Infineon Technologies S25HS02GTDPBHV153
- Part No.:
- S25HS02GTDPBHV153
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25HS02GTDPBHV153.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,474
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Product details
Overview
S25HS02GTDPBHV153 from Infineon is a 2-Gb Dual Die Package (DDP) SEMPER™ NOR flash memory with Quad SPI interface, 1.8 V/3.0 V dual supply support, ISO 26262 ASIL-B compliant functional safety architecture, and 24-ball 8 × 8 mm BGA package. It delivers up to 102 MBps DDR read throughput, supports uniform/hybrid sector architectures (4 KB and 256 KB sectors), and integrates SECDED ECC, SafeBoot, and EnduraFlex™ high-endurance partitions for automotive boot code storage.
For engineers reviewing the S25HS02GTDPBHV153 datasheet, S25HS02GTDPBHV153 pinout, S25HS02GTDPBHV153 application, or S25HS02GTDPBHV153 equivalent, key selection criteria include ASIL-B compliance status, Quad SPI DDR timing margins, 4 KB sector erase endurance (300k cycles), hybrid sector configuration flexibility, and BGA thermal/mechanical compatibility in space-constrained ADAS ECUs.
Technical Context
This device implements Infineon's 45-nm MIRRORBIT™ technology with two bits per cell and integrates an embedded microcontroller for command execution, ECC (SECDED), Data Integrity CRC, and SafeBoot recovery logic. Its EnduraFlex™ architecture enables independent endurance and retention tuning across memory partitions.
The 24-ball BGA package consolidates two 1-Gb dies in a monolithic DDP configuration with shared control signals (CS#, CK, DQ[3:0]), supporting simultaneous or interleaved access. Sector protection includes legacy block lock and advanced per-sector write enable via status registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (2 × 1 Gb die in DDP configuration) |
| Interface Protocol | Quad SPI (1S-4S-4S, 1S-4D-4D, 4S-4S-4S, 4S-4D-4D), Dual SPI, standard SPI |
| Max Read Throughput | 102 MBps (DDR mode, 102 MHz clock) |
| Endurance (Main Array) | 2,560,000 program-erase cycles - enables frequent firmware updates in telematics gateways |
| Data Retention | 25 years at +85°C - validated for automotive ECU lifetime requirements |
| Supply Voltage | 1.7–2.0 V (HS-T) or 2.7–3.6 V (HL-T) - supports dual-rail system power domains |
| Operating Temperature | –40°C to +125°C (AEC-Q100 Grade 1) - qualified for engine bay and ADAS sensor modules |
Pinout & Package
Package: 24-ball BGA, 8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable signal; drives device into Standby when HIGH, except during internal operations |
| CK | Clock Input | Rising-edge latched in SDR; both edges used in DDR for address/data transfer synchronization |
| DQ0 / SI | Serial Input / I/O | Single-bit input in SPI mode; primary data line in Quad/Dual modes |
| DQ1 / SO | Serial Output / I/O | Single-bit output in SPI mode; secondary data line in Quad/Dual modes |
| DQ2 / WP# | Write Protect / I/O | Optional hardware write lock; weak internal pull-up allows floating if unused in Quad mode |
| DQ3 / RESET# | Reset / I/O | Configurable as hardware reset (active-low) or Quad I/O; weak pull-up ensures safe default HIGH state |
| VCC | Core Power Supply | Accepts 1.7–2.0 V or 2.7–3.6 V; separate regulation required per voltage grade |
| VSS | Ground | Reference return path for all I/O and core logic; requires low-impedance PCB plane |
Key Features
| Feature | Design Value |
|---|---|
| ISO 26262 ASIL-B Compliance | Validated functional safety architecture with SafeBoot initialization reporting and configuration corruption detection |
| EnduraFlex™ Partitioning | Independent endurance (up to 2.56M cycles) and retention (25 yr) settings per memory region |
| SECDED ECC | On-the-fly single-bit error correction and double-bit error detection across full memory array |
| Hybrid Sector Architecture | Flexible 4 KB top/bottom + 256 KB main array layout for bootloader + application code separation |
| OTP Secure Silicon | 1024-byte one-time-programmable region for cryptographic keys and device identity storage |
Applications
| Automotive Boot Memory | ADAS Sensor Firmware Storage |
|---|---|
Use Scenario: Storing boot code and secure boot loader for automotive microcontrollers in domain controllers. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with deterministic read latency and SafeBoot validation on power-up. Use Value: ASIL-B compliance and 25-year retention ensure functional safety integrity over vehicle lifetime without refresh. | Use Scenario: Holding calibrated firmware and runtime parameters for radar/LiDAR processing units. IC Role / Device Role / Timing Role: High-reliability code storage with 102 MBps DDR read speed to feed real-time DSP pipelines. Use Value: Hybrid sector architecture isolates critical calibration data in 4 KB sectors with 300k-cycle endurance. |
| Telematics Gateway Update Storage | Infotainment System Code Execution |
Use Scenario: Hosting OTA update images and rollback partitions in cellular-connected telematics modules. IC Role / Device Role / Timing Role: Dual-die DDP structure enables parallel erase/program operations to reduce update window time. Use Value: 2.56M program-erase cycles support frequent field updates over 10+ years of service life. | Use Scenario: Executing application code directly from flash (XIP) in head-unit SoCs with limited RAM. IC Role / Device Role / Timing Role: Quad SPI DDR interface delivers sustained bandwidth for instruction fetch under real-time OS scheduling. Use Value: Wrapped burst reads minimize cache miss penalties during sequential code execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability automotive NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25HS02GTDPBHV153 (legacy) | Same datasheet, identical electrical specs and pinout; rebranded post-acquisition by Infineon | No functional difference; same AEC-Q100 Grade 1 qualification and ASIL-B documentation | Select for continuity in existing designs certified with Cypress branding |
| Infineon S25HS02GTDPBHV200 | Same DDP die, but 200-ball TFBGA package (12 × 12 mm); different thermal profile and board layout | Used where higher thermal dissipation or routing density is required; not drop-in compatible | Choose only when mechanical redesign accommodates larger footprint and pitch |
Compared with S25HS02GTDPBHV153, the Cypress-branded variant offers identical functionality and qualification for legacy design reuse, while the HV200 variant trades compact 8×8 mm BGA for enhanced thermal performance at the cost of PCB area and layout compatibility.
Availability
S25HS02GTDPBHV153 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, telematics gateways, and infotainment systems requiring stable component supply, long-term lifecycle assurance, and ASIL-B-certified flash memory.
Supply support for S25HS02GTDPBHV153 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and safety-critical memory solutions, with global R&D and manufacturing infrastructure.
The SEMPER™ Flash product line targets functional safety–critical automotive and industrial applications, delivering ASIL-B–compliant NOR flash with integrated ECC, SafeBoot, and EnduraFlex™ endurance partitioning.
FAQ
Is S25HS02GTDPBHV153 pin-compatible with earlier Cypress S25HS02GT devices?
Yes - this part retains identical 24-ball BGA pinout, signal definitions, and timing specifications as the pre-acquisition Cypress S25HS02GT series. Mechanical and electrical integration requires no changes; only branding and documentation reflect Infineon ownership.
What is the role of the DQ3 / RESET# pin in Quad SPI mode?
In Quad SPI mode, DQ3 functions exclusively as a bidirectional data line (DQ3). The RESET# function is disabled when Quad SPI is active; hardware reset must instead be implemented via CS# deassertion sequence or external circuitry if required during Quad operation.
Does the 25-year data retention apply to all operating temperatures?
No - the 25-year retention is specified at +85°C ambient. At +125°C (Grade 1), retention is reduced to 10 years per Infineon's reliability characterization; full specification is documented in the device's Qualification Report Q001-28767.
Can the 4 KB sectors be programmed independently of 256 KB sectors?
Yes - the hybrid sector architecture allows independent programming and erasing of any 4 KB or 256 KB sector. Each sector has its own lock bit; 4 KB sectors support faster erase (95 KBps) and higher endurance (300k cycles), making them ideal for parameter storage.
S25HS02GTDPBHV153 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 1.7ms
- Access Time:
- 6 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (8x8)
S25HS02GTDPBHV153 FAQ
1.How can I place an order for S25HS02GTDPBHV153 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25HS02GTDPBHV153 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25HS02GTDPBHV153 reliable?
The price and inventory of S25HS02GTDPBHV153 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25HS02GTDPBHV153 is usually 5 days.
3.What payment methods are accepted for S25HS02GTDPBHV153?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25HS02GTDPBHV153 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25HS02GTDPBHV153?
S25HS02GTDPBHV153 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25HS02GTDPBHV153 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25HS02GTDPBHV153?
For technical support, including S25HS02GTDPBHV153 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25HS02GTDPBHV153 requirements.
6.How does Aetrix verify that S25HS02GTDPBHV153 is sourced from the original manufacturer or authorized distributors?
All S25HS02GTDPBHV153 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25HS02GTDPBHV153 meets industry standards.
7.What is the process for return or replacement of S25HS02GTDPBHV153?
All S25HS02GTDPBHV153 units undergo pre-shipment inspection (PSI). If there is an issue with S25HS02GTDPBHV153, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25HS02GTDPBHV153 part is unused and in its original packaging.
Return procedure for S25HS02GTDPBHV153:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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