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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S26HL02GTFGBHB053

Name: S26HL02GTFGBHB053
Brand: Infineon Technologies
SKU: S26HL02GTFGBHB053
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S26HL02GTFGBHB053

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 24-VBGA

Datasheet:: S26HL02GTFGBHB053.pdf

Description:: IC FLASH 2GBIT HYPERBUS 24FBGA

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Product details

Overview

S26HL02GTFGBHB053 from Infineon Technologies is a 2 Gb (256 MB) automotive-grade SEMPER™ NOR Flash memory with HYPERBUS™ and legacy SPI interfaces, built on 45-nm MIRRORBIT™ technology in a dual-die package (DDP), supporting 332 MBps DDR read throughput at 166 MHz, 2.7–3.6 V supply, and AEC-Q100 Grade 2 (–40 °C to +105 °C) operation for ADAS boot code storage.

For engineers reviewing the S26HL02GTFGBHB053 datasheet, S26HL02GTFGBHB053 pinout, S26HL02GTFGBHB053 application, or S26HL02GTFGBHB053 equivalent, this page delivers verified interface timing, sector protection granularity, ISO 26262 ASIL-B compliance status, OTP secure silicon region size, and HYPERBUS™ vs. SPI mode selection behavior - all critical for safety-critical boot memory qualification.

Technical Context

This device implements a dual-die MCP architecture with shared control signals across two 1 Gb dies, enabling uniform 256 KB or hybrid 4 KB/256 KB sector configurations. It supports both JEDEC JESD251-compliant xSPI and proprietary HYPERBUS™ protocols, with DDR read using CK/CK# differential clocking and DS strobe for edge-aligned data capture.

The memory integrates SECDED ECC, interface and array CRC, SafeBoot initialization reporting, and hardware reset via RESET# and RSTO# pins. Its endurance is rated at 2.56M P/E cycles for main array and 300K for 4 KB sectors, with 25-year data retention - validated under industrial-plus and automotive temperature grades.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	2 Gb (256 MB) in dual-die package (DDP), enabling compact high-capacity boot storage without external address multiplexing
Interface modes	HYPERBUS™ DDR (332 MBps @ 166 MHz) and legacy ×1 SPI SDR (21 MBps @ 166 MHz); selectable at power-up via configuration register
Supply voltage	2.7–3.6 V (HL-T grade), supporting standard 3.3 V rail systems with ±10% tolerance and low-standby current (56 µA)
Endurance & retention	2,560,000 program-erase cycles (256 KB sectors), 300,000 cycles (4 KB sectors), 25 years data retention at +105 °C
Sector architecture	Configurable: uniform 256 KB only; hybrid top/bottom 32×4 KB + rest 256 KB; or split 64×4 KB (top + bottom) + rest 256 KB
Safety certification	ISO 26262 ASIL-B compliant, ASIL-D ready; includes SafeBoot, interface CRC, array CRC, and SECDED ECC
OTP region	1024-byte Secure Silicon Region (SSR), organized as 32 × 32 bytes, for immutable key or configuration storage

Pinout & Package

24-ball BGA package, 8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant. Pin assignment conforms to JEDEC MO-270AB standard with dedicated VCCQ/VSSQ for I/O domain isolation.

Pin/Terminal	Circuit Role	Design Meaning
CS#	Chip Select	Active-low enable signal; initiates all transactions; drives outputs to high-Z when deasserted
CK / CK#	Differential clock input	Non-inverting/inverting clock pair for DDR timing; supports single-ended fallback (CK only, CK# floating)
DS	Data Strobe output	Edge-aligned strobe synchronized to read data on DQ[7:0]; enables reliable capture at >133 MHz
DQ[7:0]	Bidirectional data bus	8-bit serial bus for command/address/data; operates in ×1 SPI (DQ0/DQ1 only) or ×8 HYPERBUS™ mode
RESET#	Hardware reset input	Active-low asynchronous reset with internal weak pull-up; forces POR and places DQ/DS in high-Z
RSTO#	Reset output	Open-drain POR indicator; blocks all transactions while asserted; used for system-level synchronization
INT#	Interrupt output	Open-drain event notifier (e.g., erase completion, error detection); requires external pull-up
VCC / VSS	Core power / ground	1.7–2.0 V or 2.7–3.6 V core supply; decoupling required within 10 mm of ball for noise immunity
VCCQ / VSSQ	I/O power / ground	Independent 1.7–2.0 V or 2.7–3.6 V I/O domain; isolates signal integrity from core switching noise

Key Features

Feature	Design Value
HYPERBUS™ DDR interface	332 MBps read bandwidth at 166 MHz with DS-synchronized edge-aligned output, eliminating setup/hold margin constraints
ASIL-B functional safety	Full ISO 26262 lifecycle support including SafeBoot failure reporting, configuration corruption detection, and recovery path
Flexible sector protection	Individual 4 KB or 256 KB sector lock bits, enabling granular firmware partitioning for bootloader, OS, and application code
OTP Secure Silicon Region	1024-byte one-time-programmable area with write-lock capability, suitable for cryptographic keys or calibration constants
Multi-die DDP architecture	Two stacked 1 Gb dies sharing CS#, CK, DS, and DQ; reduces PCB footprint vs. discrete 2 Gb solutions while maintaining pin compatibility

Applications

ADAS Domain Controller Boot Memory

Automotive Instrument Cluster Firmware Storage

Use Scenario: Stores boot code and safety monitor firmware for radar/EPS ECUs requiring deterministic startup within 100 ms after power-on.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory interfaced via HYPERBUS™ DDR to MCU's flash controller; provides sub-50 ns random access latency.

Use Value: ASIL-B compliance and SafeBoot ensure boot integrity reporting; 332 MBps read rate enables full image load in <150 ms, meeting ASAM MCAL timing requirements.

Use Scenario: Holds instrument cluster GUI assets, gauge calibration tables, and OTA update staging area in AEC-Q100 Grade 2 environments.

IC Role / Device Role / Timing Role: Dual-interface NOR Flash supporting both legacy SPI (for diagnostics) and HYPERBUS™ (for fast GUI rendering).

Use Value: Hybrid sector architecture isolates 4 KB calibration sectors from 256 KB GUI partitions; 300K-cycle endurance ensures 15+ year field life with daily OTA updates.

Central Gateway ECU Secure Boot Storage

Electric Powertrain Inverter Firmware

Use Scenario: Stores root-of-trust public keys and signed bootloader images in a tamper-resistant configuration for vehicle-wide secure boot chain.

IC Role / Device Role / Timing Role: Trusted execution environment (TEE) companion memory; SSR holds immutable keys; ECC and CRC protect integrity during verification.

Use Value: OTP SSR prevents key overwrite; SECDED ECC corrects bit flips induced by radiation; 25-year retention guarantees key validity over vehicle lifetime.

Use Scenario: Hosts motor control firmware and real-time safety routines in high-temperature inverter modules operating up to +125 °C junction.

IC Role / Device Role / Timing Role: High-reliability NOR Flash with AEC-Q100 Grade 1 rating; operates continuously at +105 °C ambient with derated VCCQ.

Use Value: 2.56M P/E cycles allow frequent firmware updates during validation; deep power-down mode (5.2 µA) minimizes standby leakage in parked-vehicle state.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability automotive NOR Flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Cypress S26HL02GTFAFHB020	Same die, identical 2 Gb DDP architecture and HYPERBUS™ interface, but HL-T grade only (–40 °C to +105 °C), no Grade 1 option	Lacks AEC-Q100 Grade 1 support; unsuitable for under-hood inverter applications requiring +125 °C operation	Select when Grade 2 suffices and cost sensitivity outweighs extended temperature need
Infineon S26HL02GTFGBHB020	Identical package and pinout, but HS-T (1.7–2.0 V) supply; incompatible with 3.3 V systems without level-shifting	Requires separate 1.8 V rail; not drop-in compatible with existing 3.3 V designs using S26HL02GTFGBHB053	Choose only for new 1.8 V platforms targeting lower active current (99 mA vs. 110 mA DDR read)

Compared with S26HL02GTFAFHB020 and S26HL02GTFGBHB020, the S26HL02GTFGBHB053 uniquely combines HL-T voltage range, AEC-Q100 Grade 2, and full pin/package compatibility - making it the sole option for retrofitting 3.3 V automotive controllers needing extended temperature support without redesign.

Availability

S26HL02GTFGBHB053 is available at Aetrix Electronics and suitable for ADAS domain controllers, automotive instrument clusters, central gateway ECUs, and electric powertrain inverters requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant traceability.

Supply support for S26HL02GTFGBHB053 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and safety-certified memory solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.

This part belongs to the SEMPER™ Flash product line, engineered specifically for functional safety-critical automotive applications requiring ISO 26262 ASIL-B compliance, high endurance, and deterministic boot performance - not general-purpose code storage.

FAQ

Does S26HL02GTFGBHB053 support both HYPERBUS™ and SPI interfaces simultaneously?

No. The device boots in either HYPERBUS™ (×8) or legacy ×1 SPI mode based on configuration register settings at power-up; interface selection is static per power cycle and cannot be dynamically switched during operation. Both modes share the same DQ[7:0] pins but use different command sets and timing protocols.

What is the function of the RSTO# pin, and how does it differ from RESET#?

RSTO# is an open-drain output that asserts LOW during internal power-on reset (POR) and releases to high-impedance upon completion, allowing external pull-up to signal system readiness. RESET# is an input that triggers POR when pulled LOW. RSTO# blocks all transactions while active; RESET# does not block ongoing operations if asserted mid-transaction.

Can the 4 KB sectors be programmed independently of the 256 KB sectors?

Yes. Sector erase and program operations are fully independent per sector. The 32×4 KB sectors (top/bottom/hybrid) have separate lock bits and endurance ratings (300K cycles), allowing them to be updated more frequently than main 256 KB sectors (2.56M cycles) without affecting overall array longevity.

Is the 1024-byte OTP Secure Silicon Region (SSR) accessible via standard read commands?

No. The SSR is write-once and read-protected; access requires unlocking via specific command sequences and is restricted to dedicated SSR read/write instructions defined in the datasheet. Standard array read commands return undefined data when addressing SSR addresses.

S26HL02GTFGBHB053 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: SEMPER™

Package/Case:: 24-VBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR (SLC)

Memory Size:: 2Gbit

Memory Organization:: 256M x 8

Memory Interface:: HyperBus

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 24-FBGA (8x8)

S26HL02GTFGBHB053 FAQ

1.How can I place an order for S26HL02GTFGBHB053 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26HL02GTFGBHB053 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26HL02GTFGBHB053 reliable?

The price and inventory of S26HL02GTFGBHB053 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26HL02GTFGBHB053 is usually 5 days.

3.What payment methods are accepted for S26HL02GTFGBHB053?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26HL02GTFGBHB053 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26HL02GTFGBHB053?

S26HL02GTFGBHB053 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26HL02GTFGBHB053 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26HL02GTFGBHB053?

For technical support, including S26HL02GTFGBHB053 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26HL02GTFGBHB053 requirements.

6.How does Aetrix verify that S26HL02GTFGBHB053 is sourced from the original manufacturer or authorized distributors?

All S26HL02GTFGBHB053 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26HL02GTFGBHB053 meets industry standards.

7.What is the process for return or replacement of S26HL02GTFGBHB053?

All S26HL02GTFGBHB053 units undergo pre-shipment inspection (PSI). If there is an issue with S26HL02GTFGBHB053, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26HL02GTFGBHB053 part is unused and in its original packaging.

Return procedure for S26HL02GTFGBHB053:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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