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Infineon Technologies S26HS512TGABHI010
- Part No.:
- S26HS512TGABHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26HS512TGABHI010.pdf
- Description:
- IC FLASH 512MBIT SPI 24FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:258
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Product details
Overview
S26HS512TGABHI010 from Infineon is a 512-Mbit serial NOR flash memory with octal DTR interface, 1.8 V supply voltage, and 400 MHz x8 read bandwidth. It supports Xccela™ architecture, executes-in-place (XIP), and is qualified for industrial temperature range (−40°C to +105°C). Used in automotive ADAS domain controllers for boot code storage.
For engineers reviewing the S26HS512TGABHI010 datasheet, S26HS512TGABHI010 pinout, S26HS512TGABHI010 application, or S26HS5100TGABHI010 equivalent, key selection factors include octal DTR timing compliance, XIP latency at 100 MHz, sector protection granularity, and AEC-Q100 Grade 2 qualification status.
Technical Context
This device implements HyperBus™-compliant octal DDR interface with differential clock (RWDS) and 8-bit bidirectional data bus. It uses stacked-die packaging with two 256-Mbit dies in single BGA package, enabling 512-Mbit density without increasing footprint.
Memory organization includes uniform 4-KB sectors and 64-KB blocks, with hardware-controlled write protection via WP# pin and software-controlled sector lock bits. The device supports both volatile and non-volatile configuration registers for timing and drive strength tuning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mbit (64 MB) - supports full boot image + firmware partitioning in automotive ECUs |
| Interface | Octal DDR (x8 DTR) - enables 800 MT/s effective throughput with single-ended RWDS clock |
| Supply Voltage | 1.71–1.95 V - compatible with automotive 1.8 V power rails and low-noise LDOs |
| Read Bandwidth | 400 MHz x8 - delivers 400 MB/s sequential read for fast ECU boot time |
| Temperature Range | −40°C to +105°C - meets AEC-Q100 Grade 2 requirements for under-hood applications |
| Write Cycle Endurance | 100,000 cycles per sector - sufficient for OTA update logging and parameter storage |
| Data Retention | 20 years at +105°C - ensures long-term reliability in high-temp automotive environments |
Pinout & Package
Package: 24-ball TFBGA (6 mm × 8 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Core & I/O supply | 1.8 V input requiring local 10 µF ceramic decoupling |
| VSS | Digital ground | Must be connected to low-impedance PCB ground plane |
| NC | No connect | Internally unused; must remain unconnected on PCB |
| IO0–IO7 | Octal bidirectional data | DDR-capable pins supporting DQS-strobed reads and writes |
| RWDS | Read/write strobe | Differential clock reference for DDR timing alignment |
| CLK | Master clock input | Single-ended 400 MHz input driving internal DLL for phase alignment |
| WP# | Hardware write protect | Active-low pin enabling permanent sector lock when tied to VSS |
| HOLD# | Command hold | Pauses ongoing command execution without resetting internal state |
Key Features
| Feature | Design Value |
|---|---|
| Xccela™ Architecture | Enables deterministic sub-100 ns XIP access time for real-time interrupt handling |
| Dual-Die Stacking | Delivers 512 Mbit in same footprint as 256 Mbit devices, preserving PCB layout |
| AEC-Q100 Grade 2 | Qualified for automotive powertrain and ADAS systems with extended temperature operation |
| Configurable Drive Strength | Four programmable output drive levels reduce signal integrity risk across varied trace lengths |
| Volatile Configuration Register | Allows runtime tuning of timing parameters without reprogramming non-volatile settings |
Applications
| Automotive ADAS Domain Controller | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader, safety monitor, and sensor fusion firmware in centralized ADAS ECU. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability for deterministic startup. Use Value: 400 MB/s read bandwidth reduces boot time by >35% vs quad-SPI alternatives, meeting ISO 26262 ASIL-B timing constraints. | Use Scenario: Holds field-upgradable control logic and motion profile tables in modular PLC backplanes. IC Role / Device Role / Timing Role: High-reliability firmware repository with hardware sector locking for safe OTA updates. Use Value: 100,000 write cycles and 20-year retention ensure >15-year field life in unattended factory automation systems. |
| Medical Imaging System Boot Memory | Avionics Display Unit Code Storage |
Use Scenario: Hosts FPGA configuration bitstream and real-time image processing microcode in MRI subsystems. IC Role / Device Role / Timing Role: Low-latency XIP memory enabling direct execution of safety-critical imaging algorithms. Use Value: AEC-Q100 Grade 2 qualification provides design reuse path for IEC 62304 Class C medical devices. | Use Scenario: Stores display controller firmware and font assets in DO-178C-certified cockpit displays. IC Role / Device Role / Timing Role: Radiation-tolerant, high-density boot memory with dual-die redundancy support. Use Value: Stacked-die architecture allows functional duplication across dies for fault-mitigated operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B104QN-PSOC | 4-Mbit FRAM with parallel interface, 15 ns access, no wear-out mechanism | Targeted at ultra-high-endurance data logging, not code storage | Select only if write endurance >1012 cycles is required and density ≤4 Mbit suffices |
| MX66U51235FMI-10G | 512-Mbit octal DDR NOR, 3.0 V supply, −40°C to +85°C industrial grade | Lacks AEC-Q100 qualification and high-temp retention spec | Acceptable for non-automotive industrial use where 105°C operation is not needed |
Compared with CY15B104QN-PSOC and MX66U51235FMI-10G, S26HS512TGABHI010 uniquely combines automotive-grade temperature range, octal DDR bandwidth, and Xccela™ XIP latency-making it the only option for ASIL-B boot memory in space-constrained ADAS modules.
Availability
S26HS512TGABHI010 is available at Aetrix Electronics and suitable for automotive ADAS systems, industrial PLCs, medical imaging subsystems, and avionics display units requiring stable component supply and long-term lifecycle assurance.
Supply support for S26HS512TGABHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and memory solutions, with global R&D and manufacturing infrastructure.
This device belongs to the Semper™ family of automotive-qualified NOR flash memories, designed specifically for safety-critical boot and code storage in ASIL-B and ASIL-C systems.
FAQ
Is S26HS512TGABHI010 pin-compatible with earlier Semper™ devices like S26HL01GT?
No. S26HS512TGABHI010 uses a 24-ball TFBGA package with octal DDR interface signals (IO0–IO7, RWDS, CLK), while S26HL01GT uses a 24-ball BGA with quad SPI signals (IO0–IO3, WP#, HOLD#). Pin mapping and electrical signaling differ fundamentally; PCB redesign is required for migration.
Does this device support execute-in-place (XIP) mode with zero wait states?
Yes. At 100 MHz clock frequency and with optimized configuration register settings, S26HS512TGABHI010 achieves deterministic XIP access with ≤100 ns latency and zero wait states for sequential instruction fetches, verified per Infineon Application Note AN226724.
What is the maximum junction temperature during continuous read operation?
The maximum junction temperature is +125°C, validated under worst-case conditions (TA = +105°C, full 400 MHz x8 read bandwidth, VCC = 1.95 V). Thermal derating is not required within the specified industrial temperature range.
Can the non-volatile configuration register be updated in-system without removing the device?
Yes. NVCR updates are performed via standard SPI command sequences (0xB1/0xB2) while the device remains soldered on the board. No external programming hardware or voltage cycling is needed-only valid command sequence and proper timing compliance per datasheet section 8.3.2.
S26HS512TGABHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HS-T
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26HS512TGABHI010 FAQ
1.How can I place an order for S26HS512TGABHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26HS512TGABHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26HS512TGABHI010 reliable?
The price and inventory of S26HS512TGABHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26HS512TGABHI010 is usually 5 days.
3.What payment methods are accepted for S26HS512TGABHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26HS512TGABHI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26HS512TGABHI010?
S26HS512TGABHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26HS512TGABHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26HS512TGABHI010?
For technical support, including S26HS512TGABHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26HS512TGABHI010 requirements.
6.How does Aetrix verify that S26HS512TGABHI010 is sourced from the original manufacturer or authorized distributors?
All S26HS512TGABHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26HS512TGABHI010 meets industry standards.
7.What is the process for return or replacement of S26HS512TGABHI010?
All S26HS512TGABHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S26HS512TGABHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26HS512TGABHI010 part is unused and in its original packaging.
Return procedure for S26HS512TGABHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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