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Infineon Technologies S26HL02GTFGBHM043
- Part No.:
- S26HL02GTFGBHM043
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26HL02GTFGBHM043.pdf
- Description:
- IC FLASH 2GBIT HYPERBUS 24FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,552
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Product details
Overview
S26HL02GTFGBHM043 from Infineon is a 2 Gb (256 MB) SEMPER™ NOR Flash memory with HYPERBUS™ DDR interface, 1.8 V core supply (HS-T grade), 24-ball BGA package, and ISO 26262 ASIL-B compliant functional safety architecture. It delivers up to 332 MBps read throughput, supports 256 KB and 4 KB sector erase, includes 1024-byte OTP secure silicon region, and targets automotive ADAS and industrial real-time boot applications.
For engineers reviewing the S26HL02GTFGBHM043 datasheet, S26HL02GTFGBHM043 pinout, S26HL02GTFGBHM043 application, or S26HL02GTFGBHM043 equivalent, key selection criteria include HYPERBUS™ DDR timing compliance, ASIL-B safety certification status, 4 KB sector endurance (300k cycles), dual-die package thermal behavior, and SFDP-based configuration flexibility for boot partitioning.
Technical Context
This device implements Infineon's 45-nm MIRRORBIT™ technology with two bits per cell and uses a multi-chip package (DDP) containing two 1 Gb dies. It supports both legacy ×1 SPI (SDR, up to 20.75 MBps) and HYPERBUS™ ×8 DDR (up to 332 MBps), with programmable page buffer sizes (256/512 bytes) and configurable hybrid sector architecture (32 × 4 KB + remainder 256 KB).
Functional safety features include built-in SECDED ECC, interface and data integrity CRC, SafeBoot initialization reporting, and hardware reset via RESET# and RSTO#. The device operates across -40 °C to +105 °C (Industrial Plus/AEC-Q100 Grade 2) with separate VCC/VCCQ supplies and dedicated VSS/VSSQ grounds for noise isolation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB) in dual-die package (2 × 1 Gb) |
| Interface | HYPERTBUS™ DDR (×8) with DS strobe; JEDEC JESD251-compliant xSPI |
| Max Read Throughput | 332 MBps at 166 MHz DDR clock (HS-T, 1.8 V) |
| Endurance | 2,560,000 cycles (256 KB sectors); 300,000 cycles (4 KB sectors) |
| Data Retention | Minimum 25 years at +85 °C operating temperature |
| Safety Certification | ISO 26262 ASIL-B compliant; ASIL-D ready architecture |
| Supply Voltage | VCC = 1.7–2.0 V (HS-T); VCCQ = 1.7–2.0 V |
Pinout & Package
Package: 24-ball BGA, 8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant. Ball layout optimized for signal integrity in high-speed DDR flash interfaces with dedicated VSSQ/VCCQ planes and differential clock routing support.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for all transactions; drives outputs to high-Z when deasserted |
| CK / CK# | Clock Input | Differential or single-ended clock input; latches command/address/data on rising edge (CK) or crossing (CK/CK#) |
| DS | Data Strobe Output | DDR read-data valid indicator; edge-aligned with DQ[7:0] output during CS# low |
| DQ[7:0] | Bidirectional Data Bus | 8-bit serial bus for command, address, and data; supports ×1 SPI (DQ0/DQ1 only) and ×8 HYPERBUS™ modes |
| RESET# | Hardware Reset Input | Optional active-low reset with internal weak pull-up; forces POR and high-Z I/O state |
| RSTO# | Reset Output | Open-drain POR status signal; blocks all transactions while asserted low |
| INT# | Interrupt Output | Open-drain system interrupt for completion of erase/program or error events |
| VCC / VCCQ | Power Supplies | VCC powers core logic; VCCQ powers I/O buffers-separate rails reduce switching noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR Interface | Enables 332 MBps sustained linear burst reads without external FIFO buffering |
| ASIL-B Functional Safety | Includes SafeBoot, interface/data CRC, SECDED ECC, and fault-reporting registers for automotive safety-critical boot code storage |
| Hybrid Sector Architecture | Supports flexible partitioning: 32 × 4 KB sectors at top/bottom + uniform 256 KB sectors-enables secure boot + firmware update separation |
| OTP Secure Silicon Region | 1024-byte one-time-programmable area for cryptographic keys or calibration data, isolated from main array erase cycles |
| Deep Power-Down Mode | 0.0026 mA typical current (HS-T) enables ultra-low standby power in always-on automotive modules |
Applications
| Automotive ADAS Domain Controller Boot | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Stores boot firmware and safety monitor code for radar/EPS ECUs requiring certified startup within 100 ms after power-on. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with deterministic read latency and SafeBoot validation before CPU execution. Use Value: ASIL-B compliance eliminates need for external safety monitoring IC; 332 MBps DDR read ensures full 256 KB boot image load in <390 µs. |
Use Scenario: Holds field-upgradable control logic and configuration tables in modular PLC backplanes operating continuously at +70 °C ambient. IC Role / Device Role / Timing Role: High-endurance firmware storage with 300k-cycle 4 KB sectors for frequent parameter updates. Use Value: Hybrid sector architecture isolates update partitions from protected boot code; 25-year retention guarantees long-term deployment without refresh. |
| Medical Imaging System Configuration | Avionics Display Module Boot Memory |
|
Use Scenario: Stores calibrated sensor profiles and UI assets in portable ultrasound devices subject to AEC-Q200 vibration and thermal cycling. IC Role / Device Role / Timing Role: Radiation-tolerant, high-reliability configuration store with CRC-protected read path. Use Value: Dual VCC/VCCQ supply and dedicated VSSQ ground minimize EMI-induced bit flips during real-time image reconstruction. |
Use Scenario: Provides certified boot image for DO-254-compliant display processors in cockpit multifunction displays. IC Role / Device Role / Timing Role: Safety-certified NOR flash with POR sequencing via RSTO# to synchronize FPGA and microcontroller startup. Use Value: RSTO# open-drain output enables direct connection to FPGA reset controller; eliminates discrete reset supervisor IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26HL02GTFAFHBH02 | Same die, identical electrical specs, but HS-T grade with different BGA marking (FGBHM043 vs FAFHBH02); same pinout and timing | Identical use cases; differs only in traceability coding and reel packaging for specific OEM programs | Select when matching existing BOM revision or required by Tier-1 automotive program documentation |
| Infineon S26HL02GTFAFHBM02 | Same 2 Gb DDP device, but HL-T (3.0 V) voltage grade; higher VCC/VCCQ (2.7–3.6 V), lower max DDR speed (266 MBps) | Suitable for legacy 3.3 V systems with lower timing margin; not ASIL-B certified per datasheet revision | Choose only for cost-sensitive industrial designs where 1.8 V operation and ASIL-B are not required |
Compared with S26HL02GTFGBHM043, the FAFHBH02 variant offers identical functionality with alternate traceability, while the FAFHBM02 sacrifices ASIL-B compliance and DDR speed for 3.0 V compatibility-making the original part optimal for new automotive safety-critical designs.
Availability
S26HL02GTFGBHM043 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and avionics display module boot applications requiring stable component supply, long-lifecycle availability, and ISO 26262-compliant memory.
Supply support for S26HL02GTFGBHM043 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and safety-certified memory solutions, with global R&D centers and ISO/TS 16949-certified manufacturing.
This device belongs to the SEMPER™ Flash product line, engineered specifically for functional safety-critical boot and firmware storage in automotive and industrial systems demanding ASIL-B certification, high endurance, and deterministic DDR performance.
FAQ
Does S26HL02GTFGBHM043 support both SPI and HYPERBUS™ interfaces simultaneously?
No. The device supports either legacy ×1 SPI (SDR) or HYPERBUS™ (×8 DDR) mode, selected at power-on via SFDP configuration or hardware strapping. Both interfaces share the same DQ[7:0] pins and CS#/CK/DS signals, but operate under mutually exclusive protocols defined in the boot configuration register.
What is the purpose of the RSTO# pin and how does it differ from RESET#?
RSTO# is an open-drain output that signals internal power-on reset (POR) status, transitioning from LOW to high-impedance after timeout to indicate readiness. RESET# is an optional input that triggers POR when pulled LOW. RSTO# enables system-level synchronization of host processor startup, while RESET# provides external reset initiation capability.
How is the 4 KB sector endurance of 300,000 cycles validated?
Infineon specifies 300,000 program-erase cycles for 4 KB sectors based on accelerated life testing at +85 °C with full data pattern stress, verified per JEDEC JESD47 reliability standards. This rating applies only to the designated 4 KB regions-not the main 256 KB sectors-and is guaranteed across the Industrial Plus temperature range (-40 °C to +105 °C).
Can the OTP secure silicon region be reprogrammed after initial write?
No. The 1024-byte OTP secure silicon region (SSR) is physically one-time programmable using fuse-link technology. Once programmed, bits can only transition from '1' to '0'; no erase or rewrite capability exists. Programming is performed via dedicated command sequence and requires VPP voltage; subsequent reads return locked values without modification ability.
S26HL02GTFGBHM043 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (8x8)
S26HL02GTFGBHM043 FAQ
1.How can I place an order for S26HL02GTFGBHM043 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26HL02GTFGBHM043 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26HL02GTFGBHM043 reliable?
The price and inventory of S26HL02GTFGBHM043 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26HL02GTFGBHM043 is usually 5 days.
3.What payment methods are accepted for S26HL02GTFGBHM043?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26HL02GTFGBHM043 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26HL02GTFGBHM043?
S26HL02GTFGBHM043 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26HL02GTFGBHM043 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26HL02GTFGBHM043?
For technical support, including S26HL02GTFGBHM043 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26HL02GTFGBHM043 requirements.
6.How does Aetrix verify that S26HL02GTFGBHM043 is sourced from the original manufacturer or authorized distributors?
All S26HL02GTFGBHM043 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26HL02GTFGBHM043 meets industry standards.
7.What is the process for return or replacement of S26HL02GTFGBHM043?
All S26HL02GTFGBHM043 units undergo pre-shipment inspection (PSI). If there is an issue with S26HL02GTFGBHM043, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26HL02GTFGBHM043 part is unused and in its original packaging.
Return procedure for S26HL02GTFGBHM043:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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