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Spansion S26KL128SDABHA020

Part No.:
S26KL128SDABHA020
Manufacturer:
Spansion
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KL128SDABHA020.pdf
Description:
FLASH, 16MX8, 96NS, PBGA24
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:170

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Product details

Overview

S26KL128SDABHA020 from Infineon is a 128-Mb (16-MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, RWDS read strobe, and CS# control. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package.

For engineers reviewing the S26KL128SDABHA020 datasheet, S26KL128SDABHA020 pinout, S26KL128SDABHA020 application, or S26KL128SDABHA020 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS-synchronized DDR read latency (96 ns tACC), sector protection configuration, deep power-down current (4 µA), and AEC-Q100 grade compatibility for automotive boot code storage.

Technical Context

The device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with dual-edge sampling referenced to CK/CK#. Its embedded algorithm controller (EAC) autonomously executes program/erase sequences without host intervention, using internal state machines and command memory.

HYPERFLASH™ uses MIRRORBIT™ technology enabling 16-bit word-wide accesses on 8-bit bus via DDR transfers; each read burst starts with 5–16 clock-cycle initial latency, followed by wrapped (16/32/64-byte) or linear sequential output, with automatic page prefetch during linear bursts to sustain 333 MBps throughput.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density128 Mb (16 MB) - fixed capacity for boot code and firmware image storage in resource-constrained systems
Interface ProtocolHYPERTBUS™ DDR - low-pin-count 12-signal interface (CK/CK#, CS#, DQ[7:0], RWDS, RSTO#, INT#) enabling high-speed serial-like bandwidth
Max Read Throughput333 MBps - achieved at 166 MHz clock with 2× data per cycle on 8-bit bus, eliminating need for wide parallel NOR interfaces
Initial Access Latency96 ns tACC - deterministic random read delay critical for real-time boot execution and interrupt vector fetch
Erase Endurance100,000 cycles - validated for frequent firmware update scenarios in industrial gateways and automotive ECUs
Data Retention20 years - guaranteed retention at +85°C, supporting long-lifecycle deployments without refresh
Power ModesDeep Power-Down: 4 µA - enables ultra-low standby in always-on edge nodes; no wake-up latency required for active clock stop

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8-mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputReference for DDR sampling of DQ and RWDS; enables precise timing margin control in high-speed layouts
CS#Chip select (active low)Enables device communication; must be asserted before command launch and held during burst transactions
RWDSRead data strobe outputSource-synchronous output aligned to read data edges; used by host to latch valid DQ values during reads
DQ[7:0]Bi-directional data busCarries commands, addresses, and 16-bit data in DDR mode; requires matched trace length and controlled impedance
INT#Interrupt outputAsserted on ECC error detection or busy-to-ready transition, enabling asynchronous host notification without polling
RSTO#Reset outputUser-configurable open-drain reset pulse for system-level power-on initialization; driven low during power-up sequence

Key Features

FeatureDesign Value
DDR Center-Aligned Read Strobe (DCARS)Eliminates setup/hold timing violations on DQ by aligning read data to RWDS transitions instead of CK edges
Configurable Burst ModeSupports wrapped (16/32/64-byte) or linear bursts per transaction, optimizing cache line fill and DMA buffer alignment
Embedded Algorithm Controller (EAC)Hardware-managed program/erase - offloads host CPU, ensures atomicity, and prevents partial writes during power loss
Hybrid Sector ProtectionVolatile (lock bits) and non-volatile (OTP fuses) protection per 256-KB sector, securing bootloader and calibration data
One-Time Programmable (OTP) Array1024-byte dedicated OTP space for unique device identifiers, cryptographic keys, or calibration coefficients

Applications

Automotive ADAS Boot MemoryIndustrial PLC Firmware Storage

Use Scenario: Storing boot code and safety-critical firmware for radar ECU requiring ISO 26262 ASIL-B compliance.

IC Role / Device Role / Timing Role: Primary non-volatile boot source accessed via HYPERBUS™ during cold start; provides deterministic <96 ns access for vector table fetch.

Use Value: AEC-Q100 Grade 2 qualification (–40°C to +105°C) and 20-year retention ensure reliability across vehicle lifetime without field updates.

Use Scenario: Holding firmware images and configuration data in modular programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: High-throughput code execution memory interfaced to ARM Cortex-M7 MCU; sustains 333 MBps read for real-time motion control loops.

Use Value: 100,000 erase cycles support over-the-air firmware upgrades every 3 months for 25+ years; deep power-down (4 µA) extends battery backup runtime.

5G Small Cell Baseband ProcessorMedical Imaging System Boot ROM

Use Scenario: Loading FPGA configuration bitstreams and DSP firmware in fronthaul units requiring rapid boot and thermal resilience.

IC Role / Device Role / Timing Role: HYPERBUS™-connected flash providing low-latency instruction fetch to multi-core baseband processor; RWDS-synchronized reads eliminate timing closure issues.

Use Value: Differential CK/CK# and 166 MHz operation enable stable operation at 85°C ambient; ECC corrects single-bit errors induced by neutron flux in outdoor enclosures.

Use Scenario: Storing certified diagnostic firmware and calibration tables in FDA-regulated MRI subsystems with strict data integrity requirements.

IC Role / Device Role / Timing Role: Secure boot ROM with OTP key storage and ECC-enabled read path; RSTO# coordinates system reset sequencing during power-on self-test.

Use Value: 1-bit ECC correction and 2-bit detection prevent undetected corruption of safety-critical imaging parameters; ISO/TS16949 manufacturing ensures traceability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S26KL128SDABHA010Same density and package, but rated for Industrial Plus (–40°C to +105°C) only - no AEC-Q100 certificationLacks automotive qualification; unsuitable for under-hood ECU useSelect when operating temperature exceeds +85°C but automotive compliance is not required
S26KS128SDABHA020128-Mb variant with 3.0 V I/O (vs. 1.8 V); uses single-ended CK; max 100 MHz / 200 MBpsLower bandwidth and higher voltage margin; incompatible with 1.8 V HYPERBUS™ mastersChoose only if legacy 3.0 V system design prohibits 1.8 V signaling or differential clock implementation

Compared with S26KL128SDABHA010 and S26KS128SDABHA020, the S26KL128SDABHA020 uniquely combines AEC-Q100 Grade 2 qualification, 1.8 V differential-clock HYPERBUS™ operation, and 333 MBps throughput - making it the sole option for automotive ADAS boot in thermally demanding environments.

Availability

S26KL128SDABHA020 is available at Aetrix Electronics and suitable for automotive ADAS modules, industrial PLCs, 5G small cell base stations, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant flash memory.

Supply support for S26KL128SDABHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and communications markets.

This device belongs to the HYPERFLASH™ family - designed specifically to replace parallel NOR flash in high-performance embedded systems by delivering DDR-speed throughput with minimal pin count and robust data integrity features.

FAQ

What is the purpose of the RWDS signal in S26KL128SDABHA020?

RWDS (Read Data Strobe) is an output signal synchronized to read data transitions on DQ[7:0]. It serves as a source-synchronous timing reference for the host controller to accurately latch valid data during DDR reads. Unlike clock-based sampling, RWDS edge alignment eliminates skew sensitivity and relaxes PCB layout constraints for high-speed routing.

Does S26KL128SDABHA020 support both wrapped and linear burst modes?

Yes - the device supports configurable burst types per transaction: wrapped bursts of 16, 32, or 64 bytes, or linear bursts that continue sequentially until CS# deassertion. The burst type is selected via command register bits and enables optimization for cache-line fills (wrapped) or streaming DMA transfers (linear).

How does the Embedded Algorithm Controller (EAC) improve system reliability?

The EAC executes autonomous program/erase algorithms using internal state machines and command memory. This eliminates host software dependency for complex flash operations, prevents partial writes during power loss, and ensures atomic sector erases - critical for maintaining firmware integrity in unattended industrial and automotive applications.

What is the function of the RSTO# pin and how is it configured?

RSTO# is an open-drain output that generates a system-level power-on reset pulse. Its LOW duration is user-configurable via status register bits (typically 1–100 ms). During power-up, RSTO# asserts after internal voltage stabilization, coordinating reset timing across multiple ICs without external RC networks or supervisors.

S26KL128SDABHA020 Specifications

Product attributes
Attribute value
Manufacturer:
Spansion
Series:
HYPERFLASH™ KL
Package/Case:
24-VBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KL128SDABHA020 FAQ

1.How can I place an order for S26KL128SDABHA020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KL128SDABHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KL128SDABHA020 reliable?

The price and inventory of S26KL128SDABHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL128SDABHA020 is usually 5 days.

3.What payment methods are accepted for S26KL128SDABHA020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL128SDABHA020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KL128SDABHA020?

S26KL128SDABHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KL128SDABHA020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KL128SDABHA020?

For technical support, including S26KL128SDABHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL128SDABHA020 requirements.

6.How does Aetrix verify that S26KL128SDABHA020 is sourced from the original manufacturer or authorized distributors?

All S26KL128SDABHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL128SDABHA020 meets industry standards.

7.What is the process for return or replacement of S26KL128SDABHA020?

All S26KL128SDABHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL128SDABHA020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KL128SDABHA020 part is unused and in its original packaging.

Return procedure for S26KL128SDABHA020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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