Nexperia USA Inc. S26KL128SDABHB030
- Part No.:
- S26KL128SDABHB030
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Memory
- Package:
- -
- Datasheet:
-
S26KL128SDABHB030.pdf
- Description:
- S26KL128S - 128-Mbit HYPERFLASH
- Quantity:
- Payment:

- Shipping:

Inventory:878
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Product details
Overview
S26KL128SDABHB030 from Infineon is a 128 Mb (16 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package for embedded boot code storage.
For engineers reviewing the S26KL128SDABHB030 datasheet, S26KL128SDABHB030 pinout, S26KL128SDABHB030 application, or S26KL128SDABHB030 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access, 118 ns CS# to first word), RWDS-synchronized DDR read alignment, sector protection granularity, deep power-down current (4 µA), and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-synchronized data transfer, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. It uses MIRRORBIT™ technology for high-density NOR storage and supports both wrapped (16/32/64-byte) and linear burst modes.
HYPERBUS™ protocol enables command/address/data multiplexing over the same 8-bit DQ bus using DDR edge-aligned transfers. Read operations require initial latency of 5–16 clock cycles, followed by center-aligned data output referenced to CK/CK#, with RWDS toggling on each data edge to indicate valid read windows.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (16 MB) - fixed capacity for boot image and firmware storage in resource-constrained systems |
| Interface Standard | HYPERRBUS™ DDR - 8-bit bidirectional DQ bus with differential CK/CK# and RWDS strobe for deterministic timing |
| Max Read Throughput | 333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte per transfer, enabling fast application loading |
| Random Access Time | 96 ns - initial latency for first word retrieval, critical for low-latency boot execution |
| Operating Voltage | 1.8 V I/O, 3.0 V core - dual-rail support ensures compatibility with modern low-voltage SoCs and PMICs |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - validated for long-life industrial and automotive deployments |
| Power Modes | Deep Power-Down: 4 µA (typical); Standby: 25 µA - enables ultra-low-power sleep states in always-on edge devices |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Reference for all DDR timing; CK rising/falling edges sample DQ and RWDS; required for 166 MHz operation |
| CS# | Chip select (active low) | Enables device communication; HIGH places device in standby or deep power-down mode |
| RWDS | Read data strobe output | Indicates valid read data windows on DQ; toggles on each data edge during reads only |
| DQ[7:0] | Bi-directional data bus | Transfers commands, addresses, and 8-bit data in DDR fashion; no separate address bus required |
| INT# | Interrupt output | Asserts on ECC error detection or busy-to-ready transition; used for asynchronous host notification |
| RSTO# | Reset output | Generates system-level power-on reset pulse; user-configurable LOW duration for sequenced power-up |
Key Features
| Feature | Design Value |
|---|---|
| DDR Center-Aligned Read Strobe (DCARS) | Enables precise read-data capture aligned to RWDS edges, eliminating setup/hold margin uncertainty in high-speed designs |
| Configurable Burst Mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes cache line fill and DMA efficiency |
| 512-byte Program Buffer | Reduces write latency by buffering up to 512 bytes before internal programming, achieving ~1 MBps effective write speed |
| Volatile & Non-Volatile Sector Protection | Allows runtime lock/unlock (volatile) or permanent write-protection (non-volatile) of individual 256-KB sectors |
| One-Time Programmable (OTP) Array | 1024-byte dedicated OTP space for secure keys, calibration data, or unique device identifiers with irreversible write capability |
Applications
| Automotive ADAS ECU Boot Storage | Industrial PLC Firmware Repository |
|---|---|
Use Scenario: Stores boot loader and safety-critical firmware for radar processing units requiring AEC-Q100 Grade 2 qualification and <100 ms cold-boot time. IC Role / Device Role / Timing Role: Primary non-volatile boot memory interfaced directly to ARM Cortex-R5F MCU via HYPERBUS™ controller; provides deterministic 96 ns access for instruction fetch. Use Value: 333 MBps read bandwidth enables full 16 MB firmware load in <50 ms; ECC and sector protection ensure ASIL-B compliance. | Use Scenario: Holds field-upgradable ladder logic and motion control algorithms in modular automation controllers operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: System-level firmware repository with RSTO#-driven power sequencing and INT#-triggered integrity alerts during OTA updates. Use Value: Deep power-down current of 4 µA extends battery-backed runtime; 20-year retention guarantees firmware persistence across 15+ year product lifecycles. |
| 5G Baseband Radio Unit Code Storage | Medical Imaging FPGA Configuration |
Use Scenario: Stores FPGA bitstreams and DSP firmware in remote radio heads where thermal cycling and EMI resilience are critical. IC Role / Device Role / Timing Role: High-reliability configuration memory accessed via Xilinx Zynq UltraScale+ PS side HYPERBUS™ IP; RWDS-synchronized reads prevent metastability. Use Value: Differential CK/CK# rejects common-mode noise; 100,000-cycle endurance supports frequent field reconfiguration without wear-out risk. | Use Scenario: Loads FPGA configuration and DICOM protocol stacks in portable ultrasound systems requiring rapid startup and zero-failure reliability. IC Role / Device Role / Timing Role: Secure boot memory with OTP array storing cryptographic keys and CRC-protected firmware headers for hardware-rooted trust. Use Value: ECC 1-bit correction prevents silent corruption of imaging firmware; AEC-Q100 Grade 1 rating validates operation at 125°C junction temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KS128SDABHB020 | Same density and FBGA package; identical HYPERBUS™ timing but rated for 3.0 V I/O only (no 1.8 V option) | Limited to legacy 3.0 V SoC platforms; lacks differential clock support for noise-immune 166 MHz operation | Select when interfacing with older microcontrollers lacking 1.8 V I/O capability and operating below 100 MHz |
| Winbond W25Q128JVSIM | Quad SPI interface (not HYPERBUS™); 133 MHz max clock; no RWDS or DDR; 100 µA standby current | Suitable for cost-sensitive consumer applications; incompatible with HYPERBUS™-based SoCs like i.MX RT1170 | Choose only for SPI-based designs where 333 MBps throughput and deterministic timing are not required |
Compared with S26KL128SDABHB030, the Cypress alternative maintains pin and timing compatibility but sacrifices 1.8 V operation and differential clock noise immunity, while the Winbond part requires complete interface redesign and delivers less than 40% of the sustained read bandwidth.
Availability
S26KL128SDABHB030 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, 5G radio units, and medical imaging systems requiring stable component supply, AEC-Q100 qualification, and guaranteed 20-year data retention.
Supply support for S26KL128SDABHB030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.
The HYPERFLASH™ product line was designed specifically for high-speed, low-pin-count boot memory in automotive and industrial real-time systems, addressing the need for deterministic DDR flash access without complex routing or signal integrity overhead.
FAQ
What is the minimum wake-up time from Deep Power-Down mode?
The S26KL128SDABHB030 requires 300 µs to exit Deep Power-Down mode and become ready for read access. This wake-up sequence is fully internal and does not require external clock stabilization or initialization commands - the device asserts RSTO# if configured, and RWDS becomes active after the delay. The timing is guaranteed across the full industrial temperature range (–40°C to +85°C).
Does this device support true random access to any 16-bit word address?
No - the S26KL128SDABHB030 accesses data in 32-byte pages aligned to 32-byte boundaries. Each random read targets a full page, and the initial latency (5–16 clocks) includes address decoding and half-page selection. Word-level addressing is supported logically, but physical access is page-granular; unaligned reads still incur full page latency and return the entire 32-byte block.
How is ECC handled during read operations?
ECC is applied automatically on every read: 1-bit errors are corrected transparently in hardware, and 2-bit errors trigger the INT# pin assertion and set an internal status flag readable via command query. No software intervention is needed for correction, but host firmware must monitor INT# and read status registers to detect and log uncorrectable errors for system-level fault reporting.
Can RSTO# be disabled or repurposed?
RSTO# is a dedicated open-drain output with user-configurable LOW pulse duration (programmable via status register bits). It cannot be disabled or reassigned as a general-purpose I/O. Its sole function is to generate a system-level reset pulse synchronized to device power-up or recovery from Deep Power-Down, ensuring deterministic SoC reset timing independent of external reset ICs.
S26KL128SDABHB030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
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- Clock Frequency:
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- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
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- Grade:
- -
- Qualification:
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- Mounting Type:
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- Supplier Device Package:
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S26KL128SDABHB030 FAQ
1.How can I place an order for S26KL128SDABHB030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KL128SDABHB030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KL128SDABHB030 reliable?
The price and inventory of S26KL128SDABHB030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL128SDABHB030 is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KL128SDABHB030?
For technical support, including S26KL128SDABHB030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL128SDABHB030 requirements.
6.How does Aetrix verify that S26KL128SDABHB030 is sourced from the original manufacturer or authorized distributors?
All S26KL128SDABHB030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL128SDABHB030 meets industry standards.
7.What is the process for return or replacement of S26KL128SDABHB030?
All S26KL128SDABHB030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL128SDABHB030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KL128SDABHB030 part is unused and in its original packaging.
Return procedure for S26KL128SDABHB030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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