Spansion S26KL256SDABHV030
- Part No.:
- S26KL256SDABHV030
- Manufacturer:
- Spansion
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KL256SDABHV030.pdf
- Description:
- FLASH, 32MX8, 96NS, PBGA24
- Quantity:
- Payment:

- Shipping:

Inventory:540
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Product details
Overview
S26KL256SDABHV030 from Infineon is a 256 Mb (32 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, and operates across –40°C to +105°C (Industrial Plus grade) in automotive and industrial embedded boot memory applications.
For engineers reviewing the S26KL256SDABHV030 datasheet, S26KL256SDABHV030 pinout, S26KL256SDABHV030 application, or S26KL256SDABHV030 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access), ECC 1-bit correction / 2-bit detection, configurable burst length (16/32/64 bytes), deep power-down current (4 µA), and AEC-Q100 Grade 2 qualification.
Technical Context
The device implements a DDR center-aligned read strobe (DCARS) architecture where command/address and data are transferred over the same 8-bit DQ bus using double-data-rate signaling synchronized to CK/CK#. Read operations require initial latency of 5–16 clock cycles and support wrapped or linear burst modes with automatic page prefetch during linear bursts.
Its dual-controller architecture separates host interface control (HIC) for signal timing and data transfer from the embedded algorithm controller (EAC), which autonomously executes program/erase sequences-including 512-byte buffer programming and sector erase-without host intervention. ECC and CRC are hardware-accelerated and applied per read transaction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB), organized as 32 M × 8-bit with 16-bit word addressing |
| Interface Standard | HYPERTBUS™ DDR: 1.8 V I/O, differential CK/CK#, 8-bit DQ, RWDS strobe |
| Max Read Throughput | 333 MBps sustained (166 MHz clock × 2 transfers/cycle × 1 byte) |
| Random Access Time | 96 ns tACC; 5–16 clock cycle initial latency for first word |
| Erase/Program Endurance | 100,000 program/erase cycles per sector |
| Data Retention | 20 years at +85°C, validated per JEDEC JESD22-A117 |
| Power Modes | Deep power-down: 4 µA (typical); Standby: 25 µA; Burst read: 80 mA |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Reference for DDR sampling of DQ and RWDS; enables precise timing alignment |
| CS# | Chip select (active low) | Enables device communication; HIGH places device in standby or deep power-down |
| RWDS | Read data strobe output | Edge-aligned output indicating valid DQ data during read; not used for write |
| DQ[7:0] | Bi-directional data bus | Carries commands, addresses, and data in DDR mode; 8-bit wide, CMOS-compatible |
| INT# | Interrupt output | Asserts on ECC error detection or busy-to-ready transition; level-sensitive |
| RSTO# | Reset output | User-configurable LOW pulse duration for system-level power-on reset coordination |
| PSC / PSC# | Power supply control pair | Monitor VCC/VCCQ status; enable hardware data protection during brown-out |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR Interface | Reduces pin count vs. parallel NOR while sustaining 333 MBps read speed via CK/CK# and RWDS synchronization |
| Configurable Burst Mode | Supports 16/32/64-byte wrapped bursts or linear bursts-enabling optimized cache line fetches and DMA efficiency |
| Hardware ECC & CRC | 1-bit correction / 2-bit detection per read; CRC validation on command/address transfers prevents silent corruption |
| 512-Byte Program Buffer | Enables 1 MBps effective write speed (vs. 4 KBps single-word), reducing firmware update time by >90% |
| AEC-Q100 Grade 2 | Qualified for automotive applications up to +105°C; includes extended temperature stress testing and failure analysis reporting |
Applications
| Automotive ADAS Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and safety-critical firmware for radar ECU and camera processing units. IC Role / Device Role / Timing Role: Primary non-volatile boot memory interfaced directly to ARM Cortex-R5F MCU via HYPERBUS™ master controller. Use Value: 96 ns random access and 333 MBps sequential reads ensure sub-100 ms cold boot; AEC-Q100 Grade 2 guarantees operation at +105°C under hood conditions. | Use Scenario: Holding real-time control logic and configuration data for modular I/O controllers in factory automation systems. IC Role / Device Role / Timing Role: System-level firmware storage with ECC-enabled read integrity and sector-level write protection. Use Value: 256-KB uniform sectors allow atomic firmware updates; deep power-down (4 µA) extends battery backup runtime during maintenance outages. |
| 5G Baseband Radio Firmware | Medical Imaging Device Boot ROM |
Use Scenario: Hosting FPGA bitstreams and DSP microcode in massive MIMO radio units requiring rapid reconfiguration. IC Role / Device Role / Timing Role: High-bandwidth external memory mapped to SoC's HYPERBUS™ interface for zero-wait-state execution. Use Value: Linear burst + page prefetch sustains 333 MBps reads-matching FPGA configuration bandwidth requirements without DRAM buffering. | Use Scenario: Secure boot image storage for FDA-cleared MRI subsystem controllers with traceable firmware lifecycle. IC Role / Device Role / Timing Role: Certified non-volatile memory with 20-year data retention and hardware-based ECC for audit-compliant medical firmware. Use Value: One-time-programmable (OTP) 1024-byte array stores cryptographic keys; CRC and ECC prevent undetected field corruption during long-term deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B104QN-PSOC | 4 Mb Quad SPI FRAM; no erase latency, unlimited endurance, but max 40 MBps read speed | Best for frequent small writes (e.g., logging), not high-throughput boot code | Select only when write-cycle endurance >10⁹ cycles is mandatory and bandwidth < 50 MBps suffices |
| S26KL512SDABHV030 | 512 Mb density, identical package/timing/ECC/AEC-Q100 Grade 2, same HYPERBUS™ interface | Drop-in upgrade path for higher firmware footprint; requires no PCB or firmware change | Choose when future firmware growth exceeds 32 MB; pin- and timing-compatible with identical power profile |
Compared with CY15B104QN-PSOC, S26KL256SDABHV030 provides 8× higher density and 8× faster read throughput but requires erase-before-write; versus S26KL512SDABHV030, it offers identical interface and reliability at lower cost and power for ≤32 MB firmware footprints.
Availability
S26KL256SDABHV030 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, 5G radio units, and medical imaging controllers requiring stable component supply with full AEC-Q100 and ISO/TS16949 traceability.
Supply support for S26KL256SDABHV030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO 9001 and IATF 16949.
This device belongs to Infineon's HYPERFLASH™ family-designed specifically for replacing parallel NOR flash in bandwidth-constrained, high-temperature embedded systems where pin count, power, and boot speed are critical.
FAQ
What voltage levels does S26KL256SDABHV030 support for VCC and VCCQ?
The device supports 1.8 V for both core (VCC) and I/O (VCCQ) supply rails. It is not rated for 3.0 V operation-this variant (SABHV030 suffix) is exclusively 1.8 V I/O. The 3.0 V version uses different ordering suffixes (e.g., SABHV020). Mixing voltages risks latch-up or timing violation per Section 11.4 of the datasheet.
Does S26KL256SDABHV030 require external termination resistors for CK/CK# or DQ signals?
Yes-per Section 10.2 of the datasheet, 49.9 Ω series resistors are required on CK/CK# near the source, and 33 Ω series resistors on each DQ line near the memory device. RWDS also requires a 33 Ω series resistor. These values ensure signal integrity at 166 MHz DDR and meet HYPERBUS™ specification impedance targets.
How is the 512-byte program buffer utilized during firmware updates?
The buffer accepts up to 512 bytes in a single write transaction, then internally programs them in ~475 µs-achieving ~1 MBps effective write speed. Host must issue a "buffer write" command followed by address and data; the EAC handles internal verify and retry. No host polling is needed beyond checking INT# or status register after completion.
Can S26KL256SDABHV030 operate in linear burst mode without external prefetch logic?
Yes-the embedded algorithm controller (EAC) automatically initiates prefetch of the next sequential page during linear burst reads, enabling continuous 333 MBps output without host-side prefetch instructions. This is hardware-managed and transparent to the HYPERBUS™ master, as confirmed in Section 1.2 and Figure 1 of the datasheet.
S26KL256SDABHV030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Spansion
- Series:
- HYPERFLASH™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KL256SDABHV030 FAQ
1.How can I place an order for S26KL256SDABHV030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KL256SDABHV030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KL256SDABHV030 reliable?
The price and inventory of S26KL256SDABHV030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL256SDABHV030 is usually 5 days.
3.What payment methods are accepted for S26KL256SDABHV030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL256SDABHV030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KL256SDABHV030?
S26KL256SDABHV030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KL256SDABHV030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KL256SDABHV030?
For technical support, including S26KL256SDABHV030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL256SDABHV030 requirements.
6.How does Aetrix verify that S26KL256SDABHV030 is sourced from the original manufacturer or authorized distributors?
All S26KL256SDABHV030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL256SDABHV030 meets industry standards.
7.What is the process for return or replacement of S26KL256SDABHV030?
All S26KL256SDABHV030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL256SDABHV030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KL256SDABHV030 part is unused and in its original packaging.
Return procedure for S26KL256SDABHV030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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