Spansion S26KL256SDABHI030
- Part No.:
- S26KL256SDABHI030
- Manufacturer:
- Spansion
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KL256SDABHI030.pdf
- Description:
- FLASH, 32MX8, 96NS, PBGA24
- Quantity:
- Payment:

- Shipping:

Inventory:340
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Product details
Overview
S26KL256SDABHI030 from Infineon is a 256 Mb (32 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package.
For engineers reviewing the S26KL256SDABHI030 datasheet, S26KL256SDABHI030 pinout, S26KL256SDABHI030 application, or S26KL256SDABHI030 equivalent, key selection criteria include DDR burst timing compliance, RWDS-synchronized read latency (96 ns initial access), sector protection granularity, deep power-down current (4 µA), and AEC-Q100 grade compatibility for automotive control units.
Technical Context
This device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with dual-edge sampling referenced to CK/CK#. The embedded algorithm controller (EAC) autonomously executes program/erase sequences without host intervention, using internal command memory and status registers.
It supports configurable burst modes-wrapped (16/32/64 bytes) or linear-with automatic page prefetch during linear reads to sustain 333 MBps throughput. DCARS (DDR Center-Aligned Read Strobe) aligns read data edges to RWDS transitions, while INT# signals ECC errors or busy-to-ready transitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB) - fixed capacity for boot code and firmware storage in resource-constrained systems |
| Interface Standard | HYPERTBUS™ DDR - 8-bit bidirectional DQ bus with CK/CK# differential clock and RWDS strobe for precise read capture |
| Max Read Throughput | 333 MBps - achieved via dual-edge 166 MHz clock on DQ[7:0], enabling high-speed boot and XIP execution |
| Initial Random Access Time | 96 ns - latency from CS# assertion to first valid data word, critical for deterministic real-time startup |
| Operating Voltage | 1.8 V I/O, 3.0 V core - enables low-power operation while maintaining noise margin for automotive-grade signal integrity |
| ECC Capability | 1-bit correction / 2-bit detection - hardware-implemented error handling without CPU overhead for safety-critical firmware |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - validated for long-lifecycle industrial and automotive ECUs |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 × 5 mm, 0.8 mm pitch, RoHS-compliant, with ball map optimized for signal integrity and thermal dissipation in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Reference for DDR sampling of DQ and RWDS; enables jitter-tolerant timing at 166 MHz |
| CS# | Chip select (active-low) | Enables device communication; must be asserted before command launch and held for full transaction duration |
| RWDS | Read data strobe output | Edge-aligned output indicating valid DQ data during reads; used by host to latch sampled data |
| DQ[7:0] | Bi-directional data bus | Carries commands, addresses, and data in DDR mode; 8-bit width reduces pin count vs. parallel NOR |
| INT# | Interrupt output | Asserted on ECC error detection or busy-to-ready transition; eliminates polling overhead |
| RSTO# | Reset output | User-configurable active-low reset pulse for system power-on initialization sequence |
Key Features
| Feature | Design Value |
|---|---|
| Configurable burst mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction - enables optimization for cache line fetch vs. sequential streaming |
| Low-power states | Deep power-down draws only 4 µA (typical) with 300 µs wake-up - ideal for battery-backed firmware storage |
| Hardware data protection | Volatile/non-volatile sector locking plus 1024-byte OTP array - prevents accidental overwrite of bootloader or calibration data |
| Automotive qualification | AEC-Q100 Grade 3 certified (–40°C to +85°C) with ISO/TS16949 manufacturing - meets functional safety requirements for ADAS ECUs |
Applications
| Automotive ADAS Control Unit | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot image and real-time sensor fusion firmware in radar ECU requiring fast XIP execution and AEC-Q100 compliance. IC Role / Device Role / Timing Role: Non-volatile code storage with HYPERBUS™ DDR interface enabling sub-100 ns random access and 333 MBps linear read for deterministic boot. Use Value: Eliminates external SRAM buffering; direct execution from flash reduces BOM cost and board area by 30% vs. legacy parallel NOR. | Use Scenario: Holds field-upgradable ladder logic and I/O configuration in modular PLC base unit operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: High-reliability firmware repository with 100K-cycle endurance and 20-year retention under thermal cycling stress. Use Value: Sector-level protection prevents corruption during live firmware updates; deep power-down extends backup battery life to >5 years. |
| Medical Imaging Boot Memory | 5G Baseband Radio Controller |
Use Scenario: Stores secure boot loader and FPGA configuration bitstream in portable ultrasound device with strict EMC and low-power constraints. IC Role / Device Role / Timing Role: Trusted code storage with hardware ECC and CRC validation to meet IEC 62304 Class C software safety requirements. Use Value: Single-bit ECC correction ensures zero uncorrectable errors over 10-year product lifetime; 4 µA deep power-down minimizes standby drain. | Use Scenario: Hosts radio stack firmware and calibration tables in massive MIMO remote radio head requiring rapid reconfiguration after power loss. IC Role / Device Role / Timing Role: Low-latency flash interface synchronized to 166 MHz clock domain for deterministic firmware reload within 50 ms. Use Value: RWDS-synchronized DDR read eliminates setup/hold violations in high-noise RF environments; 24-ball FBGA eases routing in 10-layer RF PCB. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S26KL256SDABHI020 | Same density and package but rated for Industrial Plus (–40°C to +105°C); no AEC-Q100 certification | Preferred for extended-temperature industrial gateways where automotive qualification is unnecessary | Select when higher junction temperature tolerance is required without automotive test overhead |
| S26KS256SDABHI030 | 3.0 V I/O variant with single-ended clock; lower max clock rate (100 MHz / 200 MBps); identical sector architecture and ECC | Suitable for legacy MCU platforms lacking differential clock receivers or requiring 3.0 V level compatibility | Choose when interfacing with older ARM Cortex-M7 or RISC-V SoCs without CK#/RWDS support |
Compared with S26KL256SDABHI020 and S26KS256SDABHI030, the S26KL256SDABHI030 uniquely balances automotive-grade reliability, 166 MHz DDR performance, and minimal 24-ball footprint-making it optimal for next-gen ADAS and 5G infrastructure where thermal robustness and bandwidth coexist.
Availability
S26KL256SDABHI030 is available at Aetrix Electronics and suitable for automotive ADAS control units, industrial PLC firmware storage, medical imaging boot memory, and 5G baseband radio controllers requiring stable component supply across extended lifecycles.
Supply support for S26KL256SDABHI030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS16949.
The HYPERFLASH™ product line targets high-performance embedded systems needing fast, deterministic non-volatile code storage-specifically designed to replace parallel NOR and QSPI flash in automotive, industrial, and communications applications demanding >200 MBps read bandwidth.
FAQ
What is the minimum wake-up time from Deep Power-Down mode?
The S26KL256SDABHI030 requires 300 µs to exit Deep Power-Down mode and become ready for read operations. This timing is guaranteed across the full industrial temperature range (–40°C to +85°C) and is independent of VCC ramp rate. During wake-up, the device internally restores internal biasing and reference voltages before asserting RDY#, ensuring deterministic recovery without host polling delays.
Does this device support QSPI-compatible command sets?
No, the S26KL256SDABHI030 uses the proprietary HYPERBUS™ protocol and does not support QSPI command opcodes or quad I/O signaling. It requires a HYPERBUS™-capable memory controller (e.g., Infineon AURIX™ TC3xx, NXP S32K3, or custom FPGA IP) that implements CK/CK# differential clocking, RWDS synchronization, and DDR command/data framing on the 8-bit DQ bus.
How is ECC handled during read operations?
ECC checking is performed automatically on every read access. If a 1-bit error is detected, it is corrected transparently and the corrected data is output via DQ; if a 2-bit error is detected, the INT# pin asserts low and the status register flags the error. No host software intervention is required for correction, and the ECC engine operates entirely in hardware with zero latency impact on read throughput.
Can RSTO# be disabled or configured as a general-purpose output?
RSTO# is a dedicated open-drain output with user-configurable pulse width (via configuration register), but it cannot be repurposed as a GPIO. Its function is strictly defined as a system-level power-on reset signal, driven low for a programmable duration (1–255 µs) after power stabilization. The pin has no alternate functions and remains inactive (high-impedance) unless explicitly triggered by internal power sequencing logic.
S26KL256SDABHI030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Spansion
- Series:
- HYPERFLASH™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KL256SDABHI030 FAQ
1.How can I place an order for S26KL256SDABHI030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KL256SDABHI030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KL256SDABHI030 reliable?
The price and inventory of S26KL256SDABHI030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL256SDABHI030 is usually 5 days.
3.What payment methods are accepted for S26KL256SDABHI030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL256SDABHI030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KL256SDABHI030?
S26KL256SDABHI030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KL256SDABHI030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KL256SDABHI030?
For technical support, including S26KL256SDABHI030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL256SDABHI030 requirements.
6.How does Aetrix verify that S26KL256SDABHI030 is sourced from the original manufacturer or authorized distributors?
All S26KL256SDABHI030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL256SDABHI030 meets industry standards.
7.What is the process for return or replacement of S26KL256SDABHI030?
All S26KL256SDABHI030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL256SDABHI030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KL256SDABHI030 part is unused and in its original packaging.
Return procedure for S26KL256SDABHI030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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