Infineon Technologies S26KL128SDABHB023
- Part No.:
- S26KL128SDABHB023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KL128SDABHB023.pdf
- Description:
- IC FLASH 128MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,163
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Product details
Overview
S26KL128SDABHB023 from Infineon is a 128-Mb (16-MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package for embedded boot code storage.
For engineers reviewing the S26KL128SDABHB023 datasheet, S26KL128SDABHB023 pinout, S26KL128SDABHB023 application, or S26KL128SDABHB023 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access, 118 ns CS# to first word), RWDS-synchronized DDR read alignment, configurable burst length (16/32/64 bytes), deep power-down current (4 µA), and AEC-Q100 grade 3 qualification for automotive use cases.
Technical Context
The device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with read data edge-aligned to RWDS transitions and command/address center-aligned to CK/CK# edges. Its dual-controller architecture separates host interface control (HIC) for signal timing and data transfer from embedded algorithm control (EAC) managing program/erase sequences.
It supports both wrapped and linear burst reads, with automatic page prefetch during linear mode enabling sustained 333 MBps throughput. The MIRRORBIT™ core enables 16-bit word-wide addressing and 32-byte page granularity, while ECC and CRC ensure data integrity across 100,000 program/erase cycles and 20-year retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (16 MB) - fixed capacity for boot image and firmware storage in resource-constrained systems |
| Interface Standard | HYPERRBUS™ DDR - low-pin-count (12-signal) high-speed interface replacing parallel NOR and QSPI in performance-critical applications |
| Max Read Throughput | 333 MBps - achieved via 166 MHz differential clock and dual-edge DQ transfers, enabling real-time code execution from flash |
| Random Access Time | 96 ns - initial latency for first word retrieval, critical for fast boot and interrupt response |
| Power Modes | Deep Power-Down: 4 µA (typical) - enables ultra-low standby power without wake-up delay in battery-backed systems |
| Data Integrity | ECC 1-bit correction / 2-bit detection + CRC - hardware-level error handling required for ASIL-B automotive and industrial safety applications |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - meets long-lifecycle requirements for industrial controllers and automotive ECUs |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8-mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Provides precise timing reference for DDR data capture; eliminates single-ended clock skew limitations |
| CS# | Chip select (active low) | Enables device communication; must be asserted before command/address transfer on DQ bus |
| RWDS | Read data strobe output | Indicates valid read data windows; synchronized to data edges for reliable sampling by host controller |
| DQ[7:0] | Bi-directional DDR data bus | Carries command, address, and data in time-multiplexed DDR format; 8-bit width reduces PCB routing complexity |
| INT# | Interrupt output | Signals Busy-to-Ready transition or ECC error detection, enabling asynchronous host response without polling |
| RSTO# | Reset output | Generates system-level power-on reset pulse; duration programmable to match downstream logic timing |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR Interface | Reduces signal count to 12 pins vs. 40+ for legacy parallel NOR, cutting PCB layer count and EMI in high-density designs |
| Configurable Burst Length | Supports 16/32/64-byte wrapped bursts or linear bursts - optimizes cache line fill efficiency for ARM Cortex-A/R cores |
| 512-byte Program Buffer | Enables 1 MBps write speed via buffer programming - improves firmware update time vs. single-word programming (4 KBps) |
| Advanced Sector Protection | Volatile and non-volatile locking per 256-KB sector - prevents accidental overwrite of bootloader or calibration data in field-deployed units |
| Automotive Qualification | AEC-Q100 Grade 3 (–40°C to +85°C) - validated for under-hood and infotainment applications without derating |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and GUI assets for real-time rendering in digital dashboards. IC Role / Device Role / Timing Role: Non-volatile code execution memory with HYPERBUS™ interface directly mapped to ARM Cortex-R5F instruction bus. Use Value: 333 MBps read throughput eliminates external RAM caching, reducing BOM cost and board space while meeting ASIL-B timing constraints. | Use Scenario: Holding firmware images and configuration parameters in modular control cabinets exposed to wide temperature swings. IC Role / Device Role / Timing Role: Primary boot flash with ECC and deep power-down support for fail-safe restart after brownout events. Use Value: 20-year data retention and 100K endurance ensure 15+ year field life without firmware corruption in unattended deployments. |
| 5G Baseband Radio Unit | Medical Imaging System Boot Memory |
Use Scenario: Loading FPGA configuration bitstreams and DSP microcode during cold start in outdoor macro cells. IC Role / Device Role / Timing Role: High-speed serial flash interfaced to Xilinx Zynq UltraScale+ MPSoC PS side via dedicated HYPERBUS™ controller. Use Value: 96 ns random access and 118 ns CS#-to-first-word timing enable sub-100ms boot sequence compliant with 3GPP TR 38.803 recovery requirements. | Use Scenario: Secure boot storage for FDA-cleared MRI controller firmware requiring tamper-resistant updates. IC Role / Device Role / Timing Role: Trusted execution environment (TEE) root-of-trust memory with one-time-programmable (OTP) array for cryptographic keys. Use Value: Dedicated 1024-byte OTP array and sector-level write protection prevent unauthorized firmware modification during service technician access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KS128SDABHB020 | Same die, identical electrical specs and pinout; differs only in marking and traceability documentation per Infineon's post-acquisition part numbering | No functional difference; accepted interchangeably in existing designs qualified to original Cypress spec | Select when sourcing legacy-design-baseline inventory or matching prior procurement records |
| Macronix MX25L12873F | Quad SPI interface (4-line I/O), max 133 MHz clock, 40 MBps read speed, no RWDS or differential clock | Lacks HYPERBUS™ timing precision and DDR bandwidth; unsuitable for direct replacement in HYPERBUS™-native SoCs | Consider only for new designs where QSPI controller is available and 333 MBps read throughput is not required |
Compared with S26KL128SDABHB023, the Cypress variant offers identical performance and drop-in compatibility, while the Macronix part trades interface simplicity for >8× lower bandwidth-making it viable only where HYPERBUS™ infrastructure is absent and latency budgets permit.
Availability
S26KL128SDABHB023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, 5G radio units, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for S26KL128SDABHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing facilities.
This device belongs to the HYPERFLASH™ family, designed specifically to replace parallel NOR flash in high-performance embedded systems requiring low-pin-count, high-bandwidth non-volatile memory with deterministic timing.
FAQ
What is the minimum supported VCCQ voltage for S26KL128SDABHB023?
The device requires 1.71 V to 1.95 V for VCCQ (I/O supply) when operating in 1.8 V mode. Operation below 1.71 V violates absolute maximum ratings and may cause RWDS timing violations or command decode failures. This range ensures stable DDR signaling margins across temperature and process variation.
Does S26KL128SDABHB023 support octal SPI or QPI modes?
No. S26KL128SDABHB023 implements only the HYPERBUS™ DDR interface with mandatory CK/CK#, RWDS, and CS# signals. It does not support SPI, QPI, or xSPI command sets. Interface compatibility is limited to SoCs with native HYPERBUS™ controllers such as NXP i.MX 8M Plus or Renesas RZ/G2L.
How is the 512-byte program buffer utilized during write operations?
The buffer accepts up to 512 bytes of data in a single write transaction, then executes internal page programming in ~475 µs. Host software must issue a "buffer write" command followed by address and data, then poll INT# or status register for completion-enabling 1 MBps effective write speed versus 4 KBps for single-word writes.
Can RSTO# be disabled or repurposed as a general-purpose output?
No. RSTO# is a dedicated open-drain output with fixed functionality: it asserts LOW for a user-configurable duration (via configuration register) upon power-on reset detection. It cannot be disabled or reassigned; its timing and drive strength are hardware-defined to meet system-level reset sequencing requirements.
S26KL128SDABHB023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERFLASH™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KL128SDABHB023 FAQ
1.How can I place an order for S26KL128SDABHB023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KL128SDABHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KL128SDABHB023 reliable?
The price and inventory of S26KL128SDABHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL128SDABHB023 is usually 5 days.
3.What payment methods are accepted for S26KL128SDABHB023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL128SDABHB023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KL128SDABHB023?
S26KL128SDABHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KL128SDABHB023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KL128SDABHB023?
For technical support, including S26KL128SDABHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL128SDABHB023 requirements.
6.How does Aetrix verify that S26KL128SDABHB023 is sourced from the original manufacturer or authorized distributors?
All S26KL128SDABHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL128SDABHB023 meets industry standards.
7.What is the process for return or replacement of S26KL128SDABHB023?
All S26KL128SDABHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL128SDABHB023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KL128SDABHB023 part is unused and in its original packaging.
Return procedure for S26KL128SDABHB023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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