My Inquiry
My Account
Infineon Technologies S25HL02GTDZBHB053
- Part No.:
- S25HL02GTDZBHB053
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25HL02GTDZBHB053.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,077
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25HL02GTDZBHB053 from Infineon is a 2-Gb Dual Die Package (DDP) SEMPER™ NOR flash memory with Quad SPI interface, 1.8 V/3.0 V dual supply support, ISO 26262 ASIL-B compliant functional safety architecture, and EnduraFlex™ high-endurance partitioning. It delivers up to 102 MBps DDR read throughput, supports 256 KB and 4 KB sector erase, and integrates SECDED ECC for memory array data integrity.
For engineers reviewing the S25HL02GTDZBHB053 datasheet, S25HL02GTDZBHB053 pinout, S25HL02GTDZBHB053 application, or S25HL02GTDZBHB053 equivalent, key selection criteria include ASIL-B compliance, hybrid sector architecture flexibility, 256/512-byte page buffer configuration, 2.56M program-erase cycles in main array, and 24-ball 8×8 mm BGA packaging for automotive and industrial embedded boot storage.
Technical Context
This device implements Infineon's 45-nm MIRRORBIT™ technology storing two bits per cell within a monolithic control logic architecture shared across two stacked 1-Gb dies in DDP configuration. It embeds an ECC engine supporting Single-bit Error Correction and Double-bit Error Detection (SECDED), plus SafeBoot for initialization failure reporting and recovery.
The flash supports multiple SPI protocols-1S-1S-1S (SPI), 1S-2S-2S (Dual), and 1S-1S-4S/1S-4S-4S/1S-4D-4D/4S-4S-4S/4S-4D-4D (Quad)-with configurable SDR/DDR timing modes, wrapped/linear burst reads, and hardware reset via dedicated RESET# or CS# signaling per JEDEC standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (2 × 1 Gb die in DDP configuration) |
| Interface Protocol | Quad SPI with SDR (up to 166 MHz) and DDR (up to 102 MHz) modes; also supports Dual and standard SPI |
| Read Throughput | Up to 102 MBps (DDR Quad Read), 83 MBps (SDR Quad Read) |
| Endurance & Retention | 2,560,000 program-erase cycles (main array); 25 years data retention at +85°C |
| Voltage Range | 1.7–2.0 V (HS-T) or 2.7–3.6 V (HL-T) operation |
| Temperature Grade | Automotive AEC-Q100 Grade 2 (–40°C to +105°C) |
| Package | 24-ball BGA, 8 mm × 8 mm, 0.8 mm pitch |
Pinout & Package
Package: 24-ball BGA, 8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Mandatory active-low input controlling device activation and standby entry; enables all bus transactions on HIGH-to-LOW transition |
| CK | Clock Input | Mandatory clock source; rising edge latches inputs in SDR mode; both edges used in DDR mode for command/address/data |
| DQ0 / SI | Serial Input / Data I/O | Mandatory bidirectional pin: SI in SPI mode, DQ0 in Dual/Quad modes; supports single-bit write/read |
| DQ1 / SO | Serial Output / Data I/O | Mandatory bidirectional pin: SO in SPI mode, DQ1 in Dual/Quad modes; outputs read data with falling-edge timing in SDR |
| DQ2 / WP# | Write Protect / Data I/O | Optional weak-pull-up pin: WP# in SPI/Dual mode; DQ2 in Quad mode; left unconnected if unused |
| DQ3 / RESET# | Reset / Data I/O | Optional weak-pull-up pin: RESET# when CS# is HIGH or Quad disabled; DQ3 in Quad mode; self-initializes device when asserted LOW |
| VCC | Core Power Supply | Mandatory 1.7–2.0 V or 2.7–3.6 V supply; powers internal logic, memory array, and I/O drivers |
| VSS | Ground | Mandatory reference ground for core and I/O circuits; must be low-impedance connection |
Key Features
| Feature | Design Value |
|---|---|
| Functional Safety Certification | ISO 26262 ASIL-B compliant and ASIL-D ready; includes SafeBoot for initialization failure detection and recovery |
| EnduraFlex™ Architecture | Enables independent endurance and retention tuning across memory partitions-critical for firmware update and log storage separation |
| SECDED ECC Engine | Corrects single-bit errors and detects double-bit errors in real time during read operations on memory array data |
| Hybrid Sector Configuration | Supports 32 × 4 KB sectors at top/bottom (Config 1) or both ends (Config 2), enabling fine-grained firmware patching without erasing full 256 KB blocks |
| Program-Erase Flexibility | Page buffer configurable to 256 or 512 bytes; 512-byte mode increases programming throughput by ~50% vs. 256-byte mode |
Applications
| Automotive ADAS ECU Boot Storage | Industrial PLC Firmware Image Storage |
|---|---|
Use Scenario: Storing boot code and safety-critical firmware for radar processing units in Level 2+ ADAS systems. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with deterministic read latency and ASIL-B-certified reliability. Use Value: Enables safe boot verification via CRC and ECC, reduces risk of field failures due to bit corruption during power cycling or EMI exposure. | Use Scenario: Holding firmware images and configuration data for programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: High-reliability code storage with 25-year retention and 2.56M endurance cycles for frequent field updates. Use Value: Eliminates need for external error-checking logic; hybrid sector architecture allows over-the-air patching of 4 KB firmware modules without disrupting 256 KB main image. |
| Medical Imaging System BIOS Storage | Avionics Display Unit Configuration Memory |
Use Scenario: Secure storage of boot firmware and calibration tables in MRI and CT scanner control subsystems. IC Role / Device Role / Timing Role: ISO 13485-aligned non-volatile memory with OTP secure silicon array for cryptographic key storage. Use Value: 1024-byte OTP region provides tamper-resistant storage for device identity and encryption keys; SafeBoot ensures verified boot chain integrity. | Use Scenario: Storing display firmware and aircraft-specific configuration parameters in certified cockpit display units. IC Role / Device Role / Timing Role: DO-160 qualified flash memory supporting -40°C to +105°C operation and rapid DDR read for UI responsiveness. Use Value: 102 MBps DDR read speed meets real-time rendering latency requirements; AEC-Q100 Grade 2 qualification satisfies RTCA/DO-160 environmental stress testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25HL02GTAGBHI010 | Same die, identical electrical specs, but uses HS-T voltage range only (1.7–2.0 V); no HL-T support | Limited to low-voltage systems; unsuitable for 3.3 V legacy industrial designs requiring HL-T operation | Select when system operates strictly at 1.8 V and requires same package footprint and timing |
| Macronix MX25L25645GZC-10G | No ASIL-B certification; lacks SafeBoot, EnduraFlex, and SECDED; max 100,000 P/E cycles | Not suitable for safety-critical automotive or medical use; limited to consumer-grade firmware storage | Consider only for cost-sensitive, non-safety applications where functional safety is not required |
Compared with S25HL02GTDZBHB053, the Cypress alternative matches pinout and performance but omits HL-T support, while the Macronix part lacks safety features, endurance, and retention-making it unsuitable for automotive or industrial safety-critical deployments.
Availability
S25HL02GTDZBHB053 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and functional safety compliance.
Supply support for S25HL02GTDZBHB053 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.
The SEMPER™ Flash product line is engineered for functional safety-critical applications-including automotive ADAS, industrial automation, and medical devices-delivering ASIL-B compliance, high endurance, and robust data integrity mechanisms.
FAQ
What voltage ranges does the S25HL02GTDZBHB053 support?
The S25HL02GTDZBHB053 supports two distinct voltage ranges: 1.7–2.0 V (HS-T grade) and 2.7–3.6 V (HL-T grade). It is not rated for operation across the full 1.7–3.6 V span. Voltage selection determines applicable temperature grades and current consumption profiles per datasheet Tables 3 and 4.
Does this device require external hardware reset circuitry?
No. The S25HL02GTDZBHB053 includes an internal weak pull-up on the RESET# signal and supports hardware reset via either the dedicated RESET# pin or CS# signaling per JEDEC JESD252. External reset circuitry is optional and only needed if system-level reset sequencing or glitch immunity beyond internal thresholds is required.
How is the 2-Gb capacity physically implemented?
The S25HL02GTDZBHB053 uses a Multi-Chip Package (MCP) with Dual Die Package (DDP) construction: two independent 1-Gb MIRRORBIT™ dies stacked and bonded in a single 24-ball BGA. Control signals (CS#, CK, DQ[3:0]) are internally shared; address decoding and die selection are handled transparently by the embedded microcontroller.
Can the 4 KB sectors be programmed independently of 256 KB sectors?
Yes. The hybrid sector architecture allows independent programming and erasing of 4 KB sectors (32 total, configurable at top/bottom or both ends) and 256 KB sectors. Each 4 KB sector has its own protection register and can be locked/unlocked separately, enabling granular firmware update management without affecting adjacent memory regions.
S25HL02GTDZBHB053 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 1.7ms
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25HL02GTDZBHB053 FAQ
1.How can I place an order for S25HL02GTDZBHB053 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25HL02GTDZBHB053 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25HL02GTDZBHB053 reliable?
The price and inventory of S25HL02GTDZBHB053 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25HL02GTDZBHB053 is usually 5 days.
3.What payment methods are accepted for S25HL02GTDZBHB053?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25HL02GTDZBHB053 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25HL02GTDZBHB053?
S25HL02GTDZBHB053 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25HL02GTDZBHB053 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25HL02GTDZBHB053?
For technical support, including S25HL02GTDZBHB053 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25HL02GTDZBHB053 requirements.
6.How does Aetrix verify that S25HL02GTDZBHB053 is sourced from the original manufacturer or authorized distributors?
All S25HL02GTDZBHB053 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25HL02GTDZBHB053 meets industry standards.
7.What is the process for return or replacement of S25HL02GTDZBHB053?
All S25HL02GTDZBHB053 units undergo pre-shipment inspection (PSI). If there is an issue with S25HL02GTDZBHB053, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25HL02GTDZBHB053 part is unused and in its original packaging.
Return procedure for S25HL02GTDZBHB053:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25HL02GTDZBHB053 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
