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Infineon Technologies S26HL02GTFGBHB040

Part No.:
S26HL02GTFGBHB040
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26HL02GTFGBHB040.pdf
Description:
IC FLASH 2GBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,474

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Product details

Overview

S26HL02GTFGBHB040 from Infineon is a 2 Gb (256 MB) automotive-grade SEMPER™ NOR Flash memory with HYPERBUS™ DDR interface, 1.8 V core supply (HS-T), 24-ball BGA package, and ISO 26262 ASIL-B compliance. It delivers up to 332 MBps read throughput, supports 4 KB/256 KB hybrid sector architecture, includes on-die SECDED ECC, and targets boot code storage in ADAS and infotainment ECUs.

For engineers reviewing the S26HL02GTFGBHB040 datasheet, S26HL02GTFGBHB040 pinout, S26HL02GTFGBHB040 application, or S26HL02GTFGBHB040 equivalent, key selection criteria include HYPERBUS™ DDR timing alignment with DS strobe, dual-die package thermal derating, AEC-Q100 Grade 2 temperature range (-40 °C to +105 °C), and OTP secure silicon region configuration for firmware authentication.

Technical Context

This device implements Infineon's 45-nm MIRRORBIT™ technology with two bits per cell and integrates dual 1 Gb dies in a single 24-ball BGA. It supports both legacy ×1 SPI (SDR, up to 20.75 MBps) and HYPERBUS™ ×8 DDR (up to 332 MBps), with command/address/data transferred in DDR fashion over DQ[7:0] using CK/CK# crossing detection.

The interface includes dedicated DS output for read-data capture synchronization, RSTO# open-drain reset status indicator, and INT# interrupt signaling for background operations. Internal error handling comprises interface CRC, array data integrity CRC, SafeBoot initialization reporting, and hardware-managed sector erase status tracking during power loss.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 2 Gb (256 MB) in dual-die package (DDP), enabling compact boot storage without external multiplexing
Interface speed HYPERBUS™ DDR at 166 MHz → 332 MBps sustained read; eliminates parallel bus routing complexity
Data integrity On-die SECDED ECC corrects single-bit errors and detects double-bit errors in main array reads/writes
Endurance & retention 2.56M program-erase cycles (256 KB sectors); 25-year data retention at +105 °C - validated for automotive life cycle
Supply voltage 1.7–2.0 V core (HS-T), 1.7–2.0 V I/O (VCCQ); separate VSS/VSSQ grounds reduce noise coupling in high-speed DDR mode
Temperature grade AEC-Q100 Grade 2 (−40 °C to +105 °C); qualified for engine bay and domain controller deployment
Sector architecture Hybrid split: thirty-two 4 KB sectors at top/bottom + remaining 256 KB sectors - supports OTA update partitioning

Pinout & Package

Package: 24-ball BGA, 8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant. Ball layout optimized for signal integrity in DDR mode with dedicated VCCQ/VSSQ pairs and differential clock routing.

Pin/Terminal Circuit Role Design Meaning
CS# Chip Select Active-low enable; all transactions begin/end with CS# edge; drives outputs to Hi-Z when deasserted
CK / CK# Clock inputs Complementary (not true differential) signals; rising-edge or crossing-aligned latching; supports single-ended or differential clock modes
DS Data Strobe output Edge-aligned with read data on DQ[7:0]; enables precise capture timing in high-speed systems without external PLL
DQ[7:0] Bidirectional data bus ×8 DDR data path for HYPERBUS™; reconfigured as SI/SO in legacy SPI mode - no pin remapping required
RESET# Hardware reset input Optional active-low reset with internal weak pull-up; forces POR and places DQ/DS in Hi-Z state
RSTO# Reset output Open-drain POR status indicator; blocks all transactions while LOW; used for system-level synchronization
INT# Interrupt output Open-drain event notifier (e.g., erase completion, error condition); requires external pull-up
VCC / VSS Core power/ground 1.7–2.0 V core supply; separate analog/digital ground reduces switching noise in MIRRORBIT™ array
VCCQ / VSSQ I/O power/ground 1.7–2.0 V I/O supply; isolated from core rails to maintain signal integrity on 8-bit DDR bus

Key Features

Feature Design Value
ISO 26262 ASIL-B compliance Validated functional safety evidence package supports automotive safety case development without external safety monitor
HYPERBUS™ DDR + DS strobe Eliminates need for source-synchronous clock forwarding; DS provides deterministic read-data valid window independent of board skew
OTP Secure Silicon Region (SSR) 1024-byte one-time-programmable area for cryptographic keys or immutable boot configuration - prevents runtime tampering
SafeBoot initialization reporting Detects corrupted configuration registers or failed POR sequence and triggers recovery before host fetches invalid boot code
Hybrid sector architecture Enables simultaneous OTA update (4 KB sectors) and persistent log storage (256 KB sectors) within same device - no external flash partitioning

Applications

ADAS Domain Controller Boot Automotive Infotainment HMI

Use Scenario: Stores boot firmware and safety-critical microkernel for radar/Ethernet domain controllers requiring <100 ms cold-boot time.

IC Role / Device Role / Timing Role: Primary boot memory mapped via XIP; HYPERBUS™ DDR delivers 332 MBps sequential read to feed ARM Cortex-R5F instruction fetch pipeline.

Use Value: ASIL-B certification eliminates need for external safety monitor IC; SSR stores root-of-trust keys for secure boot chain validation.

Use Scenario: Hosts GUI assets, voice recognition models, and firmware updates in head-unit systems with concurrent display rendering and audio playback.

IC Role / Device Role / Timing Role: Secondary code/data storage accessed via DMA; hybrid sector architecture isolates 4 KB OTA update partitions from 256 KB media asset banks.

Use Value: 25-year data retention at +105 °C ensures firmware persistence across vehicle lifetime; DS-strobed reads prevent display tearing during burst transfers.

Electric Powertrain Gateway Vehicle OTA Update Module

Use Scenario: Stores CAN FD gateway firmware and real-time diagnostics logic in 800 V battery management communication modules.

IC Role / Device Role / Timing Role: Dual-die DDP provides redundancy margin; RSTO# synchronizes gateway reset with MCU POR during high-voltage startup sequencing.

Use Value: Interface CRC detects bit errors induced by EMI in high-power environments; SafeBoot reports misaligned configuration after voltage transients.

Use Scenario: Acts as secure staging area for signed OTA firmware images prior to authenticated flashing into main application memory.

IC Role / Device Role / Timing Role: Dedicated 4 KB sector bank holds signature verification metadata; SECDED ECC protects image integrity during transfer and storage.

Use Value: OTP SSR stores public key hash for signature verification; hybrid sector layout prevents partial overwrite during interrupted downloads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress S26KS512SDPBH020 512 Mb density, 166 MHz HYPERBUS™ DDR, same 24-ball BGA but HS-T only; lacks ASIL-B certification and SSR Targeted at non-safety-critical telematics modules; no functional safety documentation package Select when cost-sensitive designs omit ASIL requirements and require smaller code footprint
Infineon S26HL02GTSGHB020 Same 2 Gb density and ASIL-B compliance, but uses SOIC-16 package; no BGA thermal performance or DDR signal integrity optimization Suitable for prototyping or low-volume industrial gateways where manual soldering is preferred Select only for legacy PCB redesigns requiring through-hole or gull-wing footprint compatibility

Compared with S26HL02GTFGBHB040, the Cypress alternative trades safety certification and secure storage for lower unit cost and smaller footprint, while the Infineon SOIC variant sacrifices DDR signal integrity and thermal dissipation for assembly simplicity - neither matches the AEC-Q100 Grade 2 + BGA + HYPERBUS™ DDR + SSR combination.

Availability

S26HL02GTFGBHB040 is available at Aetrix Electronics and suitable for ADAS domain controllers, automotive infotainment head-units, and electric powertrain gateways requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualification.

Supply support for S26HL02GTFGBHB040 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and safety-certified memory solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.

The SEMPER™ Flash product line was designed specifically for automotive functional safety applications, integrating ISO 26262-aligned features like SafeBoot, interface CRC, and ASIL-B certified failure modes into NOR Flash architecture.

FAQ

Does S26HL02GTFGBHB040 support both HYPERBUS™ and legacy SPI interfaces simultaneously?

No - the interface mode is selected at power-on via hardware configuration pins (not software). HYPERBUS™ (×8 DDR) and legacy ×1 SPI are mutually exclusive operating modes. The device boots in legacy SPI by default unless configured otherwise using SFDP register settings during initialization. Both modes share the same DQ[7:0] pins but differ in clocking, strobe usage, and transaction framing.

What is the purpose of the RSTO# pin, and how does it differ from RESET#?

RSTO# is an open-drain output that signals internal power-on reset (POR) status, transitioning from LOW to high-impedance after timeout - allowing external pull-up to assert system reset. RESET# is an input that triggers immediate POR when pulled LOW. RSTO# blocks all transactions while active; RESET# does not block ongoing operations but forces reinitialization upon release.

Can the 4 KB sectors be programmed independently of the 256 KB sectors?

Yes - the hybrid sector architecture allows independent program/erase operations on any 4 KB or 256 KB sector. Each sector has individual protection bits, and the OTP SSR resides in a dedicated 1024-byte region outside both sector types. Programming a 4 KB sector uses the same command set as 256 KB sectors but with different address mapping and endurance rating (300K vs. 2.56M cycles).

Is the DS (Data Strobe) signal required for reliable read operation in HYPERBUS™ mode?

Yes - DS is mandatory for HYPERBUS™ DDR read operations. It toggles synchronously with DQ[7:0] output edges and defines the valid data window. Unlike clock-forwarding schemes, DS is generated internally and accounts for die-to-die skew in the dual-die package. Omitting DS connection results in undetermined data capture timing and violates JEDEC JESD251 xSPI compliance.

S26HL02GTFGBHB040 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SEMPER™
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
2Gbit
Memory Organization:
256M x 8
Memory Interface:
HyperBus
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (8x8)

S26HL02GTFGBHB040 FAQ

1.How can I place an order for S26HL02GTFGBHB040 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26HL02GTFGBHB040 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26HL02GTFGBHB040 reliable?

The price and inventory of S26HL02GTFGBHB040 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26HL02GTFGBHB040 is usually 5 days.

3.What payment methods are accepted for S26HL02GTFGBHB040?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26HL02GTFGBHB040 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26HL02GTFGBHB040?

S26HL02GTFGBHB040 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26HL02GTFGBHB040 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26HL02GTFGBHB040?

For technical support, including S26HL02GTFGBHB040 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26HL02GTFGBHB040 requirements.

6.How does Aetrix verify that S26HL02GTFGBHB040 is sourced from the original manufacturer or authorized distributors?

All S26HL02GTFGBHB040 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26HL02GTFGBHB040 meets industry standards.

7.What is the process for return or replacement of S26HL02GTFGBHB040?

All S26HL02GTFGBHB040 units undergo pre-shipment inspection (PSI). If there is an issue with S26HL02GTFGBHB040, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26HL02GTFGBHB040 part is unused and in its original packaging.

Return procedure for S26HL02GTFGBHB040:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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