Infineon Technologies S26KL256SDABHB023
- Part No.:
- S26KL256SDABHB023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KL256SDABHB023.pdf
- Description:
- IC FLASH 256MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,587
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Product details
Overview
S26KL256SDABHB023 from Infineon Technologies is a 256 Mb (32 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, RWDS read strobe, and CS# chip select. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package for embedded boot code storage.
For engineers reviewing the S26KL256SDABHB023 datasheet, S26KL256SDABHB023 pinout, S26KL256SDABHB023 application, or S26KL256SDABHB023 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns tACC), RWDS-synchronized DDR read alignment, sector protection granularity, deep power-down current (4 µA), and AEC-Q100 grade compatibility for automotive control modules.
Technical Context
The device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with CK/CK# differential clock enabling precise edge-aligned sampling. RWDS output is edge-aligned to CK transitions during reads, while internal MIRRORBIT™ architecture enables concurrent page fetch and burst output for sustained 333 MBps throughput.
It integrates dual-control logic: Host Interface Controller (HIC) manages real-time signal handshake and data transfer, while Embedded Algorithm Controller (EAC) executes non-volatile programming/erase sequences-including 512-byte buffer writes and 256-KB sector erases-without host intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB), organized as 32,768 × 65,536 bits - supports full firmware image storage for mid-tier microcontrollers. |
| Interface Standard | HYPERTBUS™ DDR with 12-signal bus (CK/CK#, CS#, DQ[7:0], RWDS, RSTO#, INT#) - reduces pin count vs. parallel NOR while maintaining high bandwidth. |
| Max Read Throughput | 333 MBps at 166 MHz (1.8 V), achieved via two 8-bit transfers per clock cycle on DQ bus - enables sub-100 ms boot time for 32 MB images. |
| Access Time | 96 ns initial random read access time (tACC), with 5–16 clock-cycle latency - determines minimum instruction fetch delay in XIP execution. |
| ECC Capability | 1-bit error correction / 2-bit error detection per 512-byte sector - ensures reliable code execution without external error-handling overhead. |
| Power Modes | Deep Power-Down: 4 µA (typical); Standby: 25 µA; Burst Read: 80 mA - enables low-quiescent-power operation in always-on automotive ECUs. |
| Endurance & Retention | 100,000 program/erase cycles; 20-year data retention - meets long-life requirements for industrial gateways and telematics units. |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Defines timing reference for DDR sampling of DQ and RWDS; enables jitter-immune high-speed interface up to 166 MHz. |
| CS# | Chip select (active-low) | Enables device communication; must be asserted before command launch and held active during burst transactions. |
| RWDS | Read data strobe output | Edge-aligned to CK transitions during reads; used by host to latch valid DQ data - no RWDS required for write operations. |
| DQ[7:0] | Bi-directional DDR data bus | Carries commands, addresses, and 8-bit data on both clock edges; requires matched trace length and controlled impedance routing. |
| INT# | Interrupt output | Asserted on ECC detection or busy-to-ready transition - enables asynchronous host notification without polling. |
| RSTO# | Reset output | User-configurable open-drain reset pulse for system-level power-on initialization - eliminates need for external reset IC. |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR Interface | 12-pin interface replaces 48+ pin parallel NOR, reducing PCB layer count and routing complexity while sustaining >300 MBps read rates. |
| Configurable Burst Mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes cache line fill efficiency for ARM Cortex-A/R cores. |
| 512-Byte Program Buffer | Reduces average programming time to ~475 µs per 512 B (≈1 MBps) - cuts firmware update duration by 90% vs. single-word programming. |
| Volatile & Non-Volatile Sector Protection | Per-sector lock bits prevent accidental erase/write; NV protection survives power loss - critical for bootloader integrity in automotive ECUs. |
| Automotive Qualification | AEC-Q100 Grade 3 certified (–40°C to +85°C), ISO/TS 16949 compliant - qualified for powertrain, body control, and ADAS domain controllers. |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Storing calibrated graphics assets, gauge animations, and safety-critical boot code in digital dashboards. IC Role / Device Role / Timing Role: XIP-capable NOR flash providing deterministic <100 ns instruction fetch latency with ECC-protected execution. Use Value: Enables seamless UI rendering and failsafe boot under extended temperature cycling (–40°C to +85°C) without SRAM shadowing. |
Use Scenario: Holding field-upgradable ladder logic firmware and I/O configuration maps in programmable logic controllers. IC Role / Device Role / Timing Role: High-reliability non-volatile storage with 100K-cycle endurance and 20-year retention for unattended operation. Use Value: Eliminates external backup batteries or supercapacitors while supporting remote firmware updates over Modbus TCP. |
| 5G Baseband Radio Unit | Medical Imaging Boot Loader |
|
Use Scenario: Hosting FPGA bitstreams and DSP firmware in fronthaul units requiring rapid cold-start (<500 ms). IC Role / Device Role / Timing Role: High-throughput HYPERBUS™ interface delivering 333 MBps reads to feed multi-GHz transceiver initialization pipelines. Use Value: Reduces boot latency by 4× vs. QSPI NOR, enabling faster network synchronization and service restoration. |
Use Scenario: Securing FDA-compliant boot firmware and calibration tables in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified (–40°C to +105°C) flash with CRC and ECC for audit-trail integrity verification. Use Value: Meets IEC 62304 Class C software requirements through hardware-enforced data integrity and tamper-resistant sector locking. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KS256SDABHB020 | Same die, identical electrical specs and pinout; differs only in date code and minor packaging marking - fully interchangeable. | No functional difference; validated for same automotive and industrial use cases. | Select when sourcing from legacy Cypress channel or requiring specific lot traceability. |
| Infineon S26KL256SDABHI023 | Same 256 Mb HYPERFLASH™ device but in industrial-plus temperature grade (–40°C to +105°C) and different FBGA marking. | Required for extended-temperature applications such as under-hood engine control or outdoor telecom equipment. | Choose for designs needing guaranteed operation beyond +85°C ambient without derating. |
Compared with S26KL256SDABHB023, the S26KS256SDABHB020 offers identical performance and fit, while the S26KL256SDABHI023 extends thermal capability at no speed or interface trade-off - enabling direct upgrade paths for thermal margin expansion.
Availability
S26KL256SDABHB023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, 5G radio units, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for S26KL256SDABHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100 standards.
This part belongs to the HYPERFLASH™ family - designed specifically for high-bandwidth, low-pin-count boot and code storage in resource-constrained embedded systems where parallel NOR footprint and QSPI speed are insufficient.
FAQ
What voltage levels does S26KL256SDABHB023 support for core and I/O operation?
The device operates with 1.8 V VCC/VCCQ supply for both core logic and I/O interface, enabling compatibility with modern low-voltage SoCs and FPGAs. It does not support 3.0 V operation - this variant is strictly 1.8 V I/O, as confirmed by ordering code 'D' (1.8 V) and datasheet Rev. *Q specifications.
Does S26KL256SDABHB023 require an external clock termination resistor?
Yes - the differential CK/CK# inputs require 100 Ω Thevenin termination between the pair, placed as close as possible to the device balls per Figure 10 in the datasheet. This ensures signal integrity at 166 MHz and prevents read-data misalignment due to reflection-induced jitter.
Can RWDS be disabled or repurposed for other functions?
No - RWDS is a dedicated, non-multiplexed output that cannot be disabled or reassigned. It is essential for read-data capture timing and must be connected to the host controller's strobe input. The device does not provide register control over RWDS functionality.
How is sector protection configured - via hardware pins or software commands?
Sector protection is configured exclusively via software commands written to the device's command interface (e.g., 0x60 followed by 0xD0 for sector lock). No hardware pins enable or disable protection; volatile and non-volatile lock states are set using standard HYPERFLASH™ command sequences defined in Section 8.1 of the datasheet.
S26KL256SDABHB023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERFLASH™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KL256SDABHB023 FAQ
1.How can I place an order for S26KL256SDABHB023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KL256SDABHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KL256SDABHB023 reliable?
The price and inventory of S26KL256SDABHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL256SDABHB023 is usually 5 days.
3.What payment methods are accepted for S26KL256SDABHB023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL256SDABHB023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KL256SDABHB023?
S26KL256SDABHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KL256SDABHB023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KL256SDABHB023?
For technical support, including S26KL256SDABHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL256SDABHB023 requirements.
6.How does Aetrix verify that S26KL256SDABHB023 is sourced from the original manufacturer or authorized distributors?
All S26KL256SDABHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL256SDABHB023 meets industry standards.
7.What is the process for return or replacement of S26KL256SDABHB023?
All S26KL256SDABHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL256SDABHB023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KL256SDABHB023 part is unused and in its original packaging.
Return procedure for S26KL256SDABHB023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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