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Infineon Technologies S26HL02GTFGBHB043

Part No.:
S26HL02GTFGBHB043
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26HL02GTFGBHB043.pdf
Description:
IC FLASH 2GBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,231

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Product details

Overview

S26HL02GTFGBHB043 from Infineon Technologies is a 2 Gb (256 MB) SEMPER™ NOR Flash memory with HYPERBUS™ DDR interface, 1.8 V core supply (HS-T grade), 24-ball BGA package, and ISO 26262 ASIL-B compliance for automotive safety-critical boot code storage in ADAS ECUs.

For engineers reviewing the S26HL02GTFGBHB043 datasheet, S26HL02GTFGBHB043 pinout, S26HL02GTFGBHB043 application, or S26HL02GTFGBHB043 equivalent, this device delivers 332 MBps read throughput via HYPERBUS™ DDR at 166 MHz, supports dual-die package (DDP), includes on-chip ECC (SECDED), OTP secure silicon region (1024 bytes), and hybrid sector architecture with thirty-two 4 KB sectors.

Technical Context

This device implements Infineon's 45-nm MIRRORBIT™ technology with two bits per cell, enabling high-density NOR Flash in a multi-chip package. It supports both legacy ×1 SPI (SDR, up to 20.75 MBps) and HYPERBUS™ ×8 DDR (up to 332 MBps), with data strobe (DS) synchronized to CK/CK# for precise high-speed read capture.

The architecture includes configurable page programming buffers (256 B or 512 B), uniform or hybrid sector layouts (4 KB top/bottom + 256 KB main), and functional safety features: SafeBoot initialization reporting, interface/data integrity CRC, and built-in SECDED ECC correcting single-bit errors and detecting double-bit errors in the memory array.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 2 Gb (256 MB) in dual-die package (DDP), enabling compact boot storage without external multiplexing
Interface mode HYPERRBUS™ DDR (×8) with DS signal - enables deterministic 332 MBps reads at 166 MHz clock, edge-aligned to DS transitions
Supply voltage 1.7–2.0 V (HS-T grade) - optimized for low-power automotive domains requiring stable 1.8 V rail operation
Erase endurance 2.56M cycles (256 KB sectors); 300k cycles (4 KB sectors) - supports frequent firmware updates in telematics gateways
Data retention 25 years minimum - validated for long-life deployment in engine control modules and infotainment head units
Safety certification ISO 26262 ASIL-B compliant, ASIL-D ready - meets functional safety requirements for boot ROM in ASIL-B systems
OTP region 1024-byte Secure Silicon Region (SSR) - stores immutable keys or calibration data protected from overwrite

Pinout & Package

Package: 24-ball BGA, 8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant. Compatible with standard reflow profiles; ultrasonic cleaning prohibited.

Pin/Terminal Circuit Role Design Meaning
CS# Chip Select Active-low enable; all transactions begin/end with CS# edge transitions; places outputs in Hi-Z when deasserted
CK / CK# Clock input pair Single-ended (CK only) or differential (CK/CK#) timing reference; not true LVDS - requires system-level termination design
DS Data Strobe output Read-only synchronization signal; toggles during active read bursts to align DQ[7:0] data edges for reliable capture
DQ[7:0] Bidirectional data bus 8-bit serial I/O: functions as SI/SO in SPI mode; full bidirectional ×8 in HYPERBUS™ mode with DDR transfers
RESET# Hardware reset input Optional active-low reset with internal weak pull-up; forces POR and returns device to array read state
RSTO# Reset output Open-drain POR indicator; blocks all transactions while LOW; used for system-level reset coordination
VCC / VSS Core power / ground 1.7–2.0 V core supply (HS-T); separate VCCQ/VSSQ for I/O domain ensures signal integrity at 166 MHz DDR

Key Features

Feature Design Value
HYPERBUS™ DDR interface Delivers 332 MBps sustained read bandwidth using 8-bit bus + DDR + DS strobe - eliminates need for parallel NOR in high-performance boot paths
Hybrid sector architecture Configurable 4 KB sectors (top/bottom or split) + 256 KB main sectors - enables fine-grained OTA update partitioning without sacrificing bulk storage efficiency
On-chip SECDED ECC Corrects single-bit errors and detects double-bit errors in real time during read - reduces host-side error handling overhead in safety-critical firmware execution
SafeBoot initialization Reports boot failures, detects configuration corruption, and provides recovery options - ensures deterministic startup behavior after power-on or reset
Interface & data integrity CRC Separate CRC engines for command/address/data transfers (interface CRC) and memory array contents (data CRC) - prevents silent data corruption across bus and storage layers

Applications

ADAS Domain Controller Boot Storage Automotive Gateway Firmware Repository

Use Scenario: Stores boot code and safety monitor firmware for radar/EPS domain controllers requiring ASIL-B compliance.

IC Role / Device Role / Timing Role: Primary boot ROM accessed via HYPERBUS™ DDR during cold start; provides deterministic <14-cycle initial access latency.

Use Value: 332 MBps read rate enables full boot image load in <100 ms; ASIL-B certification eliminates need for external safety co-processor.

Use Scenario: Hosts OTA-updatable application firmware and secure bootloader in vehicle communication gateways.

IC Role / Device Role / Timing Role: Dual-role storage: 4 KB sectors hold critical bootloader config; 256 KB sectors store application partitions.

Use Value: 300k erase cycles on 4 KB sectors support >10 years of daily OTA updates; SSR stores immutable root-of-trust keys.

Infotainment Head Unit Code Storage Engine Control Module (ECM) Calibration Data

Use Scenario: Stores Linux kernel, UI assets, and middleware binaries in premium infotainment systems with fast boot requirements.

IC Role / Device Role / Timing Role: High-bandwidth code execution memory mapped via HYPERBUS™; supports linear burst reads for sequential instruction fetch.

Use Value: 25-year data retention guarantees UI assets remain intact over vehicle lifetime; VCCQ/VSSQ isolation maintains signal integrity at 166 MHz.

Use Scenario: Retains engine calibration maps, sensor compensation tables, and emission control parameters subject to regulatory audit.

IC Role / Device Role / Timing Role: Non-volatile parameter storage with hardware write protection; accessed via SPI for legacy ECU compatibility.

Use Value: Sector protection prevents accidental overwrite; interface CRC validates integrity of calibration data during read-before-use checks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash boot memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress S26HL02GTFA0BHB043 Same die, identical pinout and electrical specs, but HS-T grade with 1.8 V supply and industrial temperature range (−40 °C to +85 °C) Lacks AEC-Q100 qualification and ASIL-B certification - suitable for non-automotive industrial control, not safety-critical automotive Select when functional safety certification is not required and cost optimization is prioritized over automotive qualification
Infineon S26HL02GTFA0BHB043 Identical part number prefix but HL-T variant: 2.7–3.6 V supply, higher standby current (0.056 mA vs. 0.022 mA), same 256 KB sector erase performance Designed for 3.3 V systems; incompatible with 1.8 V core rails; unsuitable for low-power ADAS SoCs with tight power budgets Choose only for legacy 3.3 V designs where voltage compatibility overrides power efficiency goals

Compared with S26HL02GTFGBHB043, the HS-T industrial variant lacks automotive qualification and safety features, while the HL-T version trades lower power for higher voltage operation - making the GBHB043 uniquely suited for ASIL-B automotive boot applications demanding 1.8 V efficiency and certified safety.

Availability

S26HL02GTFGBHB043 is available at Aetrix Electronics and suitable for ADAS domain controllers, automotive gateways, infotainment head units, and engine control modules requiring stable component supply with long-term lifecycle assurance.

Supply support for S26HL02GTFGBHB043 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

This device belongs to the SEMPER™ Flash product line, engineered specifically for functional safety-critical boot and firmware storage in automotive and industrial systems requiring ISO 26262 compliance and high reliability.

FAQ

What interface modes does S26HL02GTFGBHB043 support, and how are they selected?

The device supports both legacy ×1 SPI (SDR) and HYPERBUS™ ×8 DDR interfaces. Interface selection is determined by hardware configuration at power-on: default boot uses SPI unless HYPERBUS™ is enabled via SFDP register settings or factory configuration. No external mode pins are required - the host controller initiates the desired protocol after reset.

Does S26HL02GTFGBHB043 require external ECC handling by the host processor?

No. The device integrates on-die SECDED (Single Error Correction, Double Error Detection) logic that automatically corrects single-bit errors and flags double-bit errors during read operations. Host software only needs to monitor status registers for uncorrectable errors; no external ECC computation or buffering is required.

How is the hybrid sector architecture configured - is it fixed or programmable?

The sector architecture is factory-configured and fixed per part number: S26HL02GTFGBHB043 implements the hybrid split configuration - thirty-two 4 KB sectors at both top and bottom of address space, with remaining regions as 256 KB sectors. This layout cannot be altered in-system and is defined in the SFDP parameter table.

What is the role of the RSTO# pin, and can it drive an external microcontroller reset?

RSTO# is an open-drain output that asserts LOW during internal power-on reset (POR) and releases to high-impedance after a user-defined timeout. With an external pull-up resistor, it transitions HIGH to signal reset completion. It is designed to synchronize system-level reset sequencing and can directly drive compatible MCU reset inputs when properly terminated.

S26HL02GTFGBHB043 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SEMPER™
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
2Gbit
Memory Organization:
256M x 8
Memory Interface:
HyperBus
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (8x8)

S26HL02GTFGBHB043 FAQ

1.How can I place an order for S26HL02GTFGBHB043 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26HL02GTFGBHB043 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26HL02GTFGBHB043 reliable?

The price and inventory of S26HL02GTFGBHB043 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26HL02GTFGBHB043 is usually 5 days.

3.What payment methods are accepted for S26HL02GTFGBHB043?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26HL02GTFGBHB043 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26HL02GTFGBHB043?

S26HL02GTFGBHB043 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26HL02GTFGBHB043 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26HL02GTFGBHB043?

For technical support, including S26HL02GTFGBHB043 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26HL02GTFGBHB043 requirements.

6.How does Aetrix verify that S26HL02GTFGBHB043 is sourced from the original manufacturer or authorized distributors?

All S26HL02GTFGBHB043 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26HL02GTFGBHB043 meets industry standards.

7.What is the process for return or replacement of S26HL02GTFGBHB043?

All S26HL02GTFGBHB043 units undergo pre-shipment inspection (PSI). If there is an issue with S26HL02GTFGBHB043, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26HL02GTFGBHB043 part is unused and in its original packaging.

Return procedure for S26HL02GTFGBHB043:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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