Spansion S26KL256SDABHV020
- Part No.:
- S26KL256SDABHV020
- Manufacturer:
- Spansion
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KL256SDABHV020.pdf
- Description:
- FLASH, 32MX8, 96NS, PBGA24
- Quantity:
- Payment:

- Shipping:

Inventory:700
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Product details
Overview
S26KL256SDABHV020 from Infineon Technologies is a 256 Mb (32 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, supporting 1.8 V I/O and differential clock (CK/CK#), delivering 333 MBps sustained read throughput at 166 MHz, 96 ns initial random access time, and ECC 1-bit correction/2-bit detection - deployed in automotive ADAS domain controllers for fast boot code execution.
For engineers reviewing the S26KL256SDABHV020 datasheet, S26KL256SDABHV020 pinout, S26KL256SDABHV020 application, or S26KL256SDABHV020 equivalent, key selection considerations include HYPERBUS™ timing compliance, RWDS-synchronized DDR read strobe behavior, sector protection granularity (256 KB uniform + optional 4 KB parameter sectors), and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-aligned data transfer, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. It uses MIRRORBIT™ technology for high-density NOR storage with word-wide (16-bit) addressing and 8-bit DDR data bus (DQ[7:0]).
HYPERBUS™ protocol enables burst-oriented operations with configurable wrapped (16/32/64-byte) or linear bursts, center-aligned command/address transfers, and edge-aligned read data referenced to RWDS transitions. Initial latency ranges from 5–16 clock cycles depending on configuration, and DCARS (DDR Center-Aligned Read Strobe) ensures precise timing alignment during high-speed reads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB) - supports full firmware images for mid-tier automotive ECUs without external compression or paging. |
| Interface Standard | HYPERTBUS™ DDR - 8-bit bidirectional data bus with differential clock (CK/CK#), eliminating single-ended clock skew limitations. |
| Max Read Throughput | 333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte per transfer, enabling sub-100 ms boot from flash. |
| Initial Random Access Time | 96 ns - corresponds to 5–16 clock cycles latency; determines minimum instruction fetch delay after address assertion. |
| ECC Capability | 1-bit correction / 2-bit detection - protects against single-bit upsets in safety-critical automotive code storage without software overhead. |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - validated for lifetime operation in engine control and infotainment modules. |
| Power Modes | Deep Power-Down: 4 µA (typical); Standby: 25 µA; Active read: 80 mA - enables low-quiescent-power ECU sleep states. |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Defines sampling edges for all DDR transfers; eliminates duty-cycle dependency and improves jitter tolerance vs. single-ended clock. |
| CS# | Chip select (active-low) | Enables device communication; must remain LOW for entire burst transaction; HIGH enters standby mode. |
| RWDS | Read data strobe output | Source-synchronous output aligned to read data edges; used by host to latch DQ[7:0] during reads only. |
| DQ[7:0] | Bi-directional DDR data bus | Transfers 16-bit words across two clock edges per cycle; carries commands, addresses, and data in time-multiplexed fashion. |
| INT# | Interrupt output | Asserts on Busy→Ready transition or ECC error detection; enables asynchronous host notification without polling. |
| RSTO# | Reset output | Drives system-level power-on reset; user-configurable LOW pulse duration supports custom POR sequencing. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable burst mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction - enables optimal cache-line alignment for ARM Cortex-R5F fetch patterns. |
| Advanced sector protection | Volatile and non-volatile lock bits per 256 KB sector - prevents accidental overwrite of bootloader or calibration data in field-deployed units. |
| 512-byte program buffer | Reduces write latency by 95% vs. single-word programming (475 µs vs. 500 µs) - accelerates OTA firmware patching. |
| Automotive qualification | AEC-Q100 Grade 2 (–40°C to +105°C) and ISO/TS16949 certified - meets functional safety requirements for ASIL-B systems. |
| One-time programmable array | 1024-byte OTP space - stores cryptographic keys, unique identifiers, or trim values that must persist across erase cycles. |
Applications
| Automotive ADAS Domain Controller | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Stores boot firmware and real-time perception algorithms for radar/vision fusion ECUs operating at 105°C ambient. IC Role / Device Role / Timing Role: Primary non-volatile code storage with HYPERBUS™-based XIP (execute-in-place) capability and deterministic 96 ns access. Use Value: Enables <100 ms cold boot via 333 MBps read throughput and eliminates external SRAM buffering for instruction fetch. |
Use Scenario: Holds firmware and configuration data for DIN-rail mounted PLCs requiring >10-year field reliability under thermal cycling. IC Role / Device Role / Timing Role: High-integrity firmware repository with ECC and 20-year data retention, accessed via industrial MCU's HYPERBUS™ controller. Use Value: Guarantees zero uncorrectable bit errors over product lifetime, reducing field return rates in mission-critical automation. |
| Medical Imaging Boot Memory | Avionics Display System Code Storage |
|
Use Scenario: Stores boot loader and diagnostic firmware for portable ultrasound devices subject to strict EMC and thermal constraints. IC Role / Device Role / Timing Role: Low-power, high-reliability flash with Deep Power-Down (4 µA) and AEC-Q100-equivalent robustness. Use Value: Extends battery life during standby while maintaining instant wake-up readiness and radiation-tolerant data integrity. |
Use Scenario: Holds display firmware and graphics assets for cockpit multifunction displays operating in extended temperature range (–40°C to +125°C). IC Role / Device Role / Timing Role: Extended temperature grade HYPERFLASH™ with RSTO#-driven system reset coordination and CRC-verified updates. Use Value: Ensures deterministic boot sequence timing and eliminates firmware corruption risk during aircraft power transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KS256SDABHV020 | Same die, legacy Cypress branding pre-Infineon acquisition; identical electrical specs, timing, and package. | No functional difference; supported by same Infineon documentation and tools post-merger. | Select when sourcing from legacy inventory or distributor stock labeled under Cypress part numbering. |
| Winbond W25Q256JWSIQ | Quad SPI interface (not HYPERBUS™), 133 MHz max clock, no RWDS or differential clock; lacks DCARS timing. | Requires SPI host controller instead of HYPERBUS™ PHY; lower throughput (up to 532 MBps quad IO but with higher latency). | Only viable if redesigning host interface; not drop-in - incompatible pinout, timing model, and command set. |
Compared with S26KL256SDABHV020, the Cypress variant offers identical performance and compatibility, whereas Winbond's QSPI alternative demands hardware and firmware rework due to fundamental interface divergence and absence of HYPERBUS™-specific features like RWDS synchronization and DCARS.
Availability
S26KL256SDABHV020 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLCs, medical imaging boot systems, and avionics display systems requiring stable component supply across extended temperature grades and long lifecycle support.
Supply support for S26KL256SDABHV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS16949.
This device belongs to Infineon's HYPERFLASH™ family - designed specifically for high-speed, low-pin-count code storage in safety-critical automotive and industrial systems requiring deterministic timing and AEC-Q100 compliance.
FAQ
What is the function of the RWDS signal in S26KL256SDABHV020?
RWDS (Read Data Strobe) is a source-synchronous output signal generated by the device during read operations only. It aligns with the edges of valid read data on DQ[7:0], allowing the host to accurately latch DDR data without relying on clock skew margins. RWDS transitions occur on both rising and falling edges of CK during the data transfer portion, and its timing is defined by DCARS (DDR Center-Aligned Read Strobe) specification in the datasheet.
Does S26KL256SDABHV020 support execute-in-place (XIP) operation?
Yes, S26KL256SDABHV020 supports true XIP operation via its HYPERBUS™ interface. The device delivers deterministic 96 ns initial access time and sustained 333 MBps read throughput, enabling ARM Cortex-R or RH850 processors to fetch instructions directly from flash without intermediate buffering. XIP requires host controller support for HYPERBUS™ command protocol and RWDS-synchronized latching.
How does the 512-byte program buffer improve write performance?
The 512-byte buffer allows the device to accept a full buffer load in one burst and internally program all 512 bytes in ~475 µs - achieving ~1 MBps effective write speed. This is 95% faster than single-word programming (500 µs per 2-byte word), significantly reducing OTA update time and minimizing host CPU wait states during firmware patching or calibration data writes.
What temperature grades are available for S26KL256SDABHV020?
S26KL256SDABHV020 is qualified for Industrial Plus (–40°C to +105°C) and Automotive Grade 2 (–40°C to +105°C) per AEC-Q100. The "HV" suffix in the part number explicitly denotes the +105°C maximum operating temperature. It is not rated for the +125°C Extended or Grade 1 automotive range - those require the "HX" suffix variant.
S26KL256SDABHV020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Spansion
- Series:
- HYPERFLASH™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KL256SDABHV020 FAQ
1.How can I place an order for S26KL256SDABHV020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KL256SDABHV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KL256SDABHV020 reliable?
The price and inventory of S26KL256SDABHV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL256SDABHV020 is usually 5 days.
3.What payment methods are accepted for S26KL256SDABHV020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL256SDABHV020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KL256SDABHV020?
S26KL256SDABHV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KL256SDABHV020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KL256SDABHV020?
For technical support, including S26KL256SDABHV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL256SDABHV020 requirements.
6.How does Aetrix verify that S26KL256SDABHV020 is sourced from the original manufacturer or authorized distributors?
All S26KL256SDABHV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL256SDABHV020 meets industry standards.
7.What is the process for return or replacement of S26KL256SDABHV020?
All S26KL256SDABHV020 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL256SDABHV020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KL256SDABHV020 part is unused and in its original packaging.
Return procedure for S26KL256SDABHV020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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