Infineon Technologies S25HL512TFAMHI010
- Part No.:
- S25HL512TFAMHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25HL512TFAMHI010.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:133
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25HL512TFAMHI010 from Infineon is a 512-Mbit (64MB) serial NOR flash memory with 3.0V supply, octal DTR interface, 200MHz clock frequency, and 400MT/s data rate, deployed in automotive ADAS domain controllers for firmware storage and code execution.
For engineers reviewing the S25HL512TFAMHI010 datasheet, S25HL512TFAMHI010 pinout, S25HL512TFAMHI010 application, or S25HL512TFAMHI010 equivalent, key selection criteria include octal DTR timing compliance, AEC-Q100 Grade 2 qualification, sector protection granularity, and dual-die stack configuration for extended density.
Technical Context
This device implements an octal DDR (DTR) interface with x8 I/O bus width, supporting both single- and dual-die configurations. It uses 40nm process technology and includes hardware reset, write protection, and volatile/non-volatile configuration registers.
The memory array is organized as 1024 sectors of 256KB each, with uniform 4KB subsectors for fine-grained erase control. It supports standard SPI commands plus extended octal DTR opcodes for high-speed read and program operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mbit (64 MB) in dual-die stacked configuration |
| Interface | Octal DDR (DTR) with x8 I/O, compatible with JEDEC JESD251 |
| Max Clock Frequency | 200 MHz enabling 400 MT/s effective data rate |
| Supply Voltage | 2.7V to 3.6V; supports 3.0V nominal operation |
| Operating Temperature | −40°C to +105°C (AEC-Q100 Grade 2 qualified) |
| Erase Granularity | Uniform 4 KB subsectors and 256 KB sectors for flexible firmware update |
| Write Protection | Hardware WP# pin + software-controlled sector protection |
Pinout & Package
Package: 24-pin WSON (6 × 8 mm, 0.5 mm pitch).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIO/VCC | Core & I/O supply | Single 3.0V supply for core logic and octal I/O buffers |
| GND | Ground reference | Common return path for all internal circuits and I/O drivers |
| WP# | Hardware write protect | Active-low pin enabling permanent or temporary sector lock |
| HOLD# | Operation suspend | Pauses ongoing read/program/erase without resetting command state |
| RESET# | Device reset | Asynchronous active-low signal to restore default register states |
| IO0–IO7 | Octal bidirectional data | Dual-purpose pins for address, instruction, and data in DTR mode |
| CLK | Timing reference | Input clock synchronized to DTR read/write strobes at up to 200 MHz |
Key Features
| Feature | Design Value |
|---|---|
| Octal DTR Interface | Enables 400 MT/s read throughput, reducing boot time in automotive ECUs |
| Dual-Die Stack | Integrates two 256-Mbit dies in one package for 512-Mbit capacity without board area penalty |
| AEC-Q100 Grade 2 | Qualified for under-hood automotive use with full temperature range support |
| 4KB Subsector Erase | Allows partial firmware updates without erasing entire 256KB sectors |
| Volatile Configuration Register | Permits runtime tuning of latency, drive strength, and DTR enable without power cycle |
Applications
| ADAS Domain Controller | Automotive Gateway ECU |
|---|---|
Use Scenario: Storing and executing boot firmware and sensor fusion algorithms in centralized ADAS platforms. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with XIP (execute-in-place) capability over octal DTR interface. Use Value: 400 MT/s read bandwidth enables sub-200ms boot time meeting ASIL-B timing constraints. | Use Scenario: Holding secure communication stacks (CAN FD, Ethernet AVB) and OTA update images. IC Role / Device Role / Timing Role: Dual-die flash providing isolated partitions for application and security firmware. Use Value: Hardware sector protection prevents unauthorized overwrite of critical bootloader sections. |
| Electric Powertrain Inverter | Vehicle Infotainment Head Unit |
Use Scenario: Storing motor control firmware and calibration maps subject to frequent field updates. IC Role / Device Role / Timing Role: High-reliability firmware storage with 4KB subsector erase for incremental patch deployment. Use Value: Eliminates need for full 256KB sector erase during minor firmware revisions, extending flash endurance. | Use Scenario: Hosting multimedia OS, UI assets, and application binaries requiring fast sequential read access. IC Role / Device Role / Timing Role: High-bandwidth code storage supporting XIP execution of Linux kernel modules. Use Value: Octal DTR interface delivers >300 MB/s sustained read throughput for UI responsiveness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B104QN-SXIT | 4-Mbit FRAM, 10^14 write cycles, no write delay, but lower density and no octal DTR | Used where frequent small writes dominate over read bandwidth; unsuitable for XIP boot | Select when endurance and write latency outweigh density and speed requirements |
| S25HL512TDPMHI010 | Same die and density, but with quad SPI (not octal DTR) interface and 133MHz max clock | Targeted at cost-sensitive designs where 200MHz DTR timing and 400MT/s are not required | Choose for legacy SPI-based platforms needing drop-in replacement without interface redesign |
Compared with CY15B104QN-SXIT, S25HL512TFAMHI010 delivers 128× higher density and 100× faster read throughput but lacks FRAM's unlimited write endurance; versus S25HL512TDPMHI010, it enables 50% higher data rate and tighter boot timing at the cost of increased layout complexity for octal routing.
Availability
S25HL512TFAMHI010 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, electric powertrain inverters, and vehicle infotainment head units requiring stable component supply across long production lifecycles.
Supply support for S25HL512TFAMHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and memory solutions for safety-critical systems.
This part belongs to the Semper™ family of automotive-grade NOR flash devices, designed specifically for real-time, high-reliability code storage and execution in ISO 26262-compliant electronic control units.
FAQ
What is the maximum operating temperature range for S25HL512TFAMHI010?
The device is rated for −40°C to +105°C ambient temperature and qualified to AEC-Q100 Grade 2 standards, making it suitable for under-hood automotive applications including engine control and powertrain modules where thermal stress is significant.
Does S25HL512TFAMHI010 support execute-in-place (XIP) operation?
Yes, it supports XIP via octal DTR interface with configurable latency modes. The device delivers deterministic read timing and low-latency instruction fetch, enabling direct CPU execution from flash without copying to RAM-critical for fast-boot automotive ECUs.
How does the dual-die stack affect PCB layout compared to single-die alternatives?
The dual-die stack integrates two 256-Mbit dies into one 24-pin WSON package, eliminating the need for two separate flash ICs and associated routing. This reduces board area by ~35% and simplifies signal integrity design for high-speed octal DTR traces.
Is hardware write protection (WP#) active-high or active-low on this device?
WP# is active-low: asserting the pin low enables hardware-based write protection for all sectors. When held high or floating (with internal pull-up), software-controlled protection remains available via status register bits.
S25HL512TFAMHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HL-T
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25HL512TFAMHI010 FAQ
1.How can I place an order for S25HL512TFAMHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25HL512TFAMHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25HL512TFAMHI010 reliable?
The price and inventory of S25HL512TFAMHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25HL512TFAMHI010 is usually 5 days.
3.What payment methods are accepted for S25HL512TFAMHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25HL512TFAMHI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25HL512TFAMHI010?
S25HL512TFAMHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25HL512TFAMHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25HL512TFAMHI010?
For technical support, including S25HL512TFAMHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25HL512TFAMHI010 requirements.
6.How does Aetrix verify that S25HL512TFAMHI010 is sourced from the original manufacturer or authorized distributors?
All S25HL512TFAMHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25HL512TFAMHI010 meets industry standards.
7.What is the process for return or replacement of S25HL512TFAMHI010?
All S25HL512TFAMHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S25HL512TFAMHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25HL512TFAMHI010 part is unused and in its original packaging.
Return procedure for S25HL512TFAMHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25HL512TFAMHI010 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

