Infineon Technologies S26HS02GTFPBHM050
- Part No.:
- S26HS02GTFPBHM050
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26HS02GTFPBHM050.pdf
- Description:
- IC FLASH 2GBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,752
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Product details
Overview
S26HS02GTFPBHM050 from Infineon is a 2 Gb (256 MB) automotive-grade SEMPER™ NOR Flash memory with HYPERBUS™ DDR interface, 1.8 V core supply, 24-ball BGA (8 × 8 mm), supporting up to 332 MBps read throughput, ISO 26262 ASIL-B compliant functional safety, and dual-die package (DDP) architecture.
For engineers reviewing the S26HS02GTFPBHM050 datasheet, S26HS02GTFPBHM050 pinout, S26HS02GTFPBHM050 application, or S26HS02GTFPBHM050 equivalent, key selection criteria include HYPERBUS™ vs. legacy SPI interface mode support, 4 KB/256 KB hybrid sector configuration, built-in SECDED ECC, and AEC-Q100 Grade 2 (–40 °C to +105 °C) qualification for ADAS and domain controller boot storage.
Technical Context
This device implements Infineon's 45-nm MIRRORBIT™ technology with two bits per cell and integrates dual 1 Gb dies in a single 24-ball BGA package. It supports both HYPERBUS™ DDR (166 MHz, 332 MBps) and legacy ×1 SPI (166 MHz, 20.75 MBps) interfaces, with configurable initial access latency (14 cycles in DDR HS-T mode) and programmable page buffer (256/512 bytes).
Functional safety is embedded at silicon level: on-chip ECC corrects single-bit errors and detects double-bit errors, interface CRC validates host-to-flash communication, Data Integrity CRC checks array contents, and SafeBoot monitors initialization integrity and enables recovery from configuration corruption - all aligned to ISO 26262 ASIL-B compliance and ASIL-D readiness.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 2 Gb (256 MB) in dual-die package (2 × 1 Gb) |
| Interface speed | 332 MBps DDR read (HYPERBUS™, 166 MHz clock, 14-cycle latency) |
| Supply voltage | 1.7–2.0 V (HS-T core), 2.7–3.6 V (HL-T I/O) |
| Endurance & retention | 2.56M program-erase cycles (main array), 25-year data retention |
| Sector architecture | Hybrid: thirty-two 4 KB sectors (top/bottom or split), remainder 256 KB sectors |
| Safety certification | ISO 26262 ASIL-B compliant, ASIL-D ready; includes SafeBoot, interface/data CRC, SECDED ECC |
| Temperature grade | AEC-Q100 Grade 2 (–40 °C to +105 °C) |
Pinout & Package
Package: 24-ball BGA, 8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant. Ball layout optimized for signal integrity in high-speed DDR read operations with dedicated VCCQ/VSSQ rails and differential clock pair (CK/CK#).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for all transactions; drives device into standby when HIGH |
| CK / CK# | Clock inputs | Differential or single-ended timing reference; latches command/address/data on crossing/rising edge |
| DS | Data Strobe output | Edge-aligned strobe for DDR read data capture; simplifies high-speed timing closure |
| DQ[7:0] | Bidirectional data bus | 8-bit serial bus for command, address, and data in HYPERBUS™ mode; SI/SO in legacy SPI |
| RESET# | Hardware reset input | Optional active-low reset with internal weak pull-up; forces POR and array read state |
| RSTO# | Reset output | Open-drain POR indicator; blocks all transactions while LOW, synchronizes system reset |
| VCC / VSS | Core power/ground | 1.7–2.0 V core supply; isolated from I/O rail to reduce noise coupling |
| VCCQ / VSSQ | I/O power/ground | 2.7–3.6 V I/O supply; dedicated rail ensures stable signal levels for DQ/DS/CK |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR interface | Enables 332 MBps sustained read throughput without parallel bus routing complexity |
| Configurable sector architecture | Supports flexible firmware partitioning: 4 KB sectors for parameter storage, 256 KB for code images |
| On-chip SECDED ECC | Corrects single-bit errors and detects double-bit errors in real time during read operations |
| SafeBoot functionality | Validates boot configuration integrity and initiates recovery if corruption is detected |
| OTP secure silicon region | 1024-byte tamper-resistant area for keys, certificates, or calibration data |
Applications
| Automotive ADAS Domain Controller | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot firmware and real-time sensor fusion algorithms for radar/vision processing units requiring fast, deterministic code execution. IC Role / Device Role / Timing Role: Primary boot memory with HYPERBUS™ DDR interface enabling sub-100 µs instruction fetch latency from flash. Use Value: ASIL-B compliance and SafeBoot ensure safe startup after power-on reset; 25-year retention guarantees field longevity without reprogramming. | Use Scenario: Holds firmware, configuration tables, and HMI assets in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Nonvolatile storage for field-upgradable firmware with hybrid sector protection isolating critical parameters from update routines. Use Value: 4 KB sector erase capability allows atomic parameter updates without disturbing main application code; industrial temperature range ensures reliability in uncontrolled enclosures. |
| Medical Imaging System Boot Memory | Avionics Display Unit Code Storage |
Use Scenario: Stores boot loader and diagnostic firmware for CT/MRI subsystems where data integrity and fail-safe initialization are mandatory. IC Role / Device Role / Timing Role: Safety-critical boot memory with interface CRC and Data Integrity CRC verifying communication and stored content before execution. Use Value: Built-in ECC and SafeBoot meet IEC 62304 Class C software requirements; 2.56M endurance supports frequent field calibration updates. | Use Scenario: Hosts display engine firmware and font assets in certified avionics displays operating under DO-254/DO-178C design assurance. IC Role / Device Role / Timing Role: High-reliability code storage with AEC-Q100 Grade 1 option (–40 °C to +125 °C) and traceable sourcing for life-critical systems. Use Value: Dual-die architecture provides redundancy margin; OTP SSR secures cryptographic keys used in display authentication protocols. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KS512SDPBHV020 | 512 Mb density, same 24-ball BGA, HYPERBUS™ DDR, but lacks ASIL-B certification and SafeBoot | Targeted at non-safety-critical industrial control; no functional safety runtime monitoring | Select when cost sensitivity outweighs ASIL-B requirement and firmware size ≤ 64 MB |
| Infineon S26HL02GTFFBHM020 | Same 2 Gb density and ASIL-B compliance, but uses HL-T voltage range (2.7–3.6 V core) instead of HS-T (1.7–2.0 V) | Designed for 3.3 V system architectures; incompatible with 1.8 V core domains without level shifting | Select for legacy 3.3 V designs where core voltage compatibility is prioritized over low-power operation |
Compared with S26HS02GTFPBHM050, the S26KS512SDPBHV020 offers lower density and no functional safety features, while the S26HL02GTFFBHM020 maintains safety compliance but requires higher core voltage - making the original part optimal for new 1.8 V automotive ADAS platforms demanding ASIL-B boot integrity.
Availability
S26HS02GTFPBHM050 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and medical imaging system boot applications requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified flash memory.
Supply support for S26HS02GTFPBHM050 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and safety-certified memory solutions.
The SEMPER™ Flash product line is engineered for functional safety-critical systems, delivering high-speed, reliable NOR flash with integrated ISO 26262-aligned features for automotive, industrial, and medical boot and code storage.
FAQ
What interface modes does S26HS02GTFPBHM050 support?
S26HS02GTFPBHM050 supports two primary interface modes: HYPERBUS™ DDR (×8) at up to 332 MBps and legacy ×1 SPI (SDR) at up to 20.75 MBps. The device boots by default in legacy SPI mode but can be configured to initialize in HYPERBUS™ mode via SFDP or hardware strapping. Both modes share the same DQ[7:0] pins, with CK/CK# used for timing in HYPERBUS™ and CK only in SPI.
How is functional safety implemented in this device?
Functional safety is implemented through multiple hardware-enforced mechanisms: ISO 26262 ASIL-B compliance validated by TÜV SÜD, on-chip SECDED ECC for memory array data, interface CRC for command/address/data integrity, Data Integrity CRC for stored content verification, SafeBoot for initialization failure detection and recovery, and a dedicated OTP secure silicon region for cryptographic key storage.
Can S26HS02GTFPBHM050 be used in 1.8 V-only systems without level shifters?
Yes - S26HS02GTFPBHM050 operates with a 1.7–2.0 V core supply (HS-T grade) and separate 2.7–3.6 V I/O supply (VCCQ). In 1.8 V systems, VCC must be supplied at 1.8 V, while VCCQ must be provided at ≥2.7 V. This requires external I/O voltage translation or a dual-rail power supply; it cannot operate with VCCQ tied to 1.8 V.
What sector erase options are available and how are they configured?
The device supports uniform (all 256 KB), hybrid grouped (32 × 4 KB at top or bottom), and hybrid split (32 × 4 KB at both top and bottom) sector configurations. Configuration is set via status register bits (SR[15:14]) and locked using write protection. Sector protection is independent per sector and enforced by hardware, preventing accidental erase or program operations without explicit unlock sequences.
S26HS02GTFPBHM050 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (8x8)
S26HS02GTFPBHM050 FAQ
1.How can I place an order for S26HS02GTFPBHM050 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26HS02GTFPBHM050 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26HS02GTFPBHM050 reliable?
The price and inventory of S26HS02GTFPBHM050 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26HS02GTFPBHM050 is usually 5 days.
3.What payment methods are accepted for S26HS02GTFPBHM050?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26HS02GTFPBHM050 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26HS02GTFPBHM050?
S26HS02GTFPBHM050 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26HS02GTFPBHM050 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26HS02GTFPBHM050?
For technical support, including S26HS02GTFPBHM050 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26HS02GTFPBHM050 requirements.
6.How does Aetrix verify that S26HS02GTFPBHM050 is sourced from the original manufacturer or authorized distributors?
All S26HS02GTFPBHM050 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26HS02GTFPBHM050 meets industry standards.
7.What is the process for return or replacement of S26HS02GTFPBHM050?
All S26HS02GTFPBHM050 units undergo pre-shipment inspection (PSI). If there is an issue with S26HS02GTFPBHM050, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26HS02GTFPBHM050 part is unused and in its original packaging.
Return procedure for S26HS02GTFPBHM050:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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