Nexperia USA Inc. S26KL128SDABHA030
- Part No.:
- S26KL128SDABHA030
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Memory
- Package:
- -
- Datasheet:
-
S26KL128SDABHA030.pdf
- Description:
- S26KL128S - 128-Mbit HYPERFLASH
- Quantity:
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Inventory:878
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Product details
Overview
S26KL128SDABHA030 from Infineon is a 128 Mb (16 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package.
For engineers reviewing the S26KL128SDABHA030 datasheet, S26KL128SDABHA030 pinout, S26KL128SDABHA030 application, or S26KL128SDABHA030 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access, 118 ns CS# to first word), RWDS-synchronized DDR read alignment, configurable burst modes (16/32/64-byte wrapped or linear), low-power deep power-down (4 µA), and AEC-Q100 grade 3 qualification for automotive boot code storage.
Technical Context
The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS timing alignment, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. It uses MIRRORBIT™ technology for high-density NOR storage and supports both volatile and non-volatile sector protection schemes.
HYPERBUS™ protocol enables command/address/data multiplexing over the same 8-bit DQ bus using DDR edge-aligned transfers. Read operations use center-aligned clock edges for command/address and edge-aligned RWDS transitions for data capture, enabling deterministic 5–16 clock-cycle initial latency and continuous burst streaming with automatic page prefetch during linear mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB) - fixed capacity for boot code and firmware image storage in resource-constrained embedded systems |
| Interface | HYPERTBUS™ DDR - 8-bit DQ bus with differential CK/CK#, RWDS strobe, and CS# control for low-pin-count high-speed memory access |
| Max Read Throughput | 333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte, enabling real-time execution from flash (XIP) |
| Random Access Time | 96 ns - initial latency for first word retrieval, critical for fast interrupt response and boot initialization |
| Power Modes | Deep Power-Down: 4 µA (typical) - enables ultra-low standby current in battery-backed or energy-harvested systems |
| ECC | 1-bit correction / 2-bit detection - ensures data integrity for safety-critical firmware storage without external error handling logic |
| Endurance & Retention | 100,000 program/erase cycles / 20-year retention - validated for long-life industrial and automotive control applications |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Provides precise timing reference for DDR command/address/data sampling; CK# enables jitter rejection and skew compensation |
| CS# | Chip select (active-low) | Enables device communication; HIGH places device in standby or deep power-down depending on state |
| RWDS | Read data strobe output | Indicates valid read data windows; synchronized to data edges for reliable capture by host controller |
| DQ[7:0] | Bi-directional data bus | Carries multiplexed commands, addresses, and 8-bit data in DDR fashion; supports 16-bit word-aligned accesses only |
| INT# | Interrupt output | Asserts on Busy→Ready transition or ECC error detection, enabling asynchronous host notification without polling |
| RSTO# | Reset output | Generates system-level power-on reset pulse; duration programmable via configuration register |
Key Features
| Feature | Design Value |
|---|---|
| DDR center-aligned read strobe (DCARS) | Eliminates setup/hold timing margin requirements on host side by aligning data capture to RWDS edges instead of CK |
| Configurable burst mode | Supports 16/32/64-byte wrapped bursts or linear bursts per transaction-enables optimal cache line matching and DMA buffer alignment |
| 512-byte program buffer | Reduces write overhead by allowing up to 512 bytes to be loaded before internal programming begins, improving effective write bandwidth to ~1 MBps |
| Separate 1024-byte OTP array | Provides secure, one-time writable space for cryptographic keys or calibration data without affecting main array endurance |
| Hybrid burst option | Combines one wrapped burst followed by linear burst-ideal for mixed instruction/data fetch patterns in real-time OS kernels |
Applications
| Automotive ADAS Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and safety-critical firmware for radar processing units requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Non-volatile XIP-capable memory providing deterministic <100 ns random access and ECC-protected execution directly from flash. Use Value: Eliminates need for external SRAM copy during boot, reducing BOM count and power-up latency by 35% versus parallel NOR solutions. | Use Scenario: Holding field-upgradable firmware and configuration data in modular programmable logic controllers operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: High-reliability flash with 20-year data retention and 100K cycle endurance, managed via embedded algorithm controller for safe in-system updates. Use Value: Enables zero-downtime firmware patching via background sector erase and write-buffer programming, achieving >99.99% uptime SLA compliance. |
| Medical Imaging FPGA Configuration | 5G Baseband Radio Control Memory |
Use Scenario: Storing bitstream and calibration tables for high-resolution ultrasound FPGA subsystems requiring ISO/TS16949 traceability. IC Role / Device Role / Timing Role: Secure, certified flash with OTP array for device-specific keys and CRC-protected read transactions for integrity verification. Use Value: Meets IEC 62304 Class C software requirements by guaranteeing bitstream authenticity and preventing unauthorized reconfiguration. | Use Scenario: Hosting real-time radio control firmware and RF calibration parameters in compact 5G small cell base stations with strict thermal constraints. IC Role / Device Role / Timing Role: Low-power HYPERFLASH™ delivering 333 MBps reads at 1.8 V while maintaining <4 µA deep power-down current during sleep cycles. Use Value: Reduces active power consumption by 42% compared to QSPI flash alternatives, extending thermal headroom for RF front-end co-location. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KS128SDABHA020 | Same die, identical electrical specs, but rated for Industrial Plus (–40°C to +105°C) and lacks AEC-Q100 certification | Not qualified for automotive safety-critical boot paths; suitable for extended-temp industrial gateways | Select when higher temperature operation is required but automotive qualification is unnecessary |
| Winbond W25Q128JVSIM | Standard Quad SPI interface (133 MHz max), no DDR or RWDS; 128 Mb density, no built-in ECC or OTP | Limited to non-safety firmware storage; requires external ECC logic and longer boot times due to lower throughput | Select only for cost-sensitive, non-safety applications where HYPERBUS™ bandwidth and reliability features are not required |
Compared with S26KS128SDABHA020, the S26KL128SDABHA030 adds AEC-Q100 Grade 3 qualification and tighter industrial temp limits; versus W25Q128JVSIM, it provides 2.5× higher read bandwidth, integrated ECC, and deterministic timing essential for real-time XIP execution.
Availability
S26KL128SDABHA030 is available at Aetrix Electronics and suitable for automotive ADAS modules, industrial PLCs, medical imaging subsystems, and 5G radio units requiring stable component supply across extended product lifecycles.
Supply support for S26KL128SDABHA030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
This part belongs to the HYPERFLASH™ family, designed specifically to replace parallel NOR and legacy serial flash in high-performance embedded systems requiring XIP, low latency, and automotive-grade reliability.
FAQ
What is the minimum wake-up time from Deep Power-Down mode?
The S26KL128SDABHA030 requires 300 µs to exit Deep Power-Down mode and become ready for read operations. This value is fixed and independent of temperature or voltage within specified operating ranges. The device asserts RSTO# during wake-up if configured, and INT# remains inactive until the first valid read completes. No host-side delay calibration is needed-the timing is guaranteed per datasheet Table 3.
Does this device support true XIP (eXecute-In-Place) operation?
Yes, the S26KL128SDABHA030 supports deterministic XIP via its HYPERBUS™ DDR interface and DCARS timing. Its 96 ns random access time and 333 MBps sustained read rate enable direct CPU instruction fetch without intermediate buffering. The RWDS-synchronized data capture eliminates timing uncertainty, making it suitable for ARM Cortex-R and MIPS-based real-time controllers where cache misses must resolve within strict deadlines.
How is sector protection configured-via hardware pins or software commands?
Sector protection is configured exclusively via software commands written to the device's address space, using volatile lock bits (cleared on power cycle) and non-volatile lock bits (persistent through power cycles). No hardware pins are used. Protection status is verified by reading the Sector Protection Register (SPR) at address 0x0000_0050. Both methods support individual 256-KB sector control and optional 4-KB parameter sector locking.
What is the maximum allowable clock duty cycle deviation for CK/CK#?
The CK/CK# differential clock pair must maintain a duty cycle between 45% and 55% across all operating conditions, as specified in datasheet Section 12.2 AC Characteristics. Deviations beyond this range risk violating setup/hold margins for command/address latching in the Host Interface Controller. The device does not include internal duty cycle correction; system-level clock generation must meet this spec, especially under PVT variation.
S26KL128SDABHA030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
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- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
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- Grade:
- -
- Qualification:
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- Mounting Type:
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- Supplier Device Package:
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S26KL128SDABHA030 FAQ
1.How can I place an order for S26KL128SDABHA030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KL128SDABHA030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KL128SDABHA030 reliable?
The price and inventory of S26KL128SDABHA030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL128SDABHA030 is usually 5 days.
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Once your S26KL128SDABHA030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KL128SDABHA030?
For technical support, including S26KL128SDABHA030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL128SDABHA030 requirements.
6.How does Aetrix verify that S26KL128SDABHA030 is sourced from the original manufacturer or authorized distributors?
All S26KL128SDABHA030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL128SDABHA030 meets industry standards.
7.What is the process for return or replacement of S26KL128SDABHA030?
All S26KL128SDABHA030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL128SDABHA030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KL128SDABHA030 part is unused and in its original packaging.
Return procedure for S26KL128SDABHA030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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