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Spansion S26KL128SDABHM030

Part No.:
S26KL128SDABHM030
Manufacturer:
Spansion
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KL128SDABHM030.pdf
Description:
PARALLEL NOR HYPERFLASH, 128MB (
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:337

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Product details

Overview

S26KL128SDABHM030 from Infineon is a 128-Mb (16-MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package for embedded boot code storage.

For engineers reviewing the S26KL128SDABHM030 datasheet, S26KL128SDABHM030 pinout, S26KL128SDABHM030 application, or S26KL128SDABHM030 equivalent, key selection criteria include DDR burst timing compliance, RWDS-synchronized read latency (96 ns tACC), sector protection granularity, deep power-down current (4 µA), and AEC-Q100 grade compatibility for automotive control modules.

Technical Context

The S26KL128SDABHM030 implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-aligned data transfer, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. It uses MIRRORBIT™ floating-gate technology for non-volatile storage and supports both wrapped (16/32/64-byte) and linear burst modes.

HYPERBUS™ protocol enables command/address/data multiplexing over the same 8-bit DQ bus using DDR timing - two 16-bit transfers per clock cycle (one on rising, one on falling edge). RWDS output is edge-aligned to CK/CK# transitions during reads, enabling precise data capture at 166 MHz with 5–16 clock-cycle initial latency.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density128 Mb (16 MB) - fixed capacity for boot image and firmware storage in space-constrained SoC interfaces.
Interface ProtocolHYPERRBUS™ DDR - 8-bit bidirectional DQ bus with differential CK/CK#, eliminating parallel address bus and reducing pin count vs. legacy parallel NOR.
Max Read Throughput333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte, enabling fast application loading in real-time systems.
Random Access Time96 ns tACC - defines minimum time from CS# assertion to first valid data word, critical for low-latency boot execution.
ECC Capability1-bit correction / 2-bit detection - hardware-implemented error handling for bit-flip resilience in long-term embedded deployments.
Power ModesDeep Power-Down: 4 µA (typical) - enables ultra-low standby current in battery-backed or energy-harvested edge nodes.
Endurance & Retention100,000 program/erase cycles / 20-year data retention - validated for mission-critical firmware storage in industrial controllers.

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8-mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputReference for DDR sampling of DQ and RWDS; enables jitter-tolerant high-speed timing at 166 MHz.
CS#Chip select (active-low)Enables device communication; must be asserted before command launch and held active during burst transactions.
RWDSRead data strobe outputSource-synchronous output aligned to data edges; used by host to latch DQ values during read bursts.
DQ[7:0]Bi-directional data busCarries commands, addresses, and 8-bit data in DDR mode; no separate address bus required.
INT#Interrupt outputAsserts on Busy→Ready transition or ECC error detection, enabling asynchronous host notification without polling.
RSTO#Reset outputConfigurable LOW pulse for system-level power-on reset; driven after internal voltage stabilization.

Key Features

FeatureDesign Value
HYPERBUS™ DDR interfaceReduces signal count to 11 pins (vs. >40 for parallel NOR), simplifying PCB routing and improving EMI performance in dense MCU designs.
Configurable burst modeSupports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes cache line alignment and DMA buffer efficiency.
Advanced sector protectionVolatile and non-volatile lock bits per 256-KB sector - prevents accidental firmware overwrite during field updates or debug sessions.
512-byte program bufferEnables 1-MBps write throughput (vs. 4 KBps single-word), accelerating firmware patching and OTA update staging.
Automotive qualificationAEC-Q100 Grade 3 certified (–40°C to +85°C) - qualified for body control modules and infotainment boot storage.

Applications

Automotive Instrument ClusterIndustrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, driver alerts, and safety-critical boot code in digital instrument clusters.

IC Role / Device Role / Timing Role: Primary boot memory mapped to ARM Cortex-R5 core; provides sub-100-ns random access for deterministic startup.

Use Value: 333 MBps read bandwidth ensures full UI rendering within 150 ms cold boot; ECC prevents display corruption from cosmic-ray-induced bit flips.

Use Scenario: Holding firmware, configuration tables, and safety logic in programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: Non-volatile code storage interfaced to Xilinx Zynq-7000 FPGA; accessed via AXI-HYPERBUS bridge IP.

Use Value: 256-KB uniform sectors enable atomic firmware rollback; deep power-down (4 µA) extends UPS runtime during brownouts.

Medical Imaging Boot LoaderAvionics Display System

Use Scenario: Hosting secure bootloader and diagnostic firmware for MRI/X-ray controller boards requiring FDA Class II compliance.

IC Role / Device Role / Timing Role: Trusted execution environment (TEE) root-of-trust memory; verified at power-up via hardware CRC and ECC.

Use Value: 20-year data retention guarantees firmware integrity across equipment lifecycle; RSTO# synchronizes system reset with internal voltage rail stability.

Use Scenario: Storing flight-critical display assets and ARINC-661 widget libraries in cockpit multifunction displays.

IC Role / Device Role / Timing Role: High-reliability code memory for PowerPC-based display processors; operates in extended temp (–40°C to +105°C) variant.

Use Value: INT# interrupt signals ECC errors to flight management computer for immediate fault logging; sector protection prevents unauthorized UI modification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S26KS128SDABHM020Same die, identical electrical specs, but rated for Industrial Plus (–40°C to +105°C) only - no AEC-Q100 certification.Lacks automotive qualification; unsuitable for safety-critical vehicle domains requiring AEC-Q100 Grade 2/3.Select when extended temperature operation is needed without automotive compliance overhead.
Winbond W25Q128JVSIMQuad SPI interface (not DDR), 133 MHz max clock, 40 MBps read speed, no RWDS or differential clock.Lower pin count (8-pin SOIC/WSON), but lacks HYPERBUS™ timing precision and sustained bandwidth for real-time UI rendering.Choose for cost-sensitive consumer devices where boot latency < 500 ms is acceptable and PCB space is constrained.

Compared with S26KL128SDABHM030, the Cypress alternative offers identical performance with broader temperature support but no automotive validation, while the Winbond part trades bandwidth and timing determinism for footprint and cost - making it suitable only for non-real-time firmware storage.

Availability

S26KL128SDABHM030 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot loaders, and avionics display systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant flash memory.

Supply support for S26KL128SDABHM030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.

The HYPERFLASH™ product line targets high-performance embedded systems needing deterministic boot and firmware execution, delivering DDR-speed NOR flash with reduced interface complexity versus parallel architectures.

FAQ

What is the purpose of the RWDS signal in S26KL128SDABHM030?

RWDS (Read Data Strobe) is a source-synchronous output that toggles edge-aligned with valid read data on DQ[7:0]. It enables the host controller to accurately latch DDR data without relying on fixed clock-to-data skew margins. RWDS is generated only during read operations and is referenced to CK/CK# transitions, ensuring robust data capture at 166 MHz even under board-level timing variation.

Does S26KL128SDABHM030 support both 1.8 V and 3.0 V I/O operation?

No - S26KL128SDABHM030 is a 1.8 V I/O variant only, indicated by the "D" in the suffix (per Infineon ordering guide). It requires 1.8 V VCCQ and uses differential CK/CK# signaling. The 3.0 V I/O variants (e.g., S26KL128SAxxHM030) use single-ended CK and different timing parameters; mixing voltage domains risks functional failure or damage.

How does the 512-byte program buffer improve write performance?

The 512-byte buffer allows up to 64 consecutive 8-bit writes to be staged before committing to flash, reducing per-word overhead. This achieves ~1 MBps effective programming speed (vs. 4 KBps for single-word writes), cutting full-sector (256 KB) programming time from ~51 seconds to ~250 ms - critical for rapid firmware updates in field-deployed systems.

Can S26KL128SDABHM030 be used without external pull-up resistors on DQ lines?

Yes - the device integrates weak internal pull-ups on DQ[7:0] in high-impedance state (CS# HIGH), eliminating need for external resistors during idle or power-down. However, external termination may still be required for signal integrity at 166 MHz depending on trace length and topology; refer to Infineon's layout guidelines for controlled-impedance routing and CK/CK# pair matching.

S26KL128SDABHM030 Specifications

Product attributes
Attribute value
Manufacturer:
Spansion
Series:
HYPERFLASH™ KL
Package/Case:
24-VBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KL128SDABHM030 FAQ

1.How can I place an order for S26KL128SDABHM030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KL128SDABHM030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KL128SDABHM030 reliable?

The price and inventory of S26KL128SDABHM030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL128SDABHM030 is usually 5 days.

3.What payment methods are accepted for S26KL128SDABHM030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL128SDABHM030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KL128SDABHM030?

S26KL128SDABHM030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KL128SDABHM030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KL128SDABHM030?

For technical support, including S26KL128SDABHM030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL128SDABHM030 requirements.

6.How does Aetrix verify that S26KL128SDABHM030 is sourced from the original manufacturer or authorized distributors?

All S26KL128SDABHM030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL128SDABHM030 meets industry standards.

7.What is the process for return or replacement of S26KL128SDABHM030?

All S26KL128SDABHM030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL128SDABHM030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KL128SDABHM030 part is unused and in its original packaging.

Return procedure for S26KL128SDABHM030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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