partition endurance (2.56M P/E cycles), and hardware reset via dedicated RESET# or DQ3/RESET# configurable pin.

Technical Context

This device implements Infineon's 45-nm MIRRORBIT™ technology storing two bits per cell within a monolithic control logic block managing stacked 1 Gb dies in a single 24-ball BGA package. Its embedded microcontroller handles SFDP parsing, SafeBoot initialization reporting, and OTP secure silicon array access (1024 bytes).

The EnduraFlex™ architecture enables independent endurance tuning across memory partitions: main array supports ≥2,560,000 program-erase cycles while 4 KB sectors guarantee ≥300,000 cycles. CRC-based data integrity checking operates on all read paths, and hardware reset is supported via CS# signaling (JEDEC), dedicated RESET#, or multiplexed DQ3/RESET# pin.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density2 Gb (2 × 1 Gb die in DDP configuration)
Interface ProtocolQuad SPI supporting 1S-4S-4S, 1S-4D-4D, 4S-4S-4S, 4S-4D-4D; DDR mode up to 102 MBps
Supply Voltage1.7–2.0 V (HS-T) or 2.7–3.6 V (HL-T); deep power-down current as low as 2.6 µA
Data RetentionMinimum 25 years at +85°C; validated for automotive AEC-Q100 Grade 2 (–40°C to +105°C)
Erase Endurance≥2,560,000 cycles for 256 KB sectors; ≥300,000 cycles for 4 KB sectors
Error CorrectionBuilt-in SECDED ECC correcting single-bit errors and detecting double-bit errors on all array reads
Sector ArchitectureConfigurable uniform (all 256 KB) or hybrid (32 × 4 KB top/bottom + remaining 256 KB)

Pinout & Package

Package: 24-ball BGA, 8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectMandatory active-low enable signal; initiates all transactions and places outputs in high-Z when deasserted
CKClock InputMandatory timing reference; rising edge latches inputs in SDR, both edges in DDR mode
DQ0 / SISerial Input / Data I/OMandatory for SPI/Dual/Quad modes; carries command/address/data in single-bit input path
DQ1 / SOSerial Output / Data I/OMandatory for SPI/Dual/Quad modes; outputs read data and status in single-bit output path
DQ2 / WP#Write Protect / Data I/OOptional write protection input with internal weak pull-up; used as quad data line when WP# disabled
DQ3 / RESET#Reset Input / Data I/OOptional hardware reset with internal weak pull-up; functions as quad data line when RESET# disabled
RESET#Hardware ResetOptional dedicated reset pin; forces self-initialization and returns device to array read state
VCCCore Power SupplyMandatory 1.7–2.0 V or 2.7–3.6 V supply; powers logic and memory array
VSSGroundMandatory reference for all signals and internal circuitry

Key Features

FeatureDesign Value
Functional Safety CertificationISO 26262 ASIL-B compliant and ASIL-D ready; SafeBoot reports initialization failures and enables recovery
Endurance PartitioningEnduraFlex™ allows separate endurance tuning: 2.56M cycles for main array, 300K for 4 KB sectors
Secure Silicon Region1024-byte OTP area (32 × 32 bytes) for keys, certificates, or calibration data with lockable access
Quad SPI DDR Performance102 MBps read rate using 4-bit DDR protocol at 102 MHz clock; eliminates bottleneck in boot-time firmware fetch
Hybrid Sector ArchitectureFlexible 4 KB/256 KB sector mix supports both fast parameter updates and bulk code storage in same device

Applications

Automotive ADAS ECU Boot MemoryIndustrial PLC Firmware Storage

Use Scenario: Storing boot code and safety-critical firmware for radar processing units operating at +105°C ambient.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory accessed via Quad SPI DDR during cold start; provides deterministic <100 ms initialization latency.

Use Value: ASIL-B compliance, 25-year retention, and SECDED ECC ensure zero uncorrectable bit errors over vehicle lifetime.

Use Scenario: Holding firmware and configuration tables in modular programmable logic controllers deployed in factory automation systems.

IC Role / Device Role / Timing Role: Field-upgradable firmware store with hybrid sector architecture enabling atomic 4 KB parameter updates without erasing full 256 KB application image.

Use Value: 300K-cycle 4 KB sectors allow >10 years of daily reconfiguration; EnduraFlex™ isolates wear from critical code regions.

Medical Imaging System BIOSAvionics Display Controller Code Storage

Use Scenario: Secure storage of boot loader and diagnostic firmware in MRI subsystems requiring traceable firmware integrity.

IC Role / Device Role / Timing Role: Trusted execution root-of-trust component; leverages OTP secure silicon region for cryptographic key binding and SFDP-based feature discovery.

Use Value: CRC-based data integrity checking and SafeBoot failure reporting meet IEC 62304 Class C software requirements.

Use Scenario: Storing display initialization sequences and graphics assets in DO-178C Level A certified cockpit displays.

IC Role / Device Role / Timing Role: High-reliability code memory interfaced via Quad SPI SDR at 83 MBps to meet real-time rendering latency budgets.

Use Value: AEC-Q100 Grade 1 qualification (–40°C to +125°C) ensures operation during extended thermal soak; deep power-down current <5.2 µA extends battery backup runtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25HL02GTDPBHI053Same die, identical electrical specs, but Industrial Plus grade (–40°C to +105°C) vs. Automotive Grade 2 (–40°C to +105°C); no AEC-Q100 certificationValid for industrial control where AEC-Q100 not mandated; lacks SafeBoot reporting and ASIL-B documentation packageSelect when cost sensitivity outweighs automotive qualification needs and functional safety traceability is not required.
Winbond W25Q256JWSIQ256 Mb density (1/8 capacity), no ASIL-B compliance, no EnduraFlex™, no SECDED ECC, max Quad SPI SDR 80 MBpsSuitable only for non-safety-critical consumer or legacy industrial designs; lacks hybrid sector architecture and OTP secure siliconChoose only for cost-driven, low-end applications where 2 Gb capacity, 25-year retention, and functional safety are not required.

Compared with S25HL02GTDPBHM053, the Cypress alternative offers identical performance without automotive qualification or safety features, while the Winbond part falls short on capacity, endurance, error correction, and safety architecture-making it unsuitable for ADAS or medical use cases.

Availability

S25HL02GTDPBHM053 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging BIOS modules, and avionics display controllers requiring stable component supply across long product lifecycles.

Supply support for S25HL02GTDPBHM053 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, sensor, and automotive ICs, with global R&D centers and ISO/TS 16949-certified manufacturing.

The SEMPER™ Flash product line targets functional safety–critical systems in automotive, industrial, and medical markets, delivering ASIL-B certified NOR flash with integrated ECC, SafeBoot, and EnduraFlex™ endurance partitioning.

FAQ

What is the maximum Quad SPI DDR read bandwidth supported by S25HL02GTDPBHM053?

The device achieves 102 MBps read throughput using Quad SPI DDR protocol at 102 MHz clock frequency, confirmed in Table 1 of the official Infineon summary datasheet (002-28767 Rev. *A). This requires host controller support for 4S-4D-4D or 4S-4S-4S DDR transaction formats and proper impedance-controlled PCB layout for DQ[3:0] lines.

Does S25HL02GTDPBHM053 support hardware reset through the DQ3 pin?

Yes, DQ3 can be configured as RESET# when Quad SPI is disabled or CS# is HIGH, per Table 5 signal description. The pin has an internal weak pull-up and must be driven LOW to initiate hardware reset. Alternatively, a dedicated RESET# pin is available and functionally identical; both assert internal self-initialization and place DQ[3:0] in high-impedance state.

How does the EnduraFlex™ architecture improve field reliability in automotive applications?

EnduraFlex™ enables independent endurance allocation: 4 KB sectors sustain ≥300,000 program-erase cycles for frequent parameter updates, while 256 KB sectors maintain ≥2,560,000 cycles for infrequently modified boot code. This prevents premature wear-out of critical firmware regions and extends total usable life beyond 15 years in ADAS ECUs operating at +105°C.

Is the 1024-byte OTP secure silicon region write-once or reprogrammable?

The OTP secure silicon region is one-time programmable: each of its 32 × 32-byte pages can be permanently locked after programming, preventing overwrite or readback. Once locked, contents remain tamper-resistant and survive >25 years at +85°C. Programming requires specific command sequences and is irreversible-intended for keys, certificates, or calibration constants.

S25HL02GTDPBHM053 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SEMPER™
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
2Gbit
Memory Organization:
256M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
1.7ms
Access Time:
6.5 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (8x8)

S25HL02GTDPBHM053 FAQ

1.How can I place an order for S25HL02GTDPBHM053 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25HL02GTDPBHM053 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25HL02GTDPBHM053 reliable?

The price and inventory of S25HL02GTDPBHM053 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25HL02GTDPBHM053 is usually 5 days.

3.What payment methods are accepted for S25HL02GTDPBHM053?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25HL02GTDPBHM053 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25HL02GTDPBHM053?

S25HL02GTDPBHM053 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25HL02GTDPBHM053 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25HL02GTDPBHM053?

For technical support, including S25HL02GTDPBHM053 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25HL02GTDPBHM053 requirements.

6.How does Aetrix verify that S25HL02GTDPBHM053 is sourced from the original manufacturer or authorized distributors?

All S25HL02GTDPBHM053 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25HL02GTDPBHM053 meets industry standards.

7.What is the process for return or replacement of S25HL02GTDPBHM053?

All S25HL02GTDPBHM053 units undergo pre-shipment inspection (PSI). If there is an issue with S25HL02GTDPBHM053, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25HL02GTDPBHM053 part is unused and in its original packaging.

Return procedure for S25HL02GTDPBHM053:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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