Infineon Technologies S26HS02GTFPBHB053

Overview

S26HS02GTFPBHB053 from Infineon is a 2 Gb (256 MB) automotive-grade SEMPER™ NOR Flash memory with HYPERBUS™ DDR interface, 1.8 V core supply, and AEC-Q100 Grade 2 qualification (-40 °C to +105 °C). It implements 45-nm MIRRORBIT™ technology in a dual-die package (DDP), supports 332 MBps read throughput via DDR mode at 166 MHz, includes on-chip SECDED ECC, and features ISO 26262 ASIL-B compliance with ASIL-D readiness for functional safety-critical boot and code storage applications in ADAS and vehicle control units.

For engineers reviewing the S26HS02GTFPBHB053 datasheet, S26HS02GTFPBHB053 pinout, S26HS02GTFPBHB053 application, or S26HS02GTFPBHB053 equivalent, key selection criteria include HYPERBUS™ vs. legacy SPI interface support, 4 KB/256 KB hybrid sector architecture, OTP secure silicon region (1024 bytes), built-in Data Integrity CRC, and RSTO# reset output signaling for system-level POR coordination.

Technical Context

This device operates as a high-reliability serial NOR flash with dual interface modes: legacy ×1 SPI (SDR, up to 20.75 MBps) and HYPERBUS™ ×8 DDR (up to 332 MBps). Its internal architecture uses mirrored bit cells for density and endurance, with configurable 256-byte or 512-byte page programming buffers and three sector configuration options - uniform 256 KB, hybrid grouped (32 × 4 KB top/bottom), or hybrid split (32 × 4 KB top + bottom).

The HYPERBUS™ interface employs CK/CK# clock pair (complementary, not true differential) and DS strobe for precise DDR read capture, while command/address/data are transferred over DQ[7:0] in burst-oriented linear or wrapped mode. Internal SafeBoot monitors initialization, detects configuration corruption, and enables recovery, and the device integrates hardware reset (RESET#) and open-drain interrupt (INT#) for real-time system event handling.

Key Specifications

Pinout & Package

Package: 24-ball BGA, 8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant, with VCC/VSS (core) and VCCQ/VSSQ (I/O) power/ground separation for signal integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR flash memory applications.

Compared with S26KS512SDPBHB020 and S26HL02GTFFBHB020, the S26HS02GTFPBHB053 uniquely combines 1.8 V core operation, AEC-Q100 Grade 2, ASIL-B certification, and OTP SSR in a single 2 Gb HYPERBUS™ device - making it the only option for safety-critical automotive boot memory requiring both low-voltage efficiency and secure key storage.

Availability

S26HS02GTFPBHB053 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, digital instrument clusters, vehicle gateway secure boot implementations, and electric powertrain control units requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S26HS02GTFPBHB053 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and safety-certified memory solutions, with global R&D and manufacturing infrastructure.

The SEMPER™ Flash product line was designed specifically for functional safety-critical automotive applications, integrating ISO 26262-aligned architecture, high-endurance MIRRORBIT™ technology, and dual-interface flexibility to replace legacy parallel NOR and QSPI flash in next-generation E/E architectures.

FAQ

What interface modes does S26HS02GTFPBHB053 support, and how are they selected?

The device supports both HYPERBUS™ DDR (×8) and legacy ×1 SPI interfaces. Interface selection occurs automatically at power-on: default boot uses legacy SPI unless configured otherwise via SFDP or status register bits. No external pins control mode selection; configuration is software-defined through command sequences issued after reset.

Does S26HS02GTFPBHB053 require external termination for the CK/CK# clock pair?

Yes - although CK and CK# are complementary (not true differential), Infineon specifies controlled-impedance routing and point-to-point termination at the receiver (device side) using 50 Ω to VCCQ. The datasheet explicitly warns against treating them as LVDS and mandates proper PCB layout per Application Note AN2297 to prevent setup/hold violations in DDR mode.

How is the 1024-byte OTP Secure Silicon Region (SSR) programmed and protected?

The SSR is programmed via dedicated unlock-and-write command sequences (0x02/0x03/0x04) after issuing the 0x60 unlock command. Once any byte in the 32 × 32-byte array is written, that row becomes permanently locked; further writes to that row return status error. Protection is enforced by on-die logic - no fuse-blowing or voltage-based programming is required.

What is the role of RSTO# during power-on reset, and how should it be used in system design?

RSTO# is an open-drain output that asserts LOW during internal POR and releases to high-impedance after a programmable timeout (default 100 ms). It must be externally pulled up to VCCQ. System designers use RSTO# to gate host processor reset release, ensuring all peripherals initialize only after flash is fully ready - preventing premature CS# assertion and bus contention.