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Infineon Technologies S26HL02GTFGBHB050
- Part No.:
- S26HL02GTFGBHB050
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26HL02GTFGBHB050.pdf
- Description:
- IC FLASH 2GBIT HYPERBUS 24FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,597
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Product details
Overview
S26HL02GTFGBHB050 from Infineon is a 2 Gb (256 MB) automotive-grade SEMPER™ NOR Flash memory with HYPERBUS™ DDR interface, 1.8 V core supply, and AEC-Q100 Grade 2 qualification (-40 °C to +105 °C). It uses 45-nm MIRRORBIT™ technology in a dual-die package (DDP), supports 332 MBps read throughput via DDR HYPERBUS™ at 166 MHz, and includes integrated SECDED ECC, interface/data integrity CRC, and SafeBoot for functional safety-critical boot applications.
For engineers reviewing the S26HL02GTFGBHB050 datasheet, S26HL02GTFGBHB050 pinout, S26HL02GTFGBHB050 application, or S26HL02GTFGBHB050 equivalent, key selection criteria include ASIL-B compliance, HYPERBUS™ vs. legacy SPI interface mode support, 4 KB/256 KB hybrid sector architecture, OTP secure silicon region (1024 bytes), and 24-ball 8×8 mm BGA package compatibility with high-speed PCB layout constraints.
Technical Context
This device implements a dual-die MCP architecture with shared control signals across two 1 Gb dies, enabling unified addressing and seamless 2 Gb capacity. Its HYPERBUS™ interface operates in DDR mode with data strobe (DS) synchronization, supporting edge-aligned read data capture and center-aligned command/address latching on CK/CK# transitions.
The flash supports three sector configurations-uniform 256 KB, hybrid grouped (32 × 4 KB top/bottom), and hybrid split (32 × 4 KB top + bottom)-with independent protection per sector. Boot defaults to legacy SPI (×1) or HYPERBUS™ (×8), and SFDP provides runtime discoverability of configuration, timing, and feature parameters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB) in dual-die package (2 × 1 Gb) |
| Interface Speed | 332 MBps DDR read (166 MHz clock, HYPERBUS™), 20.75 MBps SDR read (166 MHz, SPI) |
| Supply Voltage | 1.7–2.0 V (HS-T core), 1.7–2.0 V (HS-T I/O), compatible with low-power automotive domains |
| Data Integrity | SECDED ECC corrects 1-bit / detects 2-bit errors; interface & array CRC for end-to-end error detection |
| Endurance & Retention | 2.56M P/E cycles (main array), 300K P/E cycles (4 KB sectors), 25-year data retention |
| Sector Architecture | Configurable: uniform 256 KB, hybrid grouped (32 × 4 KB top/bottom), or hybrid split (top + bottom) |
| Functional Safety | ISO 26262 ASIL-B compliant, ASIL-D ready; SafeBoot reports initialization failures and enables recovery |
Pinout & Package
Package: 24-ball BGA, 8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant, industrial + automotive thermal profile.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable signal; initiates all transactions; drives outputs to Hi-Z when deasserted |
| CK / CK# | Clock Input | Differential or single-ended clock pair; latches command/address/data on rising edge (CK) or crossing (CK/CK#) |
| DS | Data Strobe Output | Read-only output; toggles during HYPERBUS™ reads to synchronize edge-aligned DQ[7:0] data capture |
| DQ[7:0] | Bidirectional Data Bus | 8-bit serial bus for commands, addresses, and data; operates in ×1 SPI or ×8 HYPERBUS™ modes |
| RESET# | Hardware Reset Input | Optional active-low reset with internal weak pull-up; forces POR and places DQ/DS in Hi-Z |
| RSTO# | Reset Output | Open-drain POR indicator; blocks all transactions while LOW; used for system-level reset coordination |
| VCC / VSS | Core Power/Ground | 1.7–2.0 V core supply and return; decoupling critical for DDR timing stability |
| VCCQ / VSSQ | I/O Power/Ground | 1.7–2.0 V I/O supply and return; isolated from core to reduce noise coupling into DQ/DS paths |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-B Functional Safety Certification | Validated per ISO 26262 Part 5/6; enables use in automotive ADAS and domain controller boot memory without external safety monitoring |
| HYPERBUS™ DDR + Legacy SPI Dual Interface | Single device supports both high-bandwidth DDR (332 MBps) and legacy SPI (21 MBps) boot modes - eliminates need for interface translation logic |
| Flexible Sector Protection | Independent hardware lock bits per 4 KB or 256 KB sector prevent accidental erase/write in safety-critical firmware partitions |
| OTP Secure Silicon Region (SSR) | 1024-byte one-time-programmable area stores cryptographic keys, calibration data, or unique identifiers with permanent write-lock capability |
| SafeBoot Initialization Monitoring | Detects configuration corruption or failed power-on self-test and triggers automatic recovery or fault reporting via RSTO#/INT# |
Applications
| Automotive ADAS Domain Controller Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot code and safety-critical firmware for radar/EPS ECUs requiring deterministic startup within 100 ms after power-on. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with ASIL-B certified initialization path and SafeBoot validation before CPU execution. Use Value: Eliminates external safety monitor IC by providing built-in CRC, ECC, and boot failure reporting via RSTO#, reducing BOM count and board space. | Use Scenario: Holds field-upgradable firmware and configuration data for programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: High-reliability storage element with 25-year retention and 300K-cycle endurance in 4 KB sectors for frequent parameter updates. Use Value: Hybrid sector architecture isolates frequently rewritten configuration pages (4 KB) from stable firmware (256 KB), extending overall flash lifetime beyond 15 years. |
| Medical Imaging System Configuration Storage | Avionics Display Unit Boot ROM |
Use Scenario: Stores calibrated sensor profiles and DICOM metadata mapping tables in MRI/CT scanners where data integrity is mandated by IEC 62304 Class C. IC Role / Device Role / Timing Role: Secure, CRC-protected non-volatile storage with OTP SSR for immutable calibration signatures and audit logs. Use Value: Integrated interface CRC and array CRC provide traceable error detection chain from host controller to memory cell - satisfies regulatory evidence requirements. | Use Scenario: Provides certified boot image for DO-254-compliant display processors in commercial aircraft cockpit displays. IC Role / Device Role / Timing Role: AEC-Q100 Grade 1 qualified (−40 °C to +125 °C) NOR flash used as primary boot ROM with deterministic latency under EMI stress. Use Value: HYPERBUS™ DDR interface delivers 332 MBps read bandwidth to feed GPU texture caches during cold start, cutting boot time by >40% vs. SPI alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26HL02GTABHI010 | Same die, identical specs, but industrial grade (−40 °C to +85 °C), no AEC-Q100 qualification | Lacks ASIL-B certification and SafeBoot; unsuitable for automotive safety-critical boot | Select only for non-automotive industrial designs where extended temperature range is not required |
| Winbond W25Q80DVSNIG | 8 Mb SPI NOR, no HYPERBUS™, no ECC/CRC, no functional safety features, 3.3 V only | Targeted at cost-sensitive consumer MCU boot; lacks sector protection granularity and endurance | Use only in non-safety, non-automotive, low-bandwidth applications where 8 Mb capacity suffices |
Compared with S26HL02GTFGBHB050, the Cypress alternative offers identical functionality without automotive qualification, while the Winbond part lacks DDR interface, safety features, and scalability - making S26HL02GTFGBHB050 the sole choice for ASIL-B boot memory demanding >2 Gb density and 332 MBps throughput.
Availability
S26HL02GTFGBHB050 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLCs, medical imaging systems, and avionics display units requiring stable component supply with full AEC-Q100 Grade 2 traceability and long-term lifecycle support.
Supply support for S26HL02GTFGBHB050 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and safety-certified memory solutions.
The SEMPER™ Flash product line targets functional safety-critical applications including automotive ADAS, industrial automation, and medical devices - delivering ASIL-B certified NOR flash with integrated diagnostics, high endurance, and HYPERBUS™-enabled bandwidth.
FAQ
Does S26HL02GTFGBHB050 support both HYPERBUS™ and SPI interfaces simultaneously?
No - the device boots in either legacy SPI (×1) or HYPERBUS™ (×8) mode, selected at power-on via hardware strapping or SFDP configuration. Both interfaces share the same DQ[7:0], CS#, CK/CK#, and DS pins, but operate under mutually exclusive protocols and timing requirements. Switching requires full power cycle and reinitialization.
What is the purpose of the RSTO# pin and how does it differ from RESET#?
RSTO# is an open-drain output that signals internal power-on reset (POR) status - it goes LOW during POR and releases to high-impedance upon completion, allowing external pull-up to assert system reset. RESET# is an input that triggers POR when driven LOW. RSTO# enables coordinated system-level reset sequencing; RESET# provides manual or watchdog-initiated reset initiation.
Can the 4 KB sectors be programmed independently of the 256 KB sectors?
Yes - the hybrid sector architecture allows independent erase and program operations on any 4 KB or 256 KB sector. The 32 × 4 KB sectors (top/bottom or both) are fully addressable and protected separately. Programming uses the same 256/512-byte page buffer regardless of sector size, and endurance ratings differ: 300K cycles for 4 KB sectors vs. 2.56M cycles for 256 KB sectors.
Is the OTP Secure Silicon Region (SSR) accessible via standard SPI or HYPERBUS™ commands?
Yes - the 1024-byte SSR is mapped into the main address space and accessed using standard read/write/erase commands, but with additional lock bits. Once locked via dedicated SSR lock command, writes to the SSR become permanently disabled. Access requires no special interface mode - it functions identically over both SPI and HYPERBUS™, preserving design reuse across boot interface choices.
S26HL02GTFGBHB050 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (8x8)
S26HL02GTFGBHB050 FAQ
1.How can I place an order for S26HL02GTFGBHB050 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26HL02GTFGBHB050 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26HL02GTFGBHB050 reliable?
The price and inventory of S26HL02GTFGBHB050 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26HL02GTFGBHB050 is usually 5 days.
3.What payment methods are accepted for S26HL02GTFGBHB050?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26HL02GTFGBHB050 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26HL02GTFGBHB050?
S26HL02GTFGBHB050 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26HL02GTFGBHB050 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26HL02GTFGBHB050?
For technical support, including S26HL02GTFGBHB050 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26HL02GTFGBHB050 requirements.
6.How does Aetrix verify that S26HL02GTFGBHB050 is sourced from the original manufacturer or authorized distributors?
All S26HL02GTFGBHB050 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26HL02GTFGBHB050 meets industry standards.
7.What is the process for return or replacement of S26HL02GTFGBHB050?
All S26HL02GTFGBHB050 units undergo pre-shipment inspection (PSI). If there is an issue with S26HL02GTFGBHB050, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26HL02GTFGBHB050 part is unused and in its original packaging.
Return procedure for S26HL02GTFGBHB050:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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