Infineon Technologies S26HL02GTFGBHM040

Overview

S26HL02GTFGBHM040 from Infineon Technologies is a 2 Gb (256 MB) automotive-grade SEMPER™ NOR Flash memory with HYPERBUS™ DDR interface, 1.8 V core supply (HS-T), 24-ball BGA package, and ISO 26262 ASIL-B compliance. It delivers up to 332 MBps read throughput, supports 4 KB/256 KB hybrid sector architecture, and integrates SECDED ECC, interface CRC, SafeBoot, and OTP secure silicon region for functional safety-critical boot and code storage in ADAS ECUs.

For engineers reviewing the S26HL02GTFGBHM040 datasheet, S26HL02GTFGBHM040 pinout, S26HL02GTFGBHM040 application, or S26HL02GTFGBHM040 equivalent, key selection criteria include HYPERBUS™ DDR timing alignment with DS strobe, dual-die package thermal derating, 4 KB sector endurance (300k cycles), AEC-Q100 Grade 2 temperature range (–40 °C to +105 °C), and SFDP-based configuration discovery.

Technical Context

This device implements Infineon's 45-nm MIRRORBIT™ technology with two bits per cell and operates as a dual-die package (DDP) containing two 1 Gb dies sharing common control signals. It supports both legacy ×1 SPI (SDR, up to 20.75 MBps) and HYPERBUS™ ×8 DDR (up to 332 MBps), with command/address/data transferred in DDR fashion over DQ[7:0] and synchronized by CK/CK# and DS.

The interface uses JEDEC JESD251-compliant eXpanded SPI (xSPI) protocol, enabling automatic configuration via Serial Flash Discoverable Parameters (SFDP). Internal architecture includes a configurable 256/512-byte page programming buffer, 1024-byte OTP secure silicon region, and dedicated hardware blocks for interface CRC, data integrity CRC, and SafeBoot state reporting.

Key Specifications

Pinout & Package

Package: 24-ball BGA, 8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant. Pin assignment conforms to JEDEC MO-270CA standard with VSS/VSSQ separation for noise isolation and dedicated DQ[7:0], CK/CK#, CS#, DS, RESET#, INT#, RSTO#.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR flash code storage applications.

Compared with S26HL02GTABHI010, this part adds AEC-Q100 Grade 2 qualification and ASIL-B safety mechanisms essential for automotive boot; compared with S26HL02GTFCBHM020, it delivers 25% higher read bandwidth and superior thermal performance at 105 °C using 1.8 V core.

Availability

S26HL02GTFGBHM040 is available at Aetrix Electronics and suitable for ADAS domain controllers, automotive gateways, centralized vehicle computers, and electric powertrain control modules requiring stable component supply, long-term lifecycle support, and functional safety-certified flash memory.

Supply support for S26HL02GTFGBHM040 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and safety-certified memory solutions, with global R&D and manufacturing infrastructure.

This part belongs to the SEMPER™ Flash product line, engineered specifically for functional safety-critical code storage in automotive and industrial systems requiring ISO 26262 compliance, high endurance, and deterministic high-speed read access.

FAQ

What is the purpose of the RSTO# pin and how does it interact with system reset sequencing?

RSTO# is an open-drain reset output that signals internal power-on reset (POR) completion. It remains LOW during POR, blocking all transactions and forcing external logic to hold system reset until RSTO# transitions to high-impedance. An external pull-up then pulls RSTO# HIGH, releasing system reset. This ensures synchronous release of processor and peripheral resets aligned to flash readiness - critical for deterministic boot in ASIL-B systems.

How does the hybrid sector architecture support firmware update safety in automotive applications?

The hybrid architecture allocates thirty-two 4 KB sectors at top/bottom addresses with 300k program-erase cycles - double the endurance of main 256 KB sectors. These are reserved for bootloader and safety monitor code. During OTA updates, only these protected sectors are rewritten, preserving integrity of main application firmware and enabling atomic rollback if corruption is detected by SafeBoot or interface CRC - satisfying ASIL-B fault containment requirements.

Can S26HL02GTFGBHM040 operate in legacy SPI mode while maintaining ASIL-B compliance?

Yes - ASIL-B compliance is architecture-level and independent of interface mode. All safety mechanisms (SafeBoot, ECC, CRC, OTP) remain active in both HYPERBUS™ and legacy ×1 SPI modes. However, SPI SDR limits read bandwidth to 20.75 MBps and lacks DS-strobed timing determinism, so it is typically used only for initial boot configuration or fallback recovery, not high-throughput runtime code execution.

What design considerations apply to the CK/CK# differential clock inputs given they are "complement signals" rather than true differential pairs?

CK and CK# are inverted logic signals, not LVDS-style differential pairs. They require matched trace lengths and series termination near the flash device, not differential termination. System-level routing must avoid skew > 0.1 ns between them, and the controller must sample their crossing point - not individual edges. Failure to meet this causes command/address mislatching, especially at 166 MHz, and invalidates ASIL-B timing guarantees.