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Infineon Technologies S26KL128SDABHB023

Part No.:
S26KL128SDABHB023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KL128SDABHB023.pdf
Description:
IC FLASH 128MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,163

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Product details

Overview

S26KL128SDABHB023 from Infineon is a 128-Mb (16-MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package for embedded boot code storage.

For engineers reviewing the S26KL128SDABHB023 datasheet, S26KL128SDABHB023 pinout, S26KL128SDABHB023 application, or S26KL128SDABHB023 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access, 118 ns CS# to first word), RWDS-synchronized DDR read alignment, configurable burst length (16/32/64 bytes), deep power-down current (4 µA), and AEC-Q100 grade 3 qualification for automotive use cases.

Technical Context

The device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with read data edge-aligned to RWDS transitions and command/address center-aligned to CK/CK# edges. Its dual-controller architecture separates host interface control (HIC) for signal timing and data transfer from embedded algorithm control (EAC) managing program/erase sequences.

It supports both wrapped and linear burst reads, with automatic page prefetch during linear mode enabling sustained 333 MBps throughput. The MIRRORBIT™ core enables 16-bit word-wide addressing and 32-byte page granularity, while ECC and CRC ensure data integrity across 100,000 program/erase cycles and 20-year retention.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density128 Mb (16 MB) - fixed capacity for boot image and firmware storage in resource-constrained systems
Interface StandardHYPERRBUS™ DDR - low-pin-count (12-signal) high-speed interface replacing parallel NOR and QSPI in performance-critical applications
Max Read Throughput333 MBps - achieved via 166 MHz differential clock and dual-edge DQ transfers, enabling real-time code execution from flash
Random Access Time96 ns - initial latency for first word retrieval, critical for fast boot and interrupt response
Power ModesDeep Power-Down: 4 µA (typical) - enables ultra-low standby power without wake-up delay in battery-backed systems
Data IntegrityECC 1-bit correction / 2-bit detection + CRC - hardware-level error handling required for ASIL-B automotive and industrial safety applications
Endurance & Retention100,000 program/erase cycles / 20-year data retention - meets long-lifecycle requirements for industrial controllers and automotive ECUs

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8-mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputProvides precise timing reference for DDR data capture; eliminates single-ended clock skew limitations
CS#Chip select (active low)Enables device communication; must be asserted before command/address transfer on DQ bus
RWDSRead data strobe outputIndicates valid read data windows; synchronized to data edges for reliable sampling by host controller
DQ[7:0]Bi-directional DDR data busCarries command, address, and data in time-multiplexed DDR format; 8-bit width reduces PCB routing complexity
INT#Interrupt outputSignals Busy-to-Ready transition or ECC error detection, enabling asynchronous host response without polling
RSTO#Reset outputGenerates system-level power-on reset pulse; duration programmable to match downstream logic timing

Key Features

FeatureDesign Value
HYPERBUS™ DDR InterfaceReduces signal count to 12 pins vs. 40+ for legacy parallel NOR, cutting PCB layer count and EMI in high-density designs
Configurable Burst LengthSupports 16/32/64-byte wrapped bursts or linear bursts - optimizes cache line fill efficiency for ARM Cortex-A/R cores
512-byte Program BufferEnables 1 MBps write speed via buffer programming - improves firmware update time vs. single-word programming (4 KBps)
Advanced Sector ProtectionVolatile and non-volatile locking per 256-KB sector - prevents accidental overwrite of bootloader or calibration data in field-deployed units
Automotive QualificationAEC-Q100 Grade 3 (–40°C to +85°C) - validated for under-hood and infotainment applications without derating

Applications

Automotive Instrument ClusterIndustrial PLC Firmware Storage

Use Scenario: Storing boot code and GUI assets for real-time rendering in digital dashboards.

IC Role / Device Role / Timing Role: Non-volatile code execution memory with HYPERBUS™ interface directly mapped to ARM Cortex-R5F instruction bus.

Use Value: 333 MBps read throughput eliminates external RAM caching, reducing BOM cost and board space while meeting ASIL-B timing constraints.

Use Scenario: Holding firmware images and configuration parameters in modular control cabinets exposed to wide temperature swings.

IC Role / Device Role / Timing Role: Primary boot flash with ECC and deep power-down support for fail-safe restart after brownout events.

Use Value: 20-year data retention and 100K endurance ensure 15+ year field life without firmware corruption in unattended deployments.

5G Baseband Radio UnitMedical Imaging System Boot Memory

Use Scenario: Loading FPGA configuration bitstreams and DSP microcode during cold start in outdoor macro cells.

IC Role / Device Role / Timing Role: High-speed serial flash interfaced to Xilinx Zynq UltraScale+ MPSoC PS side via dedicated HYPERBUS™ controller.

Use Value: 96 ns random access and 118 ns CS#-to-first-word timing enable sub-100ms boot sequence compliant with 3GPP TR 38.803 recovery requirements.

Use Scenario: Secure boot storage for FDA-cleared MRI controller firmware requiring tamper-resistant updates.

IC Role / Device Role / Timing Role: Trusted execution environment (TEE) root-of-trust memory with one-time-programmable (OTP) array for cryptographic keys.

Use Value: Dedicated 1024-byte OTP array and sector-level write protection prevent unauthorized firmware modification during service technician access.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S26KS128SDABHB020Same die, identical electrical specs and pinout; differs only in marking and traceability documentation per Infineon's post-acquisition part numberingNo functional difference; accepted interchangeably in existing designs qualified to original Cypress specSelect when sourcing legacy-design-baseline inventory or matching prior procurement records
Macronix MX25L12873FQuad SPI interface (4-line I/O), max 133 MHz clock, 40 MBps read speed, no RWDS or differential clockLacks HYPERBUS™ timing precision and DDR bandwidth; unsuitable for direct replacement in HYPERBUS™-native SoCsConsider only for new designs where QSPI controller is available and 333 MBps read throughput is not required

Compared with S26KL128SDABHB023, the Cypress variant offers identical performance and drop-in compatibility, while the Macronix part trades interface simplicity for >8× lower bandwidth-making it viable only where HYPERBUS™ infrastructure is absent and latency budgets permit.

Availability

S26KL128SDABHB023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, 5G radio units, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for S26KL128SDABHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing facilities.

This device belongs to the HYPERFLASH™ family, designed specifically to replace parallel NOR flash in high-performance embedded systems requiring low-pin-count, high-bandwidth non-volatile memory with deterministic timing.

FAQ

What is the minimum supported VCCQ voltage for S26KL128SDABHB023?

The device requires 1.71 V to 1.95 V for VCCQ (I/O supply) when operating in 1.8 V mode. Operation below 1.71 V violates absolute maximum ratings and may cause RWDS timing violations or command decode failures. This range ensures stable DDR signaling margins across temperature and process variation.

Does S26KL128SDABHB023 support octal SPI or QPI modes?

No. S26KL128SDABHB023 implements only the HYPERBUS™ DDR interface with mandatory CK/CK#, RWDS, and CS# signals. It does not support SPI, QPI, or xSPI command sets. Interface compatibility is limited to SoCs with native HYPERBUS™ controllers such as NXP i.MX 8M Plus or Renesas RZ/G2L.

How is the 512-byte program buffer utilized during write operations?

The buffer accepts up to 512 bytes of data in a single write transaction, then executes internal page programming in ~475 µs. Host software must issue a "buffer write" command followed by address and data, then poll INT# or status register for completion-enabling 1 MBps effective write speed versus 4 KBps for single-word writes.

Can RSTO# be disabled or repurposed as a general-purpose output?

No. RSTO# is a dedicated open-drain output with fixed functionality: it asserts LOW for a user-configurable duration (via configuration register) upon power-on reset detection. It cannot be disabled or reassigned; its timing and drive strength are hardware-defined to meet system-level reset sequencing requirements.

S26KL128SDABHB023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERFLASH™ KL
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
HyperBus
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KL128SDABHB023 FAQ

1.How can I place an order for S26KL128SDABHB023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KL128SDABHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KL128SDABHB023 reliable?

The price and inventory of S26KL128SDABHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL128SDABHB023 is usually 5 days.

3.What payment methods are accepted for S26KL128SDABHB023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL128SDABHB023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KL128SDABHB023?

S26KL128SDABHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KL128SDABHB023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KL128SDABHB023?

For technical support, including S26KL128SDABHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL128SDABHB023 requirements.

6.How does Aetrix verify that S26KL128SDABHB023 is sourced from the original manufacturer or authorized distributors?

All S26KL128SDABHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL128SDABHB023 meets industry standards.

7.What is the process for return or replacement of S26KL128SDABHB023?

All S26KL128SDABHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL128SDABHB023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KL128SDABHB023 part is unused and in its original packaging.

Return procedure for S26KL128SDABHB023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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