Infineon Technologies S25HL512TDPBHI010
- Part No.:
- S25HL512TDPBHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25HL512TDPBHI010.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:277
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25HL512TDPBHI010 from Infineon is a 512-Mbit serial NOR flash memory with octal DTR interface, 1.8 V supply voltage, 400 MHz read clock, and 120 MB/s read bandwidth. It supports Xccela™ architecture for high-speed execute-in-place (XIP) operation in automotive ADAS and infotainment systems.
For engineers reviewing the S25HL512TDPBHI010 datasheet, S25HL512TDPBHI010 pinout, S25HL512TDPBHI010 application, or S25HL512TDPBHI010 equivalent, key selection criteria include octal DTR timing compliance, AEC-Q100 Grade 2 qualification, 100K erase/write cycles, and hardware reset support for safety-critical boot code storage.
Technical Context
This device implements an octal DDR interface with double-data-rate signaling on eight I/O lines, enabling 8-bit-wide transfers per clock edge. It integrates a 4-KB uniform sector architecture with individual sector protection and volatile/non-volatile configuration registers.
The memory supports standard SPI commands plus extended xSPI opcodes including Read Status Register-2 (07h), Write Enable for Volatile SR (50h), and Octal DTR Fast Read (EDh). Boot latency is minimized via configurable dummy cycles and wrap-around burst addressing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mbit (64 MB) - supports full firmware images for modern automotive ECUs |
| Interface | Octal DTR xSPI - enables 120 MB/s sustained read throughput for real-time code execution |
| Supply Voltage | 1.71–1.95 V - compatible with low-voltage automotive domain controllers |
| Cycle Endurance | 100,000 program/erase cycles - ensures long-term reliability in over-the-air update scenarios |
| Data Retention | 20 years at 85°C - meets ASIL-B requirements for safety-critical storage |
| Qualification | AEC-Q100 Grade 2 (−40°C to +105°C) - validated for under-hood automotive environments |
Pinout & Package
Package: 24-pin BGA (6 × 8 mm, 0.8 mm pitch, PBGA).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Core power supply | 1.8 V nominal input; decoupling required within 10 mm of pin |
| VSS | GND reference | Dedicated ground return for I/O and core logic; must be connected to system GND plane |
| IO0–IO7 | Octal bidirectional data bus | DDR-capable I/O pins supporting DQS-strobed read/write; require matched trace lengths |
| DQS | Data strobe | Source-synchronous timing reference for DDR reads; routed as differential pair with DQS# |
| RESET# | Hardware reset input | Active-low asynchronous reset; used to recover from invalid command sequences during boot |
| HOLD# | Operation suspend control | Pauses ongoing read/write without terminating transaction; supports multi-master arbitration |
Key Features
| Feature | Design Value |
|---|---|
| Xccela™ Architecture | Enables deterministic 80 ns random access time and seamless XIP from flash without external RAM caching |
| Configurable Dummy Cycles | Allows tuning of read latency across temperature and voltage variations to maintain timing margin |
| Individual Sector Protection | Permits locking of critical boot sectors while allowing updates to application partitions |
| Volatile Configuration Register | Supports runtime reconfiguration of drive strength, output enable delay, and wrap mode without power cycle |
Applications
| Automotive ADAS Camera Module | Infotainment Head Unit |
|---|---|
Use Scenario: Stores calibration data, ISP firmware, and neural network weights for front-facing stereo cameras. IC Role / Device Role / Timing Role: Nonvolatile boot and configuration memory with guaranteed read stability during vehicle startup and vibration. Use Value: AEC-Q100 Grade 2 rating and 20-year data retention ensure consistent image processing performance over 15-year vehicle lifetime. | Use Scenario: Hosts Linux kernel, Qt framework, and HMI assets for 12.3-inch digital cluster displays. IC Role / Device Role / Timing Role: High-bandwidth XIP memory enabling direct code execution to reduce DRAM footprint and boot time. Use Value: 120 MB/s read bandwidth eliminates instruction cache misses during GUI rendering and audio decoding. |
| Electric Powertrain Control Unit | Vehicle Gateway ECU |
Use Scenario: Stores motor control algorithms, fault logs, and ISO 26262-compliant safety monitor code. IC Role / Device Role / Timing Role: Safety-certified nonvolatile memory with hardware reset recovery for ASIL-D subsystems. Use Value: Hardware reset pin and 100K endurance support safe firmware rollback after failed OTA updates. | Use Scenario: Holds CAN FD, Ethernet AVB, and LIN protocol stacks for multi-bus vehicle networking. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for cryptographic keys and secure boot manifests. Use Value: Individual sector protection prevents unauthorized modification of bootloader and TLS certificate partitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability automotive NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B104QN-PSOC | 4-Mbit FRAM with parallel interface; no DTR support; unlimited endurance | Used for frequent parameter logging, not firmware storage | Select only when write-cycle count dominates over density and interface speed requirements |
| MX66UM1G45GXDIO | 1-Gbit octal DTR NOR; same xSPI command set but AEC-Q100 Grade 3 (−40°C to +85°C) | Targeted at cabin electronics, not under-hood modules | Choose if higher density is needed and ambient temperature stays below 85°C |
Compared with CY15B104QN-PSOC and MX66UM1G45GXDIO, S25HL512TDPBHI010 uniquely balances 512-Mbit density, Grade 2 temperature range, and octal DTR bandwidth-making it optimal for ADAS ECUs where thermal robustness and XIP performance are jointly critical.
Availability
S25HL512TDPBHI010 is available at Aetrix Electronics and suitable for automotive ADAS camera modules, infotainment head units, and electric powertrain control units requiring stable component supply across extended product lifecycles.
Supply support for S25HL512TDPBHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and trusted security solutions.
This part belongs to the Semper™ family of automotive-grade NOR flash memories, designed specifically to replace parallel NOR and legacy SPI flash in safety-critical, high-bandwidth boot and code storage applications.
FAQ
What is the maximum operating frequency of the octal DTR interface?
The S25HL512TDPBHI010 supports up to 400 MHz DDR clock frequency on the octal DTR interface, delivering 120 MB/s effective read bandwidth. This is achieved using double-data-rate transfers across all eight I/O lines with source-synchronous DQS timing, and requires PCB layout adherence to xSPI JEDEC JESD251A routing guidelines.
Does this device support hardware reset for safety-critical boot recovery?
Yes, the RESET# pin provides asynchronous hardware reset functionality that forces the device into a known initial state, clearing internal command registers and aborting any active operation. This feature is essential for ASIL-B/D systems where deterministic recovery from undefined states is mandated by ISO 26262.
How is data retention guaranteed over temperature and time?
Data retention is specified as 20 years at 85°C and extrapolated to >40 years at 25°C, verified through accelerated high-temperature bake testing per JEDEC JESD22-A117. The device uses charge-trap Flash technology with robust oxide-nitride-oxide (ONO) gate stack to minimize electron leakage under thermal stress.
Can the configuration register be modified during normal operation?
Yes, both volatile and non-volatile configuration registers can be updated dynamically via standard xSPI commands. The volatile register allows runtime adjustment of drive strength, dummy cycle count, and burst wrap mode without power cycling, enabling adaptive timing tuning during system calibration or thermal transients.
S25HL512TDPBHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HL-T
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25HL512TDPBHI010 FAQ
1.How can I place an order for S25HL512TDPBHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25HL512TDPBHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25HL512TDPBHI010 reliable?
The price and inventory of S25HL512TDPBHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25HL512TDPBHI010 is usually 5 days.
3.What payment methods are accepted for S25HL512TDPBHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25HL512TDPBHI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25HL512TDPBHI010?
S25HL512TDPBHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25HL512TDPBHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25HL512TDPBHI010?
For technical support, including S25HL512TDPBHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25HL512TDPBHI010 requirements.
6.How does Aetrix verify that S25HL512TDPBHI010 is sourced from the original manufacturer or authorized distributors?
All S25HL512TDPBHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25HL512TDPBHI010 meets industry standards.
7.What is the process for return or replacement of S25HL512TDPBHI010?
All S25HL512TDPBHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S25HL512TDPBHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25HL512TDPBHI010 part is unused and in its original packaging.
Return procedure for S25HL512TDPBHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25HL512TDPBHI010 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

