Infineon Technologies S26HS02GTFPBHM043

Overview

S26HS02GTFPBHM043 from Infineon is a 2 Gb (256 MB) SEMPER™ NOR Flash memory with HYPERBUS™ DDR interface, 1.8 V core supply (HS-T grade), 24-ball BGA 8 × 8 mm package, and ISO 26262 ASIL-B compliant functional safety architecture. It delivers up to 332 MBps read throughput, supports dual-die package (DDP), and integrates SECDED ECC, interface/data integrity CRC, and SafeBoot for automotive and industrial boot-critical applications.

For engineers reviewing the S26HS02GTFPBHM043 datasheet, S26HS02GTFPBHM043 pinout, S26HS02GTFPBHM043 application, or S26HS02GTFPBHM043 equivalent, key selection criteria include HYPERBUS™ vs. legacy SPI interface mode, 4 KB/256 KB hybrid sector configuration, 2.56M P/E cycle endurance in main array, and AEC-Q100 Grade 2 (-40 °C to +105 °C) qualification status.

Technical Context

This device implements Infineon's 45-nm MIRRORBIT™ technology with two bits per cell and uses a multi-chip package (DDP) containing two 1 Gb dies sharing common control signals. It supports both JEDEC JESD251-compliant xSPI and legacy ×1 SPI protocols, with DDR read operation synchronized by CK/CK# and data strobe (DS) for timing-critical capture.

The internal architecture includes a configurable 256-byte or 512-byte page programming buffer, OTP secure silicon region (1024 bytes), and hardware-based sector protection. Boot defaults to legacy SPI but can be configured for HYPERBUS™, and initialization failure detection is handled via SafeBoot with recovery options and RSTO# reset output signaling.

Key Specifications

Pinout & Package

24-ball BGA package (8 × 8 mm, 0.8 mm pitch) with VCC/VCCQ separation for noise isolation between core and I/O domains. Pin assignments follow JEDEC-standard ballout for HYPERBUS™-enabled NOR flash.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability NOR flash applications.

Compared with S26HS02GTFPBHM043, the Cypress alternative offers identical interface and package but omits safety features and half the density, while the Winbond part is a legacy SPI device with no timing safety mechanisms or HYPERBUS™ performance - neither supports ASIL-B boot-critical use cases.

Availability

S26HS02GTFPBHM043 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging BIOS, and avionics display modules requiring stable component supply, long-term lifecycle assurance, and functional safety compliance.

Supply support for S26HS02GTFPBHM043 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in functional safety and high-reliability memory solutions.

This device belongs to the SEMPER™ Flash product line, designed specifically for safety-critical boot and firmware storage in automotive, industrial, and medical systems demanding ASIL-B compliance, high endurance, and deterministic initialization.

FAQ

What interface modes does S26HS02GTFPBHM043 support, and how is default mode selected?

S26HS02GTFPBHM043 supports both HYPERBUS™ DDR (×8) and legacy ×1 SPI interfaces. Default boot mode is set by internal strapping options at power-on; it boots in SPI mode unless configured otherwise via SFDP or register settings. No external pins determine this - configuration is stored in non-volatile mode registers.

Does S26HS02GTFPBHM043 require external termination resistors for HYPERBUS™ operation?

Yes - CK/CK# differential pair requires controlled-impedance routing and board-level termination (typically 100 Ω differential) per Infineon's layout guidelines. DQ[7:0] and DS also require proper AC termination and length matching to maintain signal integrity at 166 MHz DDR rates.

How is the 4 KB / 256 KB hybrid sector configuration implemented and controlled?

The hybrid sector map is fixed at manufacturing and cannot be reconfigured in-field. The device ships with either top-grouped, bottom-grouped, or split (top + bottom) 4 KB sectors. Configuration is identified via SFDP tables and confirmed by reading status registers; no user programming alters the physical sector layout.

What is the role of RSTO# versus RESET#, and can they be used together?

RSTO# is an open-drain output indicating internal POR status; RESET# is an input that triggers POR. They are complementary: driving RESET# LOW asserts RSTO# LOW, blocking all transactions until internal reset completes and RSTO# releases to Hi-Z. This pairing enables synchronized system-level reset sequencing without race conditions.