Infineon Technologies S25HL02GTDPBHV050
- Part No.:
- S25HL02GTDPBHV050
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25HL02GTDPBHV050.pdf
- Description:
- IC FLASH 2GBIT SPI/DUAL 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,268
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Product details
Overview
S25HL02GTDPBHV050 from Infineon is a 2-Gb Dual Die Package (DDP) SEMPER™ NOR Flash memory with Quad SPI interface, 1.8 V supply (HS-T grade), industrial temperature range (–40°C to +85°C), and ISO 26262 ASIL-B compliant functional safety architecture. It features 256 KB uniform sectors or hybrid 4 KB/256 KB sector configuration, 256/512-byte page programming buffer, and built-in SECDED ECC for memory array data integrity.
For engineers reviewing the S25HL02GTDPBHV050 datasheet, S25HL02GTDPBHV050 pinout, S25HL02GTDPBHV050 application, or S25HL02GTDPBHV050 equivalent, key selection criteria include Quad SPI DDR read throughput (102 MBps), 2.56M program-erase cycles in main array, 25-year data retention, hardware reset via CS#/RESET#/DQ3, and AEC-Q100 Grade 3 qualification for automotive boot code storage.
Technical Context
This device implements Infineon's 45-nm MIRRORBIT™ technology storing two bits per cell in a monolithic multi-chip package with two stacked 1-Gb dies sharing common control signals. Its EnduraFlex™ architecture partitions memory into high-endurance (4 KB sectors, 300k cycles) and long-retention (256 KB sectors, 2.56M cycles) regions.
The Quad SPI interface supports five protocols (1S-1S-4S, 1S-4S-4S, 1S-4D-4D, 4S-4S-4S, 4S-4D-4D) with SDR up to 166 MHz (83 MBps) and DDR up to 102 MHz (102 MBps). SafeBoot monitors initialization and configuration corruption, while CRC and SECDED ECC ensure end-to-end data integrity during read/write/erase operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (2 × 1 Gb DDP die), enabling compact boot code and firmware storage in space-constrained automotive ECUs |
| Interface Protocol | Quad SPI with DDR support up to 102 MBps read throughput, reducing firmware load time vs. standard SPI |
| Supply Voltage | 1.7–2.0 V (HS-T), compatible with low-voltage microcontroller I/O domains and reducing system power |
| Endurance | 2,560,000 program-erase cycles (256 KB sectors), supporting frequent OTA update logging in industrial gateways |
| Data Retention | 25 years at 85°C, ensuring reliable firmware persistence over full vehicle lifecycle without refresh |
| Safety Certification | ISO 26262 ASIL-B compliant and ASIL-D ready, meeting functional safety requirements for ASW and boot ROM |
| ECC | Built-in SECDED correcting single-bit errors and detecting double-bit errors on all array reads/writes |
Pinout & Package
24-ball BGA package (8 mm × 8 mm, 0.8 mm pitch), RoHS-compliant, with thermal pad option (PBHV suffix indicates Pb-free, HV = high-reliability variant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable signal; drives device into Standby when HIGH, except during internal operations - critical for power sequencing in multi-flash systems |
| CK | Clock Input | Rising-edge latched in SDR; both edges in DDR - timing reference for all SPI transactions including Quad and Dual modes |
| DQ0 / SI | Serial Input / Data I/O | Single-bit input in SPI mode; primary bidirectional line for command/address/data in Quad/Dual protocols |
| DQ1 / SO | Serial Output / Data I/O | Single-bit output in SPI mode; bidirectional data lane supporting 4-bit parallel transfers in Quad mode |
| DQ2 / WP# | Write Protect / Data I/O | Optional hardware write protection; weak internal pull-up allows floating if unused in Quad-only designs |
| DQ3 / RESET# | Reset / Data I/O | Configurable as hardware reset (active-low) when CS# is HIGH or Quad disabled - enables safe recovery without external reset IC |
| VCC | Core Power Supply | 1.7–2.0 V supply for logic and memory array; decoupling required within 5 mm of ball for stable DDR timing |
| VSS | Ground Reference | Common return path for core logic and array; must be low-inductance connection to minimize switching noise |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-B Functional Safety | SafeBoot self-test, configuration corruption detection, and recovery path - eliminates need for external safety monitor in ASW boot ROM |
| EnduraFlex™ Partitioning | Independent endurance tuning: 4 KB sectors (300k cycles) for NV parameters; 256 KB sectors (2.56M cycles) for firmware - extends field life of infotainment head units |
| Quad SPI DDR Read | 102 MBps throughput at 102 MHz DDR clock - cuts boot time by >2× vs. legacy SPI NOR in ADAS domain controllers |
| Secure Silicon Region | 1024-byte OTP array (32 × 32 bytes) for cryptographic keys and secure boot certificates - prevents cloning and firmware tampering |
| Legacy + Advanced Sector Protection | Hardware-based locking of individual 4 KB sectors and block-level write protection - enforces secure firmware update policies in telematics modules |
Applications
| Automotive ADAS Domain Controller | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot firmware and safety-critical sensor fusion algorithms in radar/EPS ECUs requiring ASIL-B compliance. IC Role / Device Role / Timing Role: Primary boot ROM with SafeBoot validation and SECDED-protected execution-in-place (XIP) reads. Use Value: Eliminates external safety monitor IC; 25-year retention ensures no field firmware refresh over 15-year vehicle service life. | Use Scenario: Holding programmable logic controller firmware and real-time OS images in factory automation systems with frequent OTA updates. IC Role / Device Role / Timing Role: High-endurance nonvolatile storage for field-upgradable code with 2.56M cycle endurance in 256 KB sectors. Use Value: Supports >10,000 firmware revisions over 10+ years without wear leveling controller overhead. |
| Medical Imaging System Boot Memory | Avionics Display Unit Configuration Storage |
Use Scenario: Secure storage of DICOM image processing firmware and calibration data in MRI/PET scanners requiring IEC 62304 Class C compliance. IC Role / Device Role / Timing Role: Trusted boot source with OTP-secured cryptographic keys and CRC-verified firmware integrity checks. Use Value: Meets regulatory audit requirements for immutable boot chain and tamper-evident configuration storage. | Use Scenario: Storing display firmware, font assets, and aircraft-specific configuration tables in DO-178C Level A certified cockpit displays. IC Role / Device Role / Timing Role: Radiation-tolerant (tested per AEC-Q100 Grade 1) nonvolatile memory with 125°C operation capability. Use Value: Enables single-part qualification across commercial and military avionics platforms without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25HL02GTDPBHV050 (now Infineon) | Same die, identical pinout and electrical specs - rebranded post-acquisition; no functional difference | No change in use case or qualification path | Select for continuity in existing designs qualified under Cypress branding |
| Macronix MX25L25645G | 256 Mb (not 2 Gb), no ASIL-B certification, no EnduraFlex partitioning, max Quad SPI SDR 80 MBps | Limited to non-safety-critical consumer or industrial firmware where capacity and safety are not constraints | Choose only for cost-sensitive, low-density applications without functional safety requirements |
Compared with S25HL02GTDPBHV050, the Cypress-branded version offers identical performance and qualification, while the Macronix part lacks ASIL-B compliance, 2-Gb density, and EnduraFlex endurance tuning - making it unsuitable for automotive or medical safety-critical boot storage.
Availability
S25HL02GTDPBHV050 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, medical imaging system boot memory, and avionics display unit configuration storage requiring stable component supply across extended product lifecycles.
Supply support for S25HL02GTDPBHV050 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and safety-certified memory solutions for mission-critical systems.
The SEMPER™ Flash product line was designed specifically for functional safety applications in automotive, industrial, and medical electronics, delivering ASIL-B compliance and ASIL-D readiness through integrated SafeBoot, ECC, and EnduraFlex™ architecture.
FAQ
What is the maximum Quad SPI DDR read bandwidth supported by S25HL02GTDPBHV050?
The device achieves 102 MBps read bandwidth using Quad SPI DDR mode at 102 MHz clock frequency, confirmed in Table 1 of the official Infineon datasheet (002-28767 Rev. *A). This requires host controller support for DDR protocol and proper PCB layout for signal integrity at 204 Mbps per DQ line.
Does S25HL02GTDPBHV050 support hardware reset independent of chip select?
Yes - it supports three hardware reset methods: CS# deassertion followed by timing sequence, dedicated RESET# pin (ball E2), or DQ3 configured as RESET# when Quad SPI is disabled. All methods trigger SafeBoot initialization and return the device to array read state with DQ lines in high-impedance.
How does the EnduraFlex™ architecture improve reliability in field-deployed systems?
EnduraFlex™ separates the memory array into independently configurable partitions: 4 KB sectors (300k cycles) for frequently updated NV parameters and 256 KB sectors (2.56M cycles) for firmware. This prevents premature wear-out of boot code regions during repeated OTA updates, extending usable lifetime beyond 15 years in automotive applications.
Is the 1024-byte OTP Secure Silicon region one-time programmable or reprogrammable?
The 1024-byte OTP Secure Silicon array is strictly one-time programmable - once written, bits cannot be erased or rewritten. It is used for storing immutable cryptographic keys, secure boot certificates, and device-unique identifiers, with write protection enforced by hardware fuses and register locks per Infineon's security documentation.
S25HL02GTDPBHV050 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Dual I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-BGA-24-805
S25HL02GTDPBHV050 FAQ
1.How can I place an order for S25HL02GTDPBHV050 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25HL02GTDPBHV050 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25HL02GTDPBHV050 reliable?
The price and inventory of S25HL02GTDPBHV050 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25HL02GTDPBHV050 is usually 5 days.
3.What payment methods are accepted for S25HL02GTDPBHV050?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25HL02GTDPBHV050 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25HL02GTDPBHV050?
S25HL02GTDPBHV050 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25HL02GTDPBHV050 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25HL02GTDPBHV050?
For technical support, including S25HL02GTDPBHV050 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25HL02GTDPBHV050 requirements.
6.How does Aetrix verify that S25HL02GTDPBHV050 is sourced from the original manufacturer or authorized distributors?
All S25HL02GTDPBHV050 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25HL02GTDPBHV050 meets industry standards.
7.What is the process for return or replacement of S25HL02GTDPBHV050?
All S25HL02GTDPBHV050 units undergo pre-shipment inspection (PSI). If there is an issue with S25HL02GTDPBHV050, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25HL02GTDPBHV050 part is unused and in its original packaging.
Return procedure for S25HL02GTDPBHV050:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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